Laser drilling method and system, control equipment and readable storage medium

Abstract

The invention discloses a laser drilling method and system, control equipment and a readable storage medium, and relates to the technical field of circuit board processing. The laser drilling method comprises the steps that materials of the surface layer of a drilling area are recognized; determining a laser light source according to the surface layer material of the drilling area; a laser light source is configured and excited to irradiate the drilling area; and adjusting the energy of the laser light source according to the surface layer temperature of the drilling area, and exciting the laser light source to irradiate the drilling area by using the adjusted energy until the material on the surface layer of the drilling area is removed. The embodiment of the invention provides the laser drilling method and system, the control equipment and the readable storage medium. The metal layer can be processed by using ultraviolet laser, and the base material layer can be processed by using carbon dioxide laser; the energy of the laser light source is adjusted according to the temperature of the surface layer of the drilling area in the drilling process, it can be guaranteed that the surface layer of the drilling area is not overheated, the hole wall is smooth, carbonization of a base material in the drilling area is avoided, and the drilling yield is increased.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to a laser drilling method, system, control device and readable storage medium. Background Art

[0002] In the field of printed circuit board manufacturing, laser drilling is a commonly used drilling method. It mainly relies on a single-wavelength laser to output a fixed-energy laser to irradiate the printed circuit board and remove the substrate and metal of the printed circuit board. However, the effectiveness of single-wavelength lasers in removing substrates and metals varies greatly. For example, carbon dioxide lasers can effectively remove substrates, but metals have a strong reflection of carbon dioxide lasers. For ultraviolet lasers, they can effectively remove metals, but the high temperatures generated during substrate removal can cause defects in the substrate of the printed circuit board, affecting the physical and electrical properties of the printed circuit board, and thus leading to poor yield of the printed circuit board processing. On the other hand, using fixed-energy laser pulses for drilling makes it difficult to control the local temperature rise in the drilling area, which can reduce the performance of the circuit board. Summary of the Invention

[0003] The present application provides a laser drilling method, system, control device and readable storage medium, which at least solve the problem of low circuit board yield caused by using a single wavelength laser with fixed output energy to drill printed circuit boards.

[0004] In a first aspect, the present application provides a laser drilling method, which is applied to a control device in a laser drilling system, wherein the laser drilling system includes a replaceable laser light source, and the control device controls the replaceable laser light source to drill a drilling area on a circuit board to be drilled from a drilling direction to a target depth, wherein the circuit board to be drilled includes metal and a substrate, wherein the replaceable laser light source includes at least two laser light sources, and the drilling direction is directed from the replaceable laser light source to the circuit board to be drilled along the optical axis direction of the replaceable laser light source; Laser drilling methods, including: Identify the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; Determine the laser light source based on the surface material of the drilling area; configuring and activating a laser light source to illuminate the drilling area; The energy of the excitation laser light source is adjusted according to the surface temperature of the drilling area, and the drilling area is irradiated with the laser light source with the adjusted energy until the surface material of the drilling area is removed.

[0005] In a second aspect, the present application further provides a laser drilling system, comprising: a control device and a replaceable laser light source, the control device controlling the replaceable laser light source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction, the circuit board to be drilled comprising metal and a substrate, wherein the replaceable laser light source comprises at least two laser light sources, and the drilling direction is directed from the replaceable laser light source to the circuit board to be drilled along the optical axis direction of the replaceable laser light source; The control device is configured to: Identify the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; Determine the laser light source based on the surface material of the drilling area; configuring and activating a laser light source to illuminate the drilling area; The energy of the excitation laser light source is adjusted according to the surface temperature of the drilling area, and the drilling area is irradiated with the laser light source with the adjusted energy until the surface material of the drilling area is removed.

[0006] In a third aspect, the present application further provides a control device, comprising a memory, a processor, and a laser drilling program stored in the memory and executable on the processor. When the processor executes the laser drilling program, the laser drilling method described in the first aspect is implemented, including: Identify the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; Determine the laser light source based on the surface material of the drilling area; configuring and activating a laser light source to illuminate the drilling area; The energy of the excitation laser light source is adjusted according to the surface temperature of the drilling area, and the drilling area is irradiated with the laser light source with the adjusted energy until the surface material of the drilling area is removed.

[0007] In a fourth aspect, the present application further provides a computer-readable storage medium having a laser drilling program stored thereon. When the laser drilling program is executed by a processor, the laser drilling method described in the first aspect is implemented, including: Identify the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; Determine the laser light source based on the surface material of the drilling area; configuring and activating a laser light source to illuminate the drilling area; The energy of the excitation laser light source is adjusted according to the surface temperature of the drilling area, and the drilling area is irradiated with the laser light source with the adjusted energy until the surface material of the drilling area is removed.

[0008] In a fifth aspect, the present application further provides a computer program product, including a computer program. When the computer program is executed by a processor, the laser drilling method described in the first aspect is implemented, including: Identify the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; Determine the laser light source based on the surface material of the drilling area; configuring and activating a laser light source to illuminate the drilling area; The energy of the excitation laser light source is adjusted according to the surface temperature of the drilling area, and the drilling area is irradiated with the laser light source with the adjusted energy until the surface material of the drilling area is removed.

[0009] The technical solutions provided by the embodiments of the present application have the following beneficial effects: by implementing the laser drilling method, system, control device, and readable storage medium provided by the embodiments of the present application, a laser drilling system with a replaceable laser light source can be used to drill holes in circuit boards. The laser light source can be switched based on the surface material of the hole, such as using an ultraviolet laser to process metal layers and a carbon dioxide laser to process substrate layers. This simplifies the laser drilling process and improves the drilling yield of the circuit boards.

