YASI (bis(gamma-aminopropyl) polydimethyl siloxane) siliceous epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, realize industrialized production, and simple preparation process Effect

Inactive Publication Date: 2016-12-14
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • YASI (bis(gamma-aminopropyl) polydimethyl siloxane) siliceous epoxy imide matrix resin and preparation method thereof
  • YASI (bis(gamma-aminopropyl) polydimethyl siloxane) siliceous epoxy imide matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0048] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80° C. for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0050]Mix 1.0 g of bis(γ-aminopropyl) polydimethylsiloxane (YASI), 20.0 g of N,N,O-triglycidyl m-aminophenol epoxy resin, 30.0 g of 4,5-epoxy Diglycidyl cyclohexane-1,2-dicarboxylate epoxy resin, 20.0 g CE793 epoxy resin, and 30.0 g N,N,N',N'-tetraglycidyl-2,2-bis[4- (4-Aminophenoxy)phenyl]hexafluoropropane epoxy resin was put into the reaction kettle, stirred and mixed for 0.5 hours at 100°C, then added 2.0 g of BBMO-2 imide oligomer and continued to stir for 1 hour , followed by adding 3.0 g of 3-aminopropyltrimethoxysilane and stirring the reaction for 5 minutes, cooling to room temperature, then adding 10.0 g of 1,8-diaza-bicyclo[5.4.0]undecene-7, 5.0 g of N , N-dimethyl-p-methylaniline and 35.0 grams of methyltetrahydrophthalic anhydride were stirred and mixed uniformly to obtain 156.0 grams of YASI type silicon-containing epoxy imide matrix resin, denoted as M-1.

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Abstract

The invention relates to a YASI (bis(gamma-aminopropyl) polydimethyl siloxane) siliceous epoxy imide matrix resin and a preparation method thereof. The matrix resin is composed of YASI, an epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparation method comprises the following steps: (1) preparing the imide oligomer; and (2) adding the YASI and epoxy resin into a reaction kettle, stirring and mixing to react, adding the imide oligomer, continuing stirring to react, adding the 3-aminopropyl trialkoxysilane, stirring to react, adding the curing agent, and uniformly stirring and mixing. The resin can be widely used for bonding metals (such as steel, copper, aluminum and the like) and substrates (ceramic, glass, resin-base composite materials and the like), and preparing glass fibers, aramid fibers and carbon-fiber-reinforced polymer composite materials, and thus, has favorable industrialization prospects.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a YASI silicon-containing epoxyimide matrix resin and its preparation method. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The curing of e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/12
CPCC08G73/125
Inventor 虞鑫海吴倩周志伟
Owner DONGHUA UNIV
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