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Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive

A technology of epoxy resin and polyurethane, applied in modified epoxy resin adhesives, polyurea/polyurethane adhesives, adhesives, etc., can solve the problem of slow curing speed and so on

Inactive Publication Date: 2011-06-01
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing speed of polyurethane modified epoxy adhesive is slow. In order to increase the reaction speed of photocuring, unsaturated vinyl groups can be introduced into the molecular chain, so that the curing speed can be increased by free radical polymerization.

Method used

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  • Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive
  • Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive
  • Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The preparation of embodiment 1 polyurethane-acrylic acid-epoxy resin photosensitive prepolymer (A)

[0027] 1) Preparation of low-viscosity epoxy acrylate prepolymer

[0028] In a clean 500ml three-necked flask, add epoxy resin E-54, ethylene glycol, N, N-dimethylbenzylamine and a certain amount of toluene under electric stirring, wherein, E-54 and ethylene glycol The equivalent ratio of N,N-dimethylbenzylamine accounts for 0.25wt% of the amount of E-54. The reaction was carried out at 110° C. for 3 hours. Cool to 80° C., remove the solvent under a vacuum of 2 to 5 kPa, and weigh the intermediate product after cooling to room temperature.

[0029] Under continuous stirring, add 0.02wt% p-hydroxyanisole and a certain amount of toluene to the above-mentioned reaction product mixture, gradually heat up to 105-110°C, add dropwise the mixed solution of tetrabutylammonium bromide and acrylic acid, at 30 Added in minutes. Wherein, tetrabutylammonium bromide accounts for 1...

Embodiment 2

[0033] The preparation of embodiment 2 polyurethane-acrylic acid-epoxy resin photosensitive prepolymer (B)

[0034] 1) Preparation of low-viscosity epoxy acrylate prepolymer

[0035] Replace E-54 in Example 1 with epoxy resin F-51, replace ethylene glycol with 1,3-propanediol, replace N,N-dimethylbenzylamine with triethanolamine, and react at 110° C. for 2.5 hours.

[0036] 2) Preparation of prepolymer of polyurethane acrylate resin

[0037] Replace polyethylene glycol (200) in embodiment 1 with dipropylene glycol, replace TDI with HDI, other conditions are with embodiment 1.

Embodiment 3

[0038] The preparation of embodiment 3 polyurethane-acrylic acid-epoxy resin photosensitive prepolymer (C)

[0039] 1) Preparation of low-viscosity epoxy acrylate prepolymer

[0040] Epoxy resin 711 (Tianjin Institute of Synthetic Materials) was used to replace E-54 in Example 1, and other conditions were the same as Example 1.

[0041] 2) Preparation of prepolymer of polyurethane acrylate resin

[0042] Replace TDI in embodiment 1 with HMDI, replace hydroxyethyl acrylate with hydroxypropyl acrylate, and other conditions are the same as embodiment 1.

[0043] Preparation of Polyurethane-Acrylic-Epoxy Resin Photocuring Adhesive (UV Adhesive) Composition

[0044] The prepolymers of the above-mentioned examples 1 to 3 were added with 0.3wt% of "1173", 0.1wt% of "819", 0.1wt% of "EHA" (N, N-dimethyl 4-dimethylaminobenzene 2-ethylhexyl formate), 15wt% of 1,6-hexanediol diacrylate, 0 to 15wt% of n-hexyl acrylate (the amount added depends on the viscosity of the prepolymer mixture...

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Abstract

The invention relates to a novel polyurethane-acrylic acid-epoxy resin photosensitive pre-polymer, a synthesis method of the pre-polymer, a high-performance ultraviolet (UV) cured polyurethane modified acrylic acid epoxy resin adhesive prepared from the pre-polymer and application of the UV cured adhesive to bonding of a nylon membrane material and a polyurethane or modified polyurethane elastic body. A method for preparing the photosensitive pre-polymer comprises the following steps of: 1, synthesizing a lower-viscosity epoxy acrylic ester pre-polymer; 2, preparing a pre-polymer of urethane acrylate resin; and 3, mixing or reacting the two pre-polymers in a certain ratio so as to obtain the polyurethane-acrylic acid-epoxy resin photosensitive pre-polymer. A polyurethane-acrylic acid-epoxy resin UV cured adhesive is further prepared by adding a photoinitiator, a photosensitive diluent, a light curing crosslinking agent, other necessary aids and the like.

Description

field of invention [0001] The invention relates to a high-performance modified epoxy resin light-curing adhesive, a method for preparing the light-curing adhesive and its application in bonding nylon films or polyurethane elastomer materials. More specifically, the present invention relates to a kind of synthesis method of novel photocuring (UV curing) polyurethane-acrylic acid-epoxy resin photosensitive prepolymer, the synthesis method of adhesive, and its application in bonding nylon film material, polyurethane or improved Applications in permanent polyurethane elastomers. Background of the invention [0002] Ultraviolet curing (UV curing) technology is characterized by environmental protection and fastness. Compared with thermal curing technology, the advantages of UV curing technology are fast and low energy consumption. Solvent-based adhesives usually require an inert solvent, which is a volatile organic compound, and the curing reaction speed is slow at room temperatu...

Claims

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Application Information

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IPC IPC(8): C08G59/17C08G59/16C08G18/67C08L63/10C08L75/16C09J163/10C09J175/16B32B7/12
Inventor 朱立群张红梅何涛陈贻炽李卫平刘惠丛
Owner BEIHANG UNIV
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