[0010] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser light source is adjusted according to the temperature of the surface layer of the drilling area. This can ensure that the surface layer of the drilling area will not overheat, the hole wall is smooth, and carbonization of the base material in the drilling area is avoided, thereby improving the drilling yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] Figure 1 This is a schematic diagram of a laser drilling method provided in an embodiment of the present application; Figure 2 This is a schematic diagram of the surface layer of the drilling area provided in an embodiment of the present application; Figure 3 This is a schematic diagram of drilling holes in a circuit board using a laser drilling system according to an embodiment of the present application; Figure 4 This is a schematic diagram of a control device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0013] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0014] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meaning understood by a person of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and similar expressions used in this disclosure do not indicate any order, quantity, or importance, but are simply used to distinguish different components. Similarly, terms such as "a," "an," or "the" do not indicate a quantitative limitation, but rather indicate the presence of at least one. The numbers in the drawings in this specification merely distinguish between various functional components or modules and do not indicate a logical relationship between the components or modules. Terms such as "include" or "comprising" mean that the element or object preceding the term includes the elements or objects listed after the term, and their equivalents, without excluding other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0015] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that, in the accompanying drawings, the same reference numerals are given to components having substantially the same or similar structures and functions, and repeated descriptions thereof will be omitted.

[0016] In view of the problem of low circuit board yield caused by the use of fixed output energy of a single wavelength laser for drilling printed circuit boards in the prior art, this application provides the following implementation methods: In some embodiments, as Figure 1 As shown, a laser drilling method is applied to a control device in a laser drilling system. The laser drilling system includes a replaceable laser light source. The control device controls the replaceable laser light source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction. The circuit board to be drilled includes metal and a substrate. The replaceable laser light source includes at least two laser light sources. The drilling direction is directed from the replaceable laser light source to the circuit board to be drilled along the optical axis direction of the replaceable laser light source. Laser drilling methods, including: S100: Identifying the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; S200: Determine the laser light source according to the surface material of the drilling area; S300: configuring and activating a laser light source to illuminate the drilling area; S400: adjusting the energy of the excitation laser light source according to the surface temperature of the drilling area, and irradiating the drilling area with the adjusted energy excitation laser light source until the surface material of the drilling area is removed.

[0017] The circuit board to be drilled in this application is preferably a printed circuit board. The circuit board to be drilled has a layered structure, typically consisting of a repeated stack of metal layers and substrate layers. The metal layers are preferably made of copper; the substrate layers are preferably made of FR4 resin. FR4 resin is a composite material with an epoxy resin matrix and fiberglass reinforcement. Preferably, a flame retardant (typically a bromide) is added to the FR4 resin.

[0018] The target depth for a blind via is the distance from the bottom of the hole to the surface of the hole, and can also be expressed as the sum of the number of metal and substrate layers removed. For a through hole, there is no hole bottom, and the target depth is the thickness of the circuit board.

[0019] The laser drilling system involved in this application can be a multi-wavelength laser with a replaceable laser light source. The replaceable laser light source includes at least two laser light sources: a first laser light source and a second laser light source. The first laser light source is used to drill metal in the circuit board to be drilled; the second laser light source is used to drill the substrate in the circuit board to be drilled.

[0020] Schematically, the first laser source is an ultraviolet (UV) laser, typically with an output wavelength of 355nm, suitable for drilling holes in the metal layers of circuit boards. However, it is inefficient when penetrating substrate layers thicker than 150μm, and can easily create a heat-affected zone (HAZ) near the drilled hole area, affecting the circuit board's electrical performance, degrading the substrate's performance, and increasing the difficulty and cost of subsequent processes. For example, it can carbonize low-thermal-stability substrates (such as FR4 resin); increase hole wall roughness, making the electroplated metalized via process more difficult; and easily form gaps between the hole walls, allowing the plated copper to penetrate the substrate layer, affecting the circuit board's electrical performance. The second laser source is a carbon dioxide (CO2) laser, typically with an output wavelength of 10.6μm. This laser is well-suited for drilling holes in the substrate layer of circuit boards, but it has high reflectivity on the metal layers of circuit boards, especially the copper foil, which can reach reflectivity exceeding 90%. Therefore, using carbon dioxide laser as a single light source to drill holes in circuit boards requires etching copper foil, which is a complicated process.

[0021] When drilling holes in circuit boards using a laser drilling system with a replaceable laser light source, the laser light source can be switched according to the material of the hole surface. Ultraviolet lasers can be used to process metal layers, while carbon dioxide lasers can be used to process substrate layers, simplifying the process and improving the drilling yield of circuit boards.

[0022] The drilling area refers to the area where the hole is processed by the laser drilling system. The surface layer of the drilling area refers to the layer of material closest to the laser drilling system. Figure 2 As shown in Figure 2, the surface material of the drilling area changes as the laser drilling process proceeds, as shown in Figure 2. Figure 2 As shown in part (a), when the laser drilling process begins, the surface of the drilling area is the base material; Figure 2 As shown in part (b), when the base material layer is removed, the surface of the drilling area is metal; Figure 2 As shown in part (c), when the metal layer is removed, the surface of the drilled area is another substrate layer.

