DAHTM type silicon-containing epoxy imide matrix resin and preparing method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, excellent comprehensive performance, and realize industrialized production Effect

Inactive Publication Date: 2016-11-23

DONGHUA UNIV +1

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Problems solved by technology

But its heat resistan...

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Abstract

The invention relates to DAHTM type silicon-containing epoxy imide matrix resin and a preparing method thereof. The matrix resin is prepared from 4,4'-diamido-4''-hydroxy triphenylmethane (DAHTM), epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparing method includes the following steps that 1, the imide oligomer is prepared; 2, DAHTM and epoxy resin are put into a reaction kettle, stirred and mixed for reaction, then the imide oligomer is added, the mixture continues to be stirred for reaction, then 3-aminopropyl trialkoxysilane is added and stirred for reaction, the curing agent is added and stirred to be mixed uniformly to obtain the matrix resin. The matrix resin can be widely applied to adhesion between metal such as steel, copper and aluminum and a base material such as ceramic, glass and a resin-based composite material and used for preparing glass fiber, aramid fiber and carbon fiber reinforced composite and has good industrial prospects.

Technology Topic

ChemistryCarbon fiber reinforced composite +11

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Examples

Experimental program(6)

Example Embodiment

[0042] Example 1

[0043] 73.2 g (0.2 mol) 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366g/mol), 735.0 g o-cresol, 52.0 g (0.1 mol) 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA, 520g/mol) and 19.6g (0.2mol) of maleic anhydride (MA, 98g/mol) are placed in the reactor , Blow in nitrogen, stir, heat to 80°C, add 3.8 g of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitation with 1500 g of methanol In the kettle, stir at high speed to precipitate solids, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g). The yield is 98.2%, which is recorded as BBMO-1.

Example Embodiment

[0044] Example 2

[0045] 73.2 g (0.2 mol) 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366g/mol), 1460 g o-cresol, 52.0 g (0.1 mol) 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA, 520g/mol) and 19.6g (0.2mol) of maleic anhydride (MA, 98g/mol) are placed in the reactor , Blow in nitrogen, stir, heat to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, then cool to 60°C, pour the reactants into 2000 grams of ethanol and 920 grams In the precipitator for ethylene glycol monomethyl ether, stir at high speed to precipitate solids, filter, and vacuum dry at 80°C for 10 hours to obtain 313.4 g of imide oligomer (theoretical output: 314.0 g), with a yield of 99.8%. Denoted as BBMO-2.

Example Embodiment

[0046] Example 3

[0047] 1.0g 4,4'-diamino-4”-hydroxytriphenylmethane (DAHTM), 20.0g ECC202 epoxy resin, 20.0g 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidol Ester epoxy resin, 15.0 g CE793 epoxy resin and 45.0 g N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoro Put the propane epoxy resin into the reactor, stir and mix for 0.5 hour at 100°C, add 2.0 g of BBMO-2 imide oligomer and continue to stir and react for 1 hour, then add 3.0 g of 3-aminopropyl trimethoxy The silane was stirred and reacted for 5 minutes, cooled to room temperature, and then 20.0 grams of 1,8-diaza-bicyclo[5.4.0]undecene-7 and 30.0 grams of hexahydrophthalic anhydride were added, stirred and mixed uniformly to obtain 156.0 grams of DAHTM type containing Silicon epoxy imide base resin, denoted as M-1.

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Description & Claims & Application Information

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Classification and recommendation of technical efficacy words

Good viscosity controllability
Simple preparation process

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Environmentally friendly Excellent overall performance Imide Polyresin Copper Metal Glass fiber Silicon

DAHTM type silicon-containing epoxy imide matrix resin and preparing method thereof

AI-Extracted Technical Summary

Problems solved by technology

Abstract

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Examples

Example Embodiment

Example Embodiment

Example Embodiment

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Description & Claims & Application Information

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