The application discloses a
laser drilling method,
system, control device and readable storage medium, and relates to the technical field of circuit board
processing. The
laser drilling method comprises the following steps: identifying the material of the
surface layer of a drilling area; determining a
laser light source according to the material of the
surface layer of the drilling area; configuring and exciting the
laser light source to irradiate the drilling area; adjusting the energy of the excited
laser light source according to the
surface layer temperature of the drilling area, and exciting the
laser light source to irradiate the drilling area with the adjusted energy until the material of the surface layer of the drilling area is removed. Through the implementation of the
laser drilling method,
system, control device and readable storage medium provided in the application, the
metal layer can be processed by using
ultraviolet laser, and the substrate layer can be processed by using
carbon dioxide laser; and the energy of the excited laser
light source can be adjusted according to the temperature of the surface layer of the drilling area during the drilling process, so that the surface layer of the drilling area cannot be overheated, the hole wall is smooth, the
carbonization of the substrate of the drilling area can be avoided, and the drilling yield is improved.