[0023] Because both the metal layer and the substrate layer have a certain thickness, removing the surface material from the drilled area typically requires one or more laser pulses to illuminate the drilled area, removing a portion of the layer each time until the entire layer is completely removed. The laser source is pulsed. For example, for the substrate layer, approximately 20 laser pulses are used, with a single laser pulse having an energy density of 1-5 joules per square centimeter and a pulse duration of 50-200 nanoseconds.

[0024] While gradually removing the surface layer from the drilled area, the surface temperature must be monitored in real time, and the excitation laser energy must be adjusted accordingly. Typically, the substrate material (FR4 resin) of a circuit board carbonizes when temperatures exceed 200°C, resulting in rough hole walls or cracks, which can affect the board's electrical performance. Real-time adjustment of the excitation laser energy based on temperature feedback ensures that the surface layer in the drilled area does not overheat, maintains smooth hole walls, and avoids carbonization of the substrate material.

[0025] Specifically, S100: identifying the material of the surface layer of the drilling area includes: S110: Starting the illumination light source in the laser drilling system to illuminate the drilling area; S120: Acquire an image of the drilling area through an image acquisition device in the laser drilling system; S130: Preprocessing the drilling area image to enhance the surface features of the drilling area; S140: extracting characteristic parameters corresponding to surface features; S150: calling a material identification model to determine the material of the surface layer of the drilling area based on characteristic parameters of the surface characteristics.

[0026] Using an illumination light source to evenly illuminate the drilling area can reduce the influence of interference factors such as shadows and reflected light, which is beneficial for the image acquisition device to capture a clear image of the surface of the drilling area.

[0027] Schematically, the image acquisition device can be a high-resolution industrial camera. The captured image of the drilled area primarily conveys visual information such as the color, texture, and glossiness of the surface layer in the drilled area. This visual information can be converted into a digital image for subsequent material identification.

[0028] By preprocessing the drilling area image, noise can be removed and contrast can be enhanced to highlight the surface features of the drilling area. By performing region of interest extraction (ROI extraction) on the drilling area image, the surface image of the drilling area can be accurately separated. The characteristic parameters of the surface features include at least hue, saturation, brightness, and texture features. Generally, metallic copper has an orange-red metallic luster and a relatively smooth surface texture; while the FR4 resin used as the base material is mostly green or brown, with a glass fiber woven texture on the surface. Using the HSV (Hue, Saturation, Value) histogram, the surface color of the drilling area can be further analyzed; using the local binary pattern (LBP) or gray-level co-occurrence matrix (GLCM), the corresponding texture features can be extracted to identify the corresponding material.

[0029] The material identification model can determine the material type based on characteristic parameters of the surface features. This application does not limit the specific algorithm for implementing material identification.

[0030] Preferably, before S100: identifying the material of the surface layer of the drilling area, the method further includes: S010: Turn off the ambient light source in the laser drilling system; S020: placing a reflectivity calibration plate on the carrier platform of the circuit board to be drilled, so that the surface of the reflectivity calibration plate is flush with the surface of the circuit board to be drilled; S030: Start the lighting source and continue to run the preset lighting time to allow the lighting source to reach a thermal equilibrium state; S040: Controlling the image acquisition device to acquire an image of the reflectivity calibration plate under the illumination of the illumination light source to obtain an illumination field distribution image; S050: Adjusting the lighting parameters of the lighting source according to the lighting field distribution image so that the lighting source evenly illuminates the circuit board to be drilled.

[0031] The above process enables calibration of the illumination source in a laser drilling system. To ensure accurate illumination source calibration, it should be performed with the ambient light source turned off to eliminate the influence of interfering light sources. The reflectivity calibration plate is preferably a standard reflectivity calibration plate, which can be a white diffuse reflector or a neutral gray plate with known reflectivity characteristics. The reflectivity calibration plate provides known and stable optical reflectivity, serving as a benchmark for illumination uniformity and intensity measurement and forming the basis for quantitative calibration. Starting the illumination source and running it for a preset illumination time to allow the source to reach thermal equilibrium prevents temperature-related drift in the output spectrum and intensity, ensuring repeatable and reliable calibration. The preset illumination time can be set to 5-10 minutes. The illumination field distribution image reflects the brightness distribution within the illumination source's illuminated area. The illumination parameters can be adjusted based on the illumination field distribution image to determine if there are dark corners or overly bright areas. Illumination parameters can include the position, angle, and drive current of the illumination source. Adjusting illumination parameters based on the illumination field distribution image is an iterative optimization process, achieving consistent illumination from the illumination source through repeated measurements and adjustments.

[0032] The laser light source includes: a first laser light source and a second laser light source. S200: Determining the laser light source according to the surface material of the drilling area includes: S210a: In response to identifying that the material of the surface layer of the drilling area is metal, using the first laser light source as the laser light source; S210b: In response to identifying that the material of the surface layer of the drilling area is the base material, the second laser light source is used as the laser light source.

[0033] Preferably, after S200: determining the laser light source according to the material of the surface layer of the drilling area, the method further includes: S221: Acquire an alignment mark on the circuit board to be drilled, and compare the alignment mark with a positioning mark of the laser drilling system to determine an actual offset between the circuit board to be drilled and the carrier; S222: Correcting the coordinate system of the laser drilling system according to the actual offset so that the coordinate system is associated with the actual position of the circuit board to be drilled; S223: Determine the location of the drilling area according to the drilling processing file; S224: Move the replaceable laser light source so that the replaceable laser light source is aligned with the drilling area.

