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156 results about "Hexyl acrylate" patented technology

Method for preparing hard polyvinyl chloride plastic toughening and reinforcing agent

The invention discloses a method for