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1,4-di(2,4-diamino phenoxy) benzenoid form high-temperature epoxy adhesive and preparation method thereof

A diaminophenoxy, epoxy adhesive technology, applied in the direction of in-line phenolic epoxy resin adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of high cost, high price and great disadvantages of polyetherimide resin. Large-scale promotion and application, etc., to achieve the effect of strong hydrophobicity, convenient operation and good application prospects

Inactive Publication Date: 2014-07-02
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 1,4-di(2,4-diamino phenoxy) benzenoid form high-temperature epoxy adhesive and preparation method thereof
  • 1,4-di(2,4-diamino phenoxy) benzenoid form high-temperature epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Preparation of component A

[0046] Mix 80 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8), 20 grams of 1,3-diglycidyl meta Hydroquinone (epoxy value 0.8) and 16.1 g (0.05 moles) of 1,4-bis(2,4-diaminophenoxy)benzene were placed in a reaction kettle, heated to 90°C, and stirred for 0.5 hours , to obtain 116.1 g of a homogeneous and transparent copolymer, denoted as A1.

[0047] Mix 70 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8), 30 grams of 1,3-diglycidyl meta Hydroquinone (epoxy value 0.8) and 12.9 grams (0.04 moles) of 1,4-bis(2,4-diaminophenoxy)benzene were placed in a reaction kettle, heated to 70°C, and stirred for 1 hour , Obtain 112.9 grams of homogeneous and transparent copolymer, denoted as A2.

[0048] Mix 100 grams of 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin (epoxy value 0.85) with 15.1 grams (0.047 moles) of 1,4-bis(2,4- Diaminophenoxy)benzene w...

Embodiment 2

[0052] Preparation of Component B

[0053] At room temperature, add 32.2 grams (0.1 moles) of 1,4-bis(2,4-diaminophenoxy)benzene and 600 grams of N,N-dimethylacetamide into the reaction kettle, stir and dissolve completely, then add 208 grams (0.4 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, stirred for 0.5-1 hour to obtain 840.2 grams of homogeneous transparent solution, added 300 grams Toluene is heated to reflux, and the reflux water separation reaction is carried out. The temperature is 100 ° C, and the reaction time is 3 hours. After the reaction is completed, part of the organic solvent is separated so that the solid content is in the range of 15%-30%, which is recorded as B1.

[0054] At room temperature, 32.2 grams (0.1 moles) of 1,4-bis(2,4-diaminophenoxy)benzene and 215 grams of N,N-dimethylacetamide and 400 grams of N-methyl-2-pyrrolidone Add it into the reaction kettle, after stirring and dissolving completely, add 104 grams (0.2 moles) o...

Embodiment 3

[0057] Preparation of 1,4-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive

[0058] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 1,4-bis(2,4-diaminophenoxy)benzene-type high temperature resistant epoxy adhesives , recorded as HTEA-p, p is a natural number, and the specific formula is shown in Table 1.

[0059] Table 1 Unit: Gram

[0060] Component

[0061] HTEA-6

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Abstract

The invention relates to 1,4-di(2,4-diamino phenoxy) benzenoid form high-temperature epoxy adhesive and a preparation method thereof. The adhesive consists of a component A and a component B in a mass ratio of 1:1-2, wherein the component A is a co-polymer formed by the reaction between 1,4-di(2,4-diamino phenoxy) benzene and epoxy resin; and the component B is a homogeneous transparent solution which has the solid content being 15-30 percent and is formed by the reaction between 1,4-di(2,4-diamino phenoxy) benzene and binary acid anhydride in strong polar aprotic organic solvent and toluene. The preparation method comprises the following steps of stirring and uniformly mixing the component A and the component B at room temperature in a mass ratio of 1:1-2. The preparation process is simple, and the adhesive is excellent in comprehensive performance, so that the adhesive can be widely applied to adhesion among steel, copper, aluminum and other metals, as well as ceramic, glass, resin-based composite materials and other base materials, and has an excellent industrial prospect.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparation thereof, in particular to a 1,4-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Good...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C08G59/50C08G59/20C08G69/32
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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