[0034] The actual offset between the board and the carrier establishes a correlation between the board and the laser drilling system's positioning system. During the drilling process, the board's position corresponds to the laser drilling system's alignment. Even after replacing the laser light source, the same hole can be accurately machined.

[0035] The laser light source is a first laser light source, S300: configuring and exciting the laser light source to illuminate the drilling area, including: S330a: Setting the initial energy of the first laser light source to a first initial energy; S340a: configuring an initial pulse interval of the first laser light source to be a first initial pulse interval; S350a: Excite the first laser light source with a beam size, a first initial energy, and a first initial pulse interval to irradiate the drilling area.

[0036] The laser light source is a second laser light source, S300: the laser light source is configured and excited to illuminate the drilling area, including: S330b: Setting the initial energy of the second laser light source to a second initial energy; S340b: configuring the initial pulse interval of the second laser light source to be a second initial pulse interval; S350b: Excite the second laser light source with a beam size, a second initial energy, and a second initial pulse interval to irradiate the drilling area.

[0037] For the ultraviolet laser used as the first laser light source, the first initial energy can be set to 8 joules / square centimeter, its pulse duration can be set to the nanosecond level, and the first initial pulse interval can be set according to temperature rise statistics, which is not limited here.

[0038] For the carbon dioxide laser used as the second laser light source, the second initial energy can be set to 3 joules / square centimeter, its pulse duration can be set to the nanosecond level, and the second initial pulse interval can be set according to temperature rise statistics, which is not limited here.

[0039] Preferably, before S300: configuring and activating a laser light source to irradiate the drilling area, the method further includes: S310: Obtain the size of the drilling area; S320: Adjusting the beam size of the laser light source according to the size of the drilling area.

[0040] Preferably, adjusting the beam size of the laser light source includes: S321: Determine the spot diameter of the laser light source according to the size of the drilling area; S322: Determine the spot diameter of the laser light source according to: d=K·λ·f / D, where λ represents the laser wavelength, f represents the focal length of the laser, D represents the diameter of the light beam incident on the scanning lens, d represents the focused spot diameter, i.e., the spot diameter of the laser light source, and K represents a constant; S323: Adjust the beam expander so that the diameter of the spot of the laser light source located on the surface of the drilling area is the spot diameter.

[0041] The scanning lens in the laser is a crucial optical component that is used to accurately focus the laser beam onto a flat working plane, while cooperating with the galvanometer system to achieve fast, large-area laser scanning.

[0042] The aperture of a laser-drilled hole is closely related to the focused spot diameter, but there are slight differences. Typically, the focused spot diameter d is used to characterize the aperture of a laser-drilled hole. In most cases, the aperture is larger than the focused spot diameter. The focused spot diameter can be compared to the tip of a very hot nail with a diameter of 0.5 mm. If this nail is used to burn a hole in paper, if the burn is prolonged or the nail is very hot, the resulting scorch mark on the paper will spread to 1 mm in width. This scorch mark, analogous to the "aperture," is larger than the nail tip, which is analogous to the "focused spot diameter."

[0043] Every material has a minimum energy density threshold at which it begins to ablate or melt. The focused spot diameter d determines the energy density distribution. The majority of the laser pulse's energy is concentrated within the area defined by the spot diameter d. Effective material removal occurs only in areas where the energy density exceeds the material's threshold. Because laser energy typically exhibits a Gaussian distribution (highest energy at the center and decreasing toward the edges), only a small area at the center of the spot reaches the effective ablation threshold. The diameter of the area ultimately removed (i.e., the aperture) is defined by the intersection of the energy density contour and the material threshold, and this range is almost always greater than d.

[0044] There are also differences between single-pulse and multi-pulse processing: With single-pulse drilling, the aperture is closest to the focused spot size, but can still be slightly larger due to pulse energy distribution and thermal effects. This method is often used for high-quality, high-precision micro-hole production. Multi-pulse drilling (spiral / circular cutting), on the other hand, uses a galvanometer to control the beam, scanning it repeatedly along a circular path, gradually hollowing out the material. This method can produce holes significantly larger than the focused spot diameter. The aperture is determined by the diameter of the scanning path, while the spot diameter determines the edge quality and precision of the processed part. Using a small spot size allows for finer, smoother, and larger holes.

[0045] Preferably, adjusting the energy of the laser light source according to the surface temperature of the drilling area includes: S410: Acquire the surface temperature of the drilling area; S420: In response to the surface temperature of the drilling area exceeding the temperature threshold, the energy of the current laser light source is reduced by a first preset amplitude and used as the energy of the laser light source for the next pulse; S430: In response to the energy of the laser light source of the next pulse being less than or equal to the energy density threshold, the energy density threshold is used as the energy of the laser light source of the next pulse.

[0046] Preferably, the method further comprises: In response to the surface material of the drilling area not being completely removed within the preset number of pulses, the energy of the current laser light source is increased by a second preset amplitude and used as the energy of the laser light source for the next pulse; According to the surface temperature of the drilling area, the pulse interval of the laser light source is adjusted so that the surface temperature of the drilling area is within the temperature threshold.

[0047] The excitation laser source energy is adjusted before each excitation laser pulse to effectively remove material from the drilled area. For copper, the energy density of the first laser source is in the range of 5-15 J / cm², with a pulse width of less than or equal to 10 nanoseconds to overcome high reflectivity. Therefore, the first initial energy can be set to 8 J / cm² to ensure that each pulse removes a portion of the copper layer. The energy density threshold for the first laser source is 5 J / cm².

