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A kind of bdapfp type silicon-containing epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, good viscosity controllability, and comprehensive The effect of excellent performance

Inactive Publication Date: 2018-08-14
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • A kind of bdapfp type silicon-containing epoxy imide matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0046] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80°C for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0048]1.0 g of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane (BDAPFP), 60.0 g of 1,3-diglycidyl resorcinol, 30.0 g of 3 , 4-epoxycyclohexanoic acid-3',4'-epoxycyclohexylmethyl ester and 10.0 grams of N,N,N',N'-tetraglycidyl-2,2-bis[4-( 4-Aminophenoxy) phenyl] propane epoxy resin was put into the reaction kettle, and after stirring and mixing for 0.5 hours at 100°C, 2.0 g of BBMO-1 imide oligomer was added to continue stirring and reacting for 1 hour, and then added 3.0 g of 3-aminopropyltrimethoxysilane was stirred and reacted for 5 minutes, cooled to room temperature, and then 10.0 g of 1,8-diaza-bicyclo[5.4.0]undecene-7, 12.0 g of methyltetrahydro Phthalic anhydride and 28.0 grams of tung oil anhydride were stirred and mixed uniformly to obtain 156.0 grams of BDAPFP type silicon-containing epoxyimide matrix resin, which was denoted as M-1.

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Abstract

The invention relates to BDAPFP type silicon-containing epoxy imide matrix resin and a preparation method thereof. The matrix resin comprises 2, 2-bis[4-(2, 4-diaminobenzene oxygroup) phenyl] hexafluoropropane (BDAPFP), epoxy resin, 3-aminopropyl trialkoxy silane, imide oligomer and curing agent. The preparation method includes the steps of firstly, preparing the imide oligomer; secondly, placing the 2, 2-bis[4-(2, 4-diaminobenzene oxygroup) phenyl] hexafluoropropane (BDAPFP) and the epoxy resin into a reaction kettle, stirring and mixing for reaction, adding the imide oligomer, continuing stirring for reaction, adding the 3-aminopropyl trialkoxy silane, stirring for reaction, adding the curing agent, and evenly stirring and mixing to obtain the BDAPFP type silicon-containing epoxy imide matrix resin. The BDAPFP type silicon-containing epoxy imide matrix resin is widely applicable to the bonding of metals such steel, copper and aluminum and base materials such as ceramics, glass and resin-based composite materials and the preparation of glass-fiber-enhanced, aramid-fiber-enhanced and carbon-fiber-enhanced composite materials and is promising in industrialization prospect.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a BDAPFP silicon-containing epoxyimide matrix resin and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The cur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12
CPCC08G73/125
Inventor 虞鑫海周志伟
Owner DONGHUA UNIV
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