4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof

A technology of diaminophenoxy and epoxy adhesives, applied in the direction of online phenolic epoxy resin adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of high price, unfavorable large-scale popularization and application, polyetherimide Resin cost is high, to achieve the effect of convenient operation, good application prospect and strong hydrophobicity

Inactive Publication Date: 2014-07-02
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof
  • 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Preparation of component A

[0046] Combine 100 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 23.1 grams (0.05 mol) 4,4'- The bis(2,4-diaminophenoxy)diphenylsulfone was put into the reaction kettle, heated to 50°C, stirred and reacted for 2 hours to obtain 123.1 g of a homogeneous and transparent copolymer, which was recorded as A1.

[0047] Combine 100 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 18.5 grams (0.04 moles) of 4,4'- The bis(2,4-diaminophenoxy)diphenylsulfone was put into the reaction kettle, heated to 90°C, stirred for 0.5 hours, and 118.5 g of homogeneous and transparent copolymer was obtained, which was recorded as A2.

[0048] Combine 100 grams of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester epoxy resin (epoxy value 0.85) with 21.7 grams (0.047 mole) 4,4'-bis(2,4 -Diaminophenoxy) diphenyl sulfone was put into the reaction kettle, heated to 60°C...

Embodiment 2

[0052] Preparation of component B

[0053] At room temperature, add 46.2 g (0.1 mol) 4,4'-bis(2,4-diaminophenoxy) diphenyl sulfone and 850 g N,N-dimethylacetamide into the reaction kettle, stir to dissolve completely Then, 104 grams (0.2 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and 64.4 grams (0.2 moles) of 3,3',4,4' were added -Tetracarboxybenzophenone dianhydride, stirred and reacted for 0.5 hours to obtain 1064.6 g of homogeneous transparent solution, added 170 g of toluene, heated to reflux, and performed reflux water separation reaction. The temperature was 100°C and the reaction time was 2 hours. After the reaction is completed, part of the organic solvent is separated so that the solid content is in the range of 15%-30%, which is recorded as B1.

[0054] At room temperature, 46.2 g (0.1 mol) 4,4'-bis(2,4-diaminophenoxy) diphenyl sulfone, 310 g N,N-dimethylacetamide and 350 g N-methyl- 2-Pyrrolidone was added to the reaction kettle. After stirrin...

Embodiment 3

[0058] Preparation of 4,4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature resistant epoxy adhesive

[0059] At room temperature, stir and mix components A and B at a mass ratio of 1:1-2 to obtain a series of 4,4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature resistant Epoxy adhesive, denoted as HTEA-p, p is a natural number, the specific formula is shown in Table 1.

[0060] Table 14. Formula table of 4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature epoxy adhesive unit: grams

[0061] Component

[0062] HTEA-8

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Abstract

The invention relates to a 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive is composed of a component A and a component B in a mass ratio of 1:(1-2), wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamido phenoxy)diphenylsulphone and epoxy resin; and the component B is a homogeneous-phase transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and diphenylsulphone. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

Description

Technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparations thereof, and particularly relates to a 4,4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature resistant epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding properties: high bonding strength, wide bonding surface, it is combined with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) or non The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the material to be bonded. Therefore, it can be used in many stressed structures. One of the main components of the mixture; (2) Good processing performance: The flexibility of epoxy resin formulation, the diversity of processing technology and product performance are the most prominent among po...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/08C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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