[0048] For the FR4 material in the substrate, the FR4 material in the drilling area can be effectively removed. The energy density range of the second laser light source is 1-5 joules / square centimeter, and its pulse width is 50-200 nanoseconds to reduce carbonization and ensure smooth hole walls. Usually there is also a semi-cured sheet for bonding in the substrate, and for the semi-cured sheet material, the semi-cured sheet material in the drilling area can be effectively removed. The energy density range of the second laser light source is 2-4 joules / square centimeter, and its pulse width is 20-50 nanoseconds to avoid substrate delamination. In summary, the second initial energy can be set to 3 joules / square centimeter to ensure that each pulse can remove part of the substrate layer. For the second laser light source, the energy density threshold is 2 joules / square centimeter. For different materials, the energy density, pulse parameters and action targets of the laser are shown in Table 1.

[0049] Table 1 Relationship between material layer and laser parameters

[0050] The higher the voltage, the lower the laser energy. While the electro-optic modulator is nearly linear in the low-voltage region, it exhibits nonlinearity at high voltages due to refractive index saturation. Pre-distortion compensation (which can be understood as applying a "distorted" drive voltage) is required to achieve a linear change in the final output energy.

[0051] Before each pulse, the excitation laser source energy can be adjusted by adjusting the voltage based on the voltage-transmittance curve to achieve smooth energy adjustment. The adjustment range can be reduced to 80% of the current energy or increased by 10% based on the current energy.

[0052] The voltage-transmittance curve can be plotted by measuring the corresponding transmittance values ​​(T) at 0, 0.3, 0.8, and 1.0 for voltages V = 0, 1, 2, and 3 kV. Voltage adjustment is achieved through a real-time table lookup in the FPGA, which outputs the actual drive voltage. Driven by a 200 MHz clock, the FPGA receives a new target energy value every 5 ns. Using the target energy as the address, it accesses the corresponding voltage value in memory and outputs the actual drive voltage after the next clock cycle, 5 ns later. The raw energy signal is filtered through analog and digital filtering to suppress energy noise and achieve smooth variations. The digital filter utilizes a FIR filter with linear phase characteristics, ensuring distortion-free signal waveforms.

[0053] Preferably, after removing the surface material of the drilling area, the method further comprises: S510: Acquire an image of the drilling area after drilling through an image acquisition device; S520: reconstructing the three-dimensional topography of the hole wall according to the drilling area image; S530: Determine the flatness of the hole wall according to a defect recognition algorithm, wherein the defect recognition algorithm is used to identify the flatness of the hole wall; S540: In response to the flatness of the hole wall not reaching the preset flatness, repairing the hole wall until the preset flatness of the hole wall is reached.

[0054] Repair the hole wall until it reaches the preset flatness, including: S541: Evaluate hole wall roughness and determine repair targets. Use a high-power microscope (such as SEM) or a 3D profilometer to inspect the hole wall morphology after laser drilling, quantify the roughness parameters, and set the target roughness threshold (for example, roughness <5μm) based on product requirements.

[0055] S542: Select the appropriate laser type, preferably short-pulse or ultrashort-pulse lasers (such as picosecond lasers and femtosecond lasers), usually with ultraviolet wavelengths.

[0056] S543: Set the laser repair mode and scanning path, using a circular or spiral scan pattern to evenly scan the laser beam along the inner surface of the hole wall. The laser focus is positioned in the upper middle of the hole wall and slightly offset inward to ensure that energy is applied to the roughened area.

[0057] S544: Optimize laser process parameters and set appropriate laser energy density, pulse frequency, scanning speed and repetition times.

[0058] Initially, low energy is used for trial repair, and then gradually adjusted to the optimal parameters (e.g., energy density slightly higher than the material threshold but lower than the carbonization threshold).

[0059] S545: Execute laser repair processing. The laser system is activated and scans the target microhole multiple times along a preset path, removing surface irregularities layer by layer. A coaxial monitoring system can be used to observe changes in the hole wall in real time.

[0060] S546: Cleaning and decarburization treatment: After laser repair, plasma cleaning or chemical decarburization process is used to remove residual trace carbides or debris.

[0061] S547: Verify the repair effect and re-inspect the roughness, roundness, and cracks or delamination of the repaired hole wall. Perform electroplating verification to check the continuity and adhesion of the plating.

[0062] The image acquisition device uses a laser scanning confocal microscope to reconstruct the 3D topography of the hole wall through point-by-point scanning, achieving submicron accuracy. Through image processing and analysis, laser scanning generates a 3D model of the hole wall and quantifies geometric deviations (such as roundness and taper). A defect recognition algorithm, based on defect synthesis and semi-supervised learning, automatically classifies defects (cracks, chipped edges, and residual debris). Key parameter measurements can quantify hole size, surface roughness, and hole depth.

[0063] This application uses dynamic reduction of dielectric layer energy (e.g., FR4: 3J / cm² → 1.5J / cm²) to inhibit carbonization and real-time temperature control (<200°C) to avoid material phase change. Laser 1 is used to refine the hole wall and reduce the heat-affected zone. Short pulses are used for the copper layer and long pulses for the dielectric layer to avoid interface unevenness. Comparative data under the same conditions are shown in Table 2.

[0064] Table 2 Roughness relationship table

[0065] Roughness reduction = (1-Ra / Rb) × 100%. Ra is the roughness of the hole wall of the corresponding material after the embodiment of the present application is implemented; Rb is the roughness of the corresponding material before the embodiment of the present application is implemented.

