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A kind of bdabp type silicon-containing epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, realize industrialized production, and controllable viscosity good sex effect

Inactive Publication Date: 2018-09-25
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • A kind of bdabp type silicon-containing epoxy imide matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0047] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80°C for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0049]1.0 g of 4,4'-bis(2,4-diaminophenoxy)biphenyl (BDABP), 10.0 g of 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl Resin, 20.0 g 1,3-diglycidyl resorcinol, 20.0 g CE793 epoxy resin and 50.0 g N,N,N',N'-tetraglycidyl-2,2-bis[4-( 4-Aminophenoxy) phenyl] propane epoxy resin was put into the reaction kettle, and after stirring and mixing for 0.5 hours at 100°C, 2.0 g of BBMO-1 imide oligomer was added to continue stirring and reacting for 1 hour, and then added 3.0 grams of 3-aminopropyltrimethoxysilane was stirred and reacted for 5 minutes, cooled to room temperature, then added 12.0 grams of 1,8-diaza-bicyclo[5.4.0]undecene-7 and 38.0 grams of tung oilic anhydride, stirred Mix evenly to obtain 156.0 g of BDABP silicon-containing epoxyimide matrix resin, denoted as M-1.

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Abstract

The invention relates to BDABP type silicon containing epoxy imide matrix resin and a preparation method thereof. The matrix resin is prepared from 4,4'-bis(2,4-diamino phenoxy)biphenyl BDABP, epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparation method comprises the following steps that 1, the imide oligomer is prepared; 2, 4,4'-bis(2,4-diamino phenoxy)biphenyl and the epoxy resin are placed in a reaction still, after stirring, mixing and reacting, the imide oligomer is added, the mixture continues to be stirred to react, then 3-aminopropyl trialkoxysilane is added and stirred to react, the curing agent is added, and the mixture is stirred and mixed to be uniform. The BDABP type silicon containing epoxy imide matrix resin can be widely applied to bonding among steel, copper, aluminum and other metal and ceramic, glass, resin-based composites and other base materials and preparation of glass fiber, aramid fiber and carbon fiber reinforced composites, and has good industrial prospects.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a BDABP silicon-containing epoxyimide matrix resin and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The curi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12
CPCC08G73/125
Inventor 虞鑫海吴倩周志伟
Owner DONGHUA UNIV
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