DAHTM type silicon-containing epoxy imide matrix resin and preparing method thereof
A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, excellent comprehensive performance, and realize industrialized production Effect
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[0042] Example 1
[0043] 73.2 g (0.2 mol) 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366g / mol), 735.0 g o-cresol, 52.0 g (0.1 mol) 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA, 520g / mol) and 19.6g (0.2mol) of maleic anhydride (MA, 98g / mol) are placed in the reactor , Blow in nitrogen, stir, heat to 80°C, add 3.8 g of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitation with 1500 g of methanol In the kettle, stir at high speed to precipitate solids, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g). The yield is 98.2%, which is recorded as BBMO-1.
Example Embodiment
[0044] Example 2
[0045] 73.2 g (0.2 mol) 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366g / mol), 1460 g o-cresol, 52.0 g (0.1 mol) 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA, 520g / mol) and 19.6g (0.2mol) of maleic anhydride (MA, 98g / mol) are placed in the reactor , Blow in nitrogen, stir, heat to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, then cool to 60°C, pour the reactants into 2000 grams of ethanol and 920 grams In the precipitator for ethylene glycol monomethyl ether, stir at high speed to precipitate solids, filter, and vacuum dry at 80°C for 10 hours to obtain 313.4 g of imide oligomer (theoretical output: 314.0 g), with a yield of 99.8%. Denoted as BBMO-2.
Example Embodiment
[0046] Example 3
[0047] 1.0g 4,4'-diamino-4”-hydroxytriphenylmethane (DAHTM), 20.0g ECC202 epoxy resin, 20.0g 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidol Ester epoxy resin, 15.0 g CE793 epoxy resin and 45.0 g N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoro Put the propane epoxy resin into the reactor, stir and mix for 0.5 hour at 100°C, add 2.0 g of BBMO-2 imide oligomer and continue to stir and react for 1 hour, then add 3.0 g of 3-aminopropyl trimethoxy The silane was stirred and reacted for 5 minutes, cooled to room temperature, and then 20.0 grams of 1,8-diaza-bicyclo[5.4.0]undecene-7 and 30.0 grams of hexahydrophthalic anhydride were added, stirred and mixed uniformly to obtain 156.0 grams of DAHTM type containing Silicon epoxy imide base resin, denoted as M-1.
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