[0066] The hole wall roughness (R) is defined as the arithmetic mean roughness, and the calculation formula is: ; Where x is the horizontal displacement along the reference length L (unit: mm), representing the length coordinate of the measured surface; y(x) is the vertical deviation between the actual profile curve and the center line at position x (unit: μm), i.e., the profile height offset; L is the evaluation length; and the center line is an ideal straight line within the reference length L that divides the actual profile into upper and lower equal areas. It is a reference line dynamically calculated based on the actual profile.

[0067] It should be understood that although Figure 1 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 1 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0068] By implementing a laser drilling method provided in an embodiment of the present application, a laser drilling system with a replaceable laser light source can be used. When drilling holes in a circuit board, the laser light source can be switched according to the material of the hole surface, and an ultraviolet laser can be used to process the metal layer and a carbon dioxide laser can be used to process the substrate layer, thereby simplifying the laser drilling process and improving the drilling yield of the circuit board.

[0069] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser light source is adjusted according to the temperature of the surface layer of the drilling area. This can ensure that the surface layer of the drilling area will not overheat, the hole wall is smooth, and carbonization of the base material in the drilling area is avoided, thereby improving the drilling yield.

[0070] Figure 3 The business logic diagram of drilling holes in a circuit board using a laser drilling system is briefly shown.

[0071] The voltage that drives the laser light source can be adjusted in time according to the temperature and the residual degree of the surface material in the drilling area to smoothly adjust the laser pulse energy, effectively remove the material in the hole, and control the temperature during the drilling process to ensure that the physical and electrical properties of the circuit board are not deteriorated due to temperature rise.

[0072] In other embodiments, a laser drilling system includes: a control device and a replaceable laser light source, the control device controlling the replaceable laser light source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction, the circuit board to be drilled including metal and a substrate, wherein the replaceable laser light source includes at least two laser light sources, and the drilling direction is directed from the replaceable laser light source to the circuit board to be drilled along an optical axis direction of the replaceable laser light source; The control device is configured to: S100: Identifying the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; S200: Determine the laser light source according to the surface material of the drilling area; S300: configuring and activating a laser light source to illuminate the drilling area; S400: adjusting the energy of the excitation laser light source according to the surface temperature of the drilling area, and irradiating the drilling area with the adjusted energy excitation laser light source until the surface material of the drilling area is removed.

[0073] By implementing a laser drilling system provided in an embodiment of the present application, a laser drilling system with a replaceable laser light source can be used. When drilling holes in a circuit board, the laser light source can be switched according to the material of the surface layer of the hole. An ultraviolet laser can be used to process the metal layer, and a carbon dioxide laser can be used to process the substrate layer. This simplifies the laser drilling process and improves the drilling yield of the circuit board.

[0074] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser light source is adjusted according to the temperature of the surface layer of the drilling area. This can ensure that the surface layer of the drilling area will not overheat, the hole wall is smooth, and carbonization of the base material in the drilling area is avoided, thereby improving the drilling yield.

[0075] The specific definitions of the laser drilling system described above can be found in the definitions of the laser drilling method described above and will not be further elaborated here. Each module in the aforementioned laser drilling system may be implemented in whole or in part through software, hardware, or a combination thereof. Each of these modules may be embedded in or independent of a processor within a computer device in hardware form, or may be stored in a computer device memory in software form, allowing the processor to call and execute the corresponding operations of each module.

[0076] In other embodiments, Figure 4 As shown, a control device includes a memory, a processor, and a laser drilling program stored in the memory and executable on the processor. When the processor executes the laser drilling program, the laser drilling method described above is implemented, specifically including: S100: Identifying the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; S200: Determine the laser light source according to the surface material of the drilling area; S300: configuring and activating a laser light source to illuminate the drilling area; S400: adjusting the energy of the excitation laser light source according to the surface temperature of the drilling area, and irradiating the drilling area with the adjusted energy excitation laser light source until the surface material of the drilling area is removed.

[0077] By implementing a control device provided in an embodiment of the present application, a laser drilling system with a replaceable laser light source can be used. When drilling holes in a circuit board, the laser light source can be switched according to the material of the surface layer of the hole. An ultraviolet laser can be used to process the metal layer, and a carbon dioxide laser can be used to process the substrate layer. This simplifies the laser drilling process and improves the drilling yield of the circuit board.

[0078] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser light source is adjusted according to the temperature of the surface layer of the drilling area. This can ensure that the surface layer of the drilling area will not overheat, the hole wall is smooth, and carbonization of the base material in the drilling area is avoided, thereby improving the drilling yield.

[0079] In other embodiments, a computer-readable storage medium stores a laser drilling program. When the laser drilling program is executed by a processor, the laser drilling method described in the first aspect is implemented, specifically including: S100: Identifying the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; S200: Determine the laser light source according to the surface material of the drilling area; S300: configuring and activating a laser light source to illuminate the drilling area; S400: adjusting the energy of the excitation laser light source according to the surface temperature of the drilling area, and irradiating the drilling area with the adjusted energy excitation laser light source until the surface material of the drilling area is removed.

[0080] By implementing a computer-readable storage medium provided in an embodiment of the present application, a laser drilling system with a replaceable laser light source can be used to drill holes in a circuit board. The laser light source can be switched according to the material of the surface layer of the hole, and an ultraviolet laser can be used to process the metal layer and a carbon dioxide laser can be used to process the substrate layer, thereby simplifying the laser drilling process and improving the drilling yield of the circuit board.

