A kind of dahtm type silicon-containing epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, simple preparation process, and environmental friendliness Effect

Inactive Publication Date: 2018-08-14
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • A kind of dahtm type silicon-containing epoxy imide matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0045] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80°C for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0047]1.0 g of 4,4'-diamino-4"-hydroxytriphenylmethane (DAHTM), 20.0 g of ECC202 epoxy resin, 20.0 g of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl Ester epoxy resin, 15.0 g CE793 epoxy resin, and 45.0 g N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoro Put the propane epoxy resin into the reaction kettle, stir and mix at 100°C for 0.5 hours, then add 2.0 grams of BBMO-2 imide oligomer and continue to stir for 1 hour, then add 3.0 grams of 3-aminopropyltrimethoxy The silane was stirred and reacted for 5 minutes, cooled to room temperature, and then 20.0 grams of 1,8-diaza-bicyclo[5.4.0]undecene-7 and 30.0 grams of hexahydrophthalic anhydride were added, stirred and mixed uniformly to obtain 156.0 grams of DAHTM containing Silicon epoxy imide matrix resin, denoted as M-1.

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Abstract

The invention relates to DAHTM type silicon-containing epoxy imide matrix resin and a preparing method thereof. The matrix resin is prepared from 4,4'-diamido-4''-hydroxy triphenylmethane (DAHTM), epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparing method includes the following steps that 1, the imide oligomer is prepared; 2, DAHTM and epoxy resin are put into a reaction kettle, stirred and mixed for reaction, then the imide oligomer is added, the mixture continues to be stirred for reaction, then 3-aminopropyl trialkoxysilane is added and stirred for reaction, the curing agent is added and stirred to be mixed uniformly to obtain the matrix resin. The matrix resin can be widely applied to adhesion between metal such as steel, copper and aluminum and a base material such as ceramic, glass and a resin-based composite material and used for preparing glass fiber, aramid fiber and carbon fiber reinforced composite and has good industrial prospects.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a DAHTM silicon-containing epoxyimide matrix resin and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The curi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12
CPCC08G73/125
Inventor 虞鑫海周志伟
Owner DONGHUA UNIV
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