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A kind of 14bdapb type silicon-containing epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, realize industrialized production, and be environmentally friendly Effect

Inactive Publication Date: 2018-08-03
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • A kind of 14bdapb type silicon-containing epoxy imide matrix resin and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0044] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0046] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80° C. for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0048]Mix 1.0 g of 1,4-bis(2,4-diaminophenoxy)benzene (14BDAPB), 30.0 g of 1,3-diglycidyl resorcinol, 30.0 g of CE793 epoxy resin, and 40.0 g of N, N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane epoxy resin was placed in a reaction kettle, stirred and mixed for 0.5 hours at 100°C After that, add 2.0 grams of BBMO-1 imide oligomer and continue to stir for 1 hour, then add 3.0 grams of 3-aminopropyltrimethoxysilane and stir for 5 minutes, cool to room temperature, and then add 8.0 grams of 1,8- Diaza-bicyclo[5.4.0]undecene-7 and 42.0 grams of tungoleic anhydride were stirred and mixed uniformly to obtain 156.0 grams of 14BDAPB type silicon-containing epoxyimide matrix resin, which was denoted as M-1.

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Abstract

The invention relates to 14BDAPB type silicon-containing epoxy imide matrix resin and a preparation method thereof. The matrix resin is prepared from 1,4-bis(2,4-diaminophenoxy)benzene 14BDAPB, epoxy resin, 3-aminopropyl trialkoxy silane, an imide oligomer and a curing agent. The preparation method comprises the following steps: (1) preparing the imide oligomer; (2) putting the 1,4-bis(2,4-diaminophenoxy)benzene and the epoxy resin into a reaction kettle, stirring and mixing for reacting; after that, adding the imide oligomer and continuously stirring for reacting; then adding the 3-aminopropyl trialkoxy silane and stirring for reacting; and adding the curing agent and stirring and mixing uniformly to obtain the 14BDAPB type silicon-containing epoxy imide matrix resin. The 14BDAPB type silicon-containing epoxy imide matrix resin provided by the invention can be widely applied to the bonding of metals such as steel, cooper and aluminum and base materials such as ceramic, glass and resin-based composites and the preparation of glass fiber, aramid fiber and carbon fiber reinforced composites, and has good industrialization prospect.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a 14BDAPB silicon-containing epoxyimide matrix resin and its preparation method. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The curing o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12
CPCC08G73/125
Inventor 虞鑫海周志伟
Owner DONGHUA UNIV
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