[0081] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser light source is adjusted according to the temperature of the surface layer of the drilling area. This can ensure that the surface layer of the drilling area will not overheat, the hole wall is smooth, and carbonization of the base material in the drilling area is avoided, thereby improving the drilling yield.

[0082] In some other embodiments, a computer program product includes a computer program. When the computer program is executed by a processor, the laser drilling method described in the first aspect is implemented, specifically including: S100: Identifying the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer in the drilling area irradiated by the replaceable laser light source; S200: Determine the laser light source according to the surface material of the drilling area; S300: configuring and activating a laser light source to illuminate the drilling area; S400: adjusting the energy of the excitation laser light source according to the surface temperature of the drilling area, and irradiating the drilling area with the adjusted energy excitation laser light source until the surface material of the drilling area is removed.

[0083] By implementing a computer program product provided in an embodiment of the present application, a laser drilling system with a replaceable laser light source can be used to drill holes in a circuit board. The laser light source can be switched according to the material of the surface layer of the hole, and an ultraviolet laser can be used to process the metal layer and a carbon dioxide laser can be used to process the substrate layer. This simplifies the laser drilling process and improves the drilling yield of the circuit board.

[0084] By implementing the laser drilling method, system, control device, and readable storage medium provided in the embodiments of the present application, a laser drilling system with a replaceable laser light source can be used to drill holes in circuit boards. The laser light source can be switched according to the surface material of the hole, such as using an ultraviolet laser to process metal layers and using a carbon dioxide laser to process substrate layers. This simplifies the laser drilling process and improves the drilling yield of the circuit boards.

[0085] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser light source is adjusted according to the temperature of the surface layer of the drilling area. This can ensure that the surface layer of the drilling area will not overheat, the hole wall is smooth, and carbonization of the base material in the drilling area is avoided, thereby improving the drilling yield.

[0086] The voltage that drives the laser light source can be adjusted in time according to the temperature and the residual degree of the surface material in the drilling area to smoothly adjust the laser pulse energy, effectively remove the material in the hole, and control the temperature during the drilling process to ensure that the physical and electrical properties of the circuit board are not deteriorated due to temperature rise.

[0087] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0088] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as steps executed by a computer software program control. For example, an embodiment of the present application includes a computer program product, which includes a computer program loaded on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a memory, or installed from a ROM. When the computer program is executed by an external processor, the above-mentioned functions defined in the method of the embodiment of the present application are executed.

[0089] It should be noted that the computer-readable medium of the embodiments of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or component, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the embodiments of the present application, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or device. In the embodiments of the present application, the computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries a computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or convey a program for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0090] The computer-readable medium may be included in the server or may exist independently and not incorporated into the server. The computer-readable medium carries one or more programs that, when executed by the server, cause the server to: in response to detecting that the terminal's peripheral mode is inactive, obtain the frame rate of applications on the terminal; when the frame rate meets a screen-off condition, determine whether the user is currently accessing the terminal's screen information; and, in response to determining that the user is not accessing the terminal's screen information, control the screen to enter an immediate dimming mode.

[0091] Computer program code for performing the operations of embodiments of the present application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0092] Each embodiment in this specification is described in a progressive manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple. For relevant parts, refer to the partial description of the method embodiment. The system and system embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. A person of ordinary skill in the art can understand and implement it without expending creative work.

[0093] The above is a detailed introduction to the technical solutions provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core concept of this application. At the same time, for those skilled in the art, based on the concept of this application, there may be changes in the specific implementation methods and application scope. In summary, the contents of this specification should not be understood as limiting this application.

[0094] The above is a detailed introduction to a laser drilling method, system, control device and readable storage medium provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The above embodiments are only preferred embodiments of the present application and are used to help understand the method and core ideas of the present application, and are not intended to limit the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application, these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. A laser drilling method, characterized in that: A control device for use in a laser drilling system, the laser drilling system including a replaceable laser light source, the control device controlling the replaceable laser light source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction, the circuit board to be drilled including metal and a substrate, wherein the replaceable laser light source includes at least two laser light sources, and the drilling direction is directed from the replaceable laser light source to the circuit board to be drilled along the optical axis direction of the replaceable laser light source; The laser drilling method comprises: Identifying the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer of the drilling area irradiated by the replaceable laser light source; Determining the laser light source according to the surface material of the drilling area; configuring and activating the laser light source to illuminate the drilling area; The energy of the laser light source is adjusted according to the surface temperature of the drilling area, and the laser light source is excited with the adjusted energy to irradiate the drilling area until the surface material of the drilling area is removed.

2. The laser drilling method according to claim 1, characterized in that: The identifying of the surface material of the drilling area includes: Starting the illumination light source in the laser drilling system to illuminate the drilling area; Acquiring an image of the drilling area by an image acquisition device in the laser drilling system; Preprocessing the drilling area image to enhance the surface features of the drilling area; extracting characteristic parameters corresponding to the surface features; A material identification model is called to determine the material of the surface layer of the drilling area based on the characteristic parameters of the surface characteristics.

3. The laser drilling method according to claim 1, characterized in that: Before identifying the material of the surface layer of the drilling area, the method further includes: Turning off the ambient light source in the laser drilling system; Arranging a reflectivity calibration plate on the carrier platform of the circuit board to be drilled, so that the surface of the reflectivity calibration plate is flush with the surface of the circuit board to be drilled; Starting the lighting source and continuously running the lighting for a preset lighting time to allow the lighting source to reach a thermal equilibrium state; Controlling an image acquisition device to acquire an image of the reflectivity calibration plate under the illumination of the illumination light source to obtain an illumination field distribution image; According to the illumination field distribution image, the illumination parameters of the illumination light source are adjusted so that the illumination light source is evenly irradiated on the circuit board to be drilled.

