4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof

A technology of diaminophenoxy and epoxy adhesives, applied in the direction of online phenolic epoxy resin adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of high cost, high price, and great disadvantages of polyetherimide resins. Large-scale promotion and application, etc., to achieve the effect of strong hydrophobicity, convenient operation, and good application prospects

Inactive Publication Date: 2013-06-05
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof
  • 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Preparation of component A

[0046] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 23.1 g (0.05 mol) of 4,4'- Put bis(2,4-diaminophenoxy)diphenyl sulfone into a reaction kettle, heat up to 50°C, and stir for 2 hours to obtain 123.1 g of a homogeneous and transparent copolymer, designated as A1.

[0047] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 18.5 g (0.04 mol) of 4,4'- Put bis(2,4-diaminophenoxy)diphenyl sulfone into a reaction kettle, heat up to 90°C, and stir for 0.5 hour to obtain 118.5 g of a homogeneous and transparent copolymer, designated as A2.

[0048] Diglycidyl 100 g of 4,5-epoxycyclohexane-1,2-dicarboxylate epoxy resin (epoxy value 0.85) was mixed with 21.7 g (0.047 mol) of 4,4'-bis(2,4 -diaminophenoxy)diphenyl sulfone was put into a reaction kettle, heated to 60° C., stirred and reacted for 1 hour to obtain 121.7 g of a homogeneous and transpar...

Embodiment 2

[0052] Preparation of Component B

[0053] At room temperature, add 46.2 grams (0.1 moles) of 4,4'-bis(2,4-diaminophenoxy)diphenyl sulfone and 850 grams of N,N-dimethylacetamide into the reaction kettle, stir to dissolve completely After that, 104 g (0.2 mol) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and 64.4 g (0.2 mol) of 3,3',4,4' were added -Tetracarboxybenzophenone dianhydride, stirred and reacted for 0.5 hour, obtained 1064.6 grams of homogeneous transparent solution, added 170 grams of toluene, heated to reflux, and carried out reflux water separation reaction, the temperature was 100 ° C, and the reaction time was 2 hours. After the reaction is completed, separate part of the organic solvent so that its solid content is in the range of 15%-30%, which is recorded as B1.

[0054] At room temperature, mix 46.2 g (0.1 mol) of 4,4'-bis(2,4-diaminophenoxy)diphenyl sulfone with 310 g of N,N-dimethylacetamide and 350 g of N-methyl- Add 2-pyrrolidone into ...

Embodiment 3

[0058] Preparation of 4,4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature resistant epoxy adhesive

[0059] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 4,4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature resistant The epoxy adhesive is denoted as HTEA-p, where p is a natural number, and the specific formula is shown in Table 1.

[0060] Table 14, 4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature resistant epoxy adhesive formula table unit: gram

[0061] Component

[0062] HTEA-8

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Abstract

The invention relates to a 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive is composed of a component A and a component B in a mass ratio of 1:(1-2), wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamido phenoxy)diphenylsulphone and epoxy resin; and the component B is a homogeneous-phase transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and diphenylsulphone. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparation thereof, in particular to a 4,4'-bis(2,4-diaminophenoxy)diphenylsulfone type high temperature resistant epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/08C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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