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Chemical copper-plating solution and chemical copper-plating method

A technology of electroless copper plating and electroless plating, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problem of non-decreasing plating speed, and achieve the improvement of plating speed, work efficiency and stability Effect

Inactive Publication Date: 2011-09-21
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The present invention solves the problem that the plating speed does not decrease under the high stability of the chemical plating solution existing in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Electroless Copper Plating Solution:

[0034] Copper sulfate pentahydrate 10g / L

[0035] N-Methylmorpholine 2g / L

[0036] Formaldehyde 4g / L

[0037] NaOH 13g / L

[0038] Sodium Potassium Tartrate 10g / L

[0039] Disodium EDTA 20g / L

[0040] Potassium ferrocyanide 0.1g / L

[0041] Bipyridine 0.01g / L

[0042] Methanol 50mL / L.

Embodiment 2

[0044] Electroless Copper Plating Solution:

[0045] Copper sulfate pentahydrate 10g / L

[0046] N-Methylmorpholine 9g / L

[0047] Formaldehyde 4g / L

[0048] NaOH 13g / L

[0049] Sodium Potassium Tartrate 10g / L

[0050] Disodium EDTA 20g / L

[0051] Tannin 0.01g / L

[0052] Bipyridine 0.01g / L

[0053] Methanol 50mL / L.

Embodiment 3

[0055] Electroless Copper Plating Solution:

[0056] The difference from Example 1 is that the electroless copper plating solution also contains accelerator ammonium chloride and nickel sulfate. The specific content is:

[0057] Ammonium chloride 0.5g / L

[0058] Nickel sulfate 0.1g / L.

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PUM

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Abstract

The invention provides chemical copper-plating solution. The chemical copper-plating solution is the aqueous solution containing copper salt, N-methylmorpholine, formaldehyde, complexing agent, stabilizer and pH regulator and the pH value of the chemical copper-plating solution is 12-13. The invention also provides a chemical copper-plating method. The method comprises the following steps: directly contacting a part to perform chemical copper plating with the chemical copper-plating solution, cleaning and drying to obtain the plated part. By adopting the chemical copper-plating solution, the stability of the copper-plating solution can be greatly increased and the plating speed can be increased. By adopting the chemical copper-plating method provided by the invention to plate copper on the part to be plated, the yield of the copper-plating product can be increased largely and the work efficiency of chemical plating can be increased, thus the method is good for industrialized mass production.

Description

technical field [0001] The invention relates to the field of non-metallic electroless plating, in particular to an electroless plating solution and an electroless copper plating method. Background technique [0002] Since the birth of electroless copper plating technology, scientists have continuously explored the kinetic process of its heterogeneous surface catalytic deposition; trying to make a reasonable explanation for the experimental facts of electroless copper plating. At present, most commercial electroless copper plating solutions use formaldehyde as a reducing agent, and there are two basic chemical reactions in the reaction process, namely: [0003] Reaction formula 1: Cu 2+ +2e→Cu [0004] Reaction 2: 2HCHO+4OH-→H 2 ↑+2H 2 O+2HCOO-+2e [0005] The chemical reaction takes place on the catalytic heterogeneous surface in the absence of external power and electrons. [0006] Above-mentioned reaction formula one and reaction formula two can be combined into the ...

Claims

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Application Information

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IPC IPC(8): C23C18/40
Inventor 韦家亮
Owner BYD CO LTD
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