4. The laser drilling method according to claim 1, wherein: The laser light source includes: a first laser light source and a second laser light source, and the laser light source is determined according to the material of the surface layer of the drilling area, including: In response to identifying that the material of the surface layer of the drilling area is metal, using the first laser light source as the laser light source; In response to identifying that the material of the surface layer of the drilling area is a base material, the second laser light source is used as the laser light source.

5. The laser drilling method according to claim 4, characterized in that: After determining the laser light source according to the surface material of the drilling area, the method further includes: Obtaining an alignment mark on the circuit board to be drilled, and comparing the alignment mark with a positioning mark of the laser drilling system to determine an actual offset between the circuit board to be drilled and the carrier platform; Correcting the coordinate system of the laser drilling system according to the actual offset so that the coordinate system is associated with the actual position of the circuit board to be drilled; Determine the location of the drilling area according to the drilling processing file; The replaceable laser light source is moved so as to align the replaceable laser light source with the drilling area.

6. The laser drilling method according to claim 1, characterized in that: The laser light source is a first laser light source, and the configuration and excitation of the laser light source to illuminate the drilling area include: configuring the initial energy of the first laser light source to be a first initial energy; configuring an initial pulse interval of the first laser light source to be a first initial pulse interval; The first laser light source is excited with a beam size, a first initial energy, and a first initial pulse interval to irradiate the drilling area.

7. The laser drilling method according to claim 1, characterized in that: The laser light source is a second laser light source, and the configuration and excitation of the laser light source to illuminate the drilling area include: configuring the initial energy of the second laser light source to be a second initial energy; configuring an initial pulse interval of the second laser light source to be a second initial pulse interval; The second laser light source is excited with a beam size, a second initial energy, and a second initial pulse interval to irradiate the drilling area.

8. The laser drilling method according to claim 6 or 7, characterized in that: Before configuring and exciting the laser light source to irradiate the drilling area, the method further includes: Get the size of the drilling area; The beam size of the laser light source is adjusted according to the size of the drilling area.

9. The laser drilling method according to claim 8, characterized in that: The adjusting the beam size of the laser light source includes: Determining the spot diameter of the laser light source according to the size of the drilling area; The spot diameter of the laser light source is determined according to: d=K·λ·f / D, where λ represents the laser wavelength, f represents the focal length of the laser, D represents the diameter of the light beam incident on the scanning lens, d represents the focused spot diameter, and K represents a constant; The beam expander is adjusted so that the diameter of the light spot of the laser light source located on the surface of the drilling area is the light spot diameter.

10. The laser drilling method according to claim 1, wherein: The step of adjusting the energy of the laser light source according to the surface temperature of the drilling area includes: Obtaining the surface temperature of the drilling area; In response to the surface temperature of the drilling area exceeding the temperature threshold, the energy of the current laser light source is reduced by a first preset amplitude and used as the energy of the laser light source for the next pulse; In response to the energy of the laser light source of the next pulse being less than or equal to an energy density threshold, the energy density threshold is used as the energy of the laser light source of the next pulse.

11. The laser drilling method according to claim 1, wherein: The method further comprises: In response to the surface material of the drilling area not being completely removed within the preset number of pulses, the energy of the current laser light source is increased by a second preset amplitude and used as the energy of the laser light source for the next pulse; According to the surface temperature of the drilling area, the pulse interval of the laser light source is adjusted so that the surface temperature of the drilling area is within a temperature threshold.

12. The laser drilling method according to claim 1, wherein: After removing the surface material of the drilling area, the method further comprises: Acquire an image of the drilling area after drilling by an image acquisition device; reconstructing the three-dimensional morphology of the hole wall according to the drilling area image; determining the flatness of the hole wall according to a defect recognition algorithm, wherein the defect recognition algorithm is used to identify the flatness of the hole wall; In response to the flatness of the hole wall not reaching the preset flatness, the hole wall is repaired until the flatness of the hole wall is reached.

13. A laser drilling system, characterized in that: The laser drilling system includes: a control device and a replaceable laser light source, wherein the control device controls the replaceable laser light source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction, wherein the circuit board to be drilled includes metal and a substrate, wherein the replaceable laser light source includes at least two laser light sources, and the drilling direction is directed from the replaceable laser light source to the circuit board to be drilled along the optical axis direction of the replaceable laser light source; The control device is configured to: Identifying the material of the surface layer of the drilling area, wherein the surface layer of the drilling area is the surface of the material layer of the drilling area irradiated by the replaceable laser light source; Determining the laser light source according to the surface material of the drilling area; configuring and activating the laser light source to illuminate the drilling area; The energy of the laser light source is adjusted according to the surface temperature of the drilling area, and the laser light source is excited with the adjusted energy to irradiate the drilling area until the surface material of the drilling area is removed.

14. A control device, characterized in that: The laser drilling method comprises a memory, a processor and a laser drilling program stored in the memory and executable on the processor. When the processor executes the laser drilling program, the laser drilling method according to any one of claims 1 to 12 is implemented.

15. A readable storage medium, characterized in that A laser drilling program is stored thereon, and when the laser drilling program is executed by the processor, the laser drilling method according to any one of claims 1 to 12 is implemented.

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