Alpha-cyanogroup-beta-ethyl ethoxyacrylate modified epoxy resin adhesive and preparation method thereof

A technology of ethoxylated ethyl acrylate and epoxy acrylate, which is applied in the field of epoxy resin adhesive and its preparation, can solve the problems of high cost, high price and unfavorable large-scale application of polyetherimide resin, and achieve Strong hydrophobicity, convenient operation and good application prospects

Inactive Publication Date: 2013-04-03
DONGHUA UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherim

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Mix 50.0 grams of E-51 epoxy resin, 50.0 grams of TDE-85 epoxy resin, 30.0 grams of HPEI phenolic hydroxyl-containing polyetherimide and 30.0 grams of carboxyl-terminated nitrile rubber, stir and react at 60 ° C for 20 minutes, add 80.0 grams of bisphenol A type epoxy acrylate resin, 20.0 grams of bisphenol A type epoxy methacrylate resin and 20.0 grams of α-cyano-β-ethoxy ethyl acrylate, stirred and mixed evenly to obtain A component ;

[0032] Mix 65.0 grams of polyamide 650 resin, 10.0 grams of 3,3'-dimethyl-4,4'-diamino-dicyclohexylmethane and 5.0 grams of 2-ethyl-4-methylimidazole, stir well, that is is the B component;

[0033] When in use, mix components A and B evenly to obtain an α-cyano-β-ethoxy ethyl acrylate modified epoxy resin adhesive, which is designated as EAN-1.

[0034]Take an appropriate amount of α-cyano-β-ethoxyethyl acrylate modified epoxy resin adhesive of EAN-1, and evenly spread it on a standard stainless steel test piece, stack it, clamp it,...

Embodiment 2

[0040] Mix 50.0 grams of E-51 epoxy resin, 50.0 grams of E-44 epoxy resin with 15.0 grams of amino-terminated nitrile rubber and 15.0 grams of carboxyl-terminated nitrile rubber, and stir and react at 80°C for 15 minutes, then add 50.0 grams of bisphenol A Type epoxy acrylate resin and 5.0 grams of α-cyano-β-ethoxy ethyl acrylate, stirred and mixed uniformly to obtain A component;

[0041] Mix 5.0 grams of polyamide 650 resin, 2.0 grams of methyltetrahydrophthalic anhydride, 8.0 grams of 3,3'-dimethyl-4,4'-diamino-dicyclohexylmethane and 15.0 grams of DMP-30, stir well, That is the B component;

[0042] When in use, mix components A and B evenly to obtain an α-cyano-β-ethoxy ethyl acrylate modified epoxy resin adhesive, which is designated as EAN-2.

[0043] Take an appropriate amount of α-cyano-β-ethoxy ethyl acrylate modified epoxy resin adhesive of EAN-2, and evenly spread it on a standard stainless steel test piece, stack, clamp, and put it into a blast oven for curing :...

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PUM

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Abstract

The invention relates to an alpha-cyanogroup-beta-ethyl ethoxyacrylate modified epoxy resin adhesive and a preparation method thereof. The adhesive comprises the following components: epoxy resin, epoxy ester resin, activity flexibilizer, alpha-cyanogroup-beta-ethyl ethoxyacrylate and a curing agent at a mass ratio of 100:(100-50): (60-30): (5-20): (30-80). The preparation method comprises the following steps that the epoxy resin and the activity flexibilizer are mixed, react at 60-80 DEG C for 15-20min, then are added with the epoxy ester resin and alpha-cyanogroup-beta-ethyl 3-ethoxyacrylate, and stirred and mixed uniformly, and a component A is obtained; the curing agent is a component B; and in a using process, the component A and the component B are mixed uniformly, and the adhesive is obtained. The adhesive is high in bonding strength, excellent in combination property, solvent-free and environment-friendly, can be used for bonding base materials such as metal, glass and ceramic, and has a good application prospect.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparation thereof, in particular to an α-cyano-β-ethoxy ethyl acrylate modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is the main component of structural adhesives One; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Good stability performance: the curing of epo...

Claims

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Application Information

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IPC IPC(8): C09J163/10C08G59/17
Inventor 虞鑫海黄斌全虞敷扬刘万章陈吉伟
Owner DONGHUA UNIV
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