Room temperature curing high-temperature-resistant high-tenacity epoxy adhesive and preparation method thereof

An epoxy adhesive, room temperature curing technology, used in adhesives, epoxy resin adhesives, polymer adhesive additives, etc., can solve the problem of poor toughening effect and heat resistance, and achieve excellent shear strength and excellent toughness. , cheap and easy to obtain effects

Active Publication Date: 2015-07-29
上海都昱新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This invention patent uses epoxy resin modified by carboxyl-terminated liquid nitrile rubber, and its toughening

Method used

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  • Room temperature curing high-temperature-resistant high-tenacity epoxy adhesive and preparation method thereof

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Embodiment 1

[0020] A room-temperature-curable, high-temperature-resistant, high-toughness epoxy adhesive. The raw materials in terms of weight percent include: 30% of component A and 70% of component B. The raw materials of component A in terms of weight percent include: 75% of E51 epoxy resin 10% epoxy resin toughening agent modified by nano core-shell particles, 2% dodecyl to tetradecyl glycidyl ether, 0.5% polysiloxane coupling agent, 0.5% hydrophobic fumed silica, talc Powder 11.9%, polydimethylsiloxane defoamer 0.1%, the raw materials of the B component according to weight percentage include: alicyclic amine 35%, polyamide 25%, modified fatty amine 15%, amino silicone Alkane coupling agent coupling agent 0.5%, hydrophobic fumed silica 0.5%, aluminum oxide 1%, polydimethylsiloxane defoamer 0.1%.

[0021] The preparation method of the room temperature curing epoxy adhesive with high temperature resistance and high toughness, the specific steps are as follows:

[0022] (1) Taking mater...

Embodiment 2

[0027] An epoxy adhesive cured at room temperature with high temperature resistance and high toughness, the raw materials according to weight percentage include: 32% of component A, 68% of component B, and the raw materials of component A according to weight percentage include: 70% of E51 epoxy resin 15% epoxy resin toughening agent modified by nano core-shell particles, 2% dodecyl to tetradecyl glycidyl ether, 0.5% modified polysiloxane coupling agent, 0.5% hydrophobic fumed silica , aluminum oxide 11.9%, tributyl phosphate defoamer 0.1%, the raw materials of the B component according to weight percentage include: alicyclic amine 30%, polyamide 25%, modified fatty amine 15%, mercaptosiloxane Coupling agent 0.5% coupling agent, 0.5% hydrophobic fumed silica, 28.9% calcium carbonate, 0.1% tributyl phosphate defoamer.

[0028] The preparation method of the room temperature curing epoxy adhesive with high temperature resistance and high toughness, the specific steps are as follow...

Embodiment 3

[0034] An epoxy adhesive cured at room temperature with high temperature resistance and high toughness, the raw materials according to weight percentage include: 35% of component A, 65% of component B, and the raw materials of component A according to weight percentage include: 72% of E51 epoxy resin 12.5% ​​epoxy resin toughening agent modified by nano core-shell particles, 2% dodecyl to tetradecyl glycidyl ether, 0.5% polysiloxane coupling agent, 0.5% hydrophobic fumed silica, talc Powder 12.4%, polydimethylsiloxane defoamer 0.1%, the raw materials of the B component according to weight percentage include: alicyclic amine 40%, polyamide 20%, modified fatty amine 15%, amino silicone 0.5% alkane coupling agent, 0.5% hydrophobic fumed silica, 23.9% talcum powder, and 0.1% polydimethylsiloxane defoamer.

[0035] The preparation method of the room temperature curing epoxy adhesive with high temperature resistance and high toughness, the specific steps are as follows:

[0036] (1...

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Abstract

The invention discloses a room temperature curing high-temperature-resistant high-tenacity epoxy adhesive and a preparation method thereof. The room temperature curing high-temperature-resistant high-tenacity epoxy adhesive is prepared from raw materials comprising a component A and a component B based on weight percent, wherein the component A comprises the following raw materials in weight percent: epoxy resin, a flexibilizer, a thinner, a coupling agent, fumed silica, a packing and a defoaming agent; the component B comprises the following raw materials in weight percent: alicyclic amine, polyamide, modified fatty amine, a coupling agent, fumed silica, a packing and a defoaming agent; the flexibilizer in the component A adopts epoxy resin modified by nanometer core-shell particles. According to the room temperature curing high-temperature-resistant high-tenacity epoxy adhesive disclosed by the invention, the excellent tenacity is achieved by using the common epoxy resin, the epoxy flexibilizer modified by the nanometer core-shell particles and the polyamide curing agent; the epoxy resin is cheap in price, accessible and capable of retaining higher shear strength at the high temperature; when alicyclic amine and modified fatty amine are selected and used as curing agents, the Tg can be higher, and the shear strength at the high temperature can be kept excellent.

Description

technical field [0001] The invention relates to an adhesive, in particular to an epoxy adhesive cured at room temperature with high temperature resistance and high toughness and a preparation method thereof. Background technique [0002] As a good bonding material, epoxy adhesive accounts for the largest proportion of existing adhesive types and has a wide range of applications. The brittleness of epoxy adhesives has been recognized by people in the industry. Since its inception, people have been conducting research on the toughening of epoxy resins. The first-generation toughening agent uses nitrile rubber for toughening, and reacts it with epoxy resin to make a carboxyl-terminated-COOH type toughening agent, referred to as CTBN, which is a sea-island structure in terms of molecular morphology, while in CTBN The terminal carboxyl group can produce good chemical reaction with amine curing agent. When an external force is applied, it can better absorb the impact and achieve...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/08C09J11/06C09J11/04
Inventor 黄荣杨丽燕许期斌
Owner 上海都昱新材料科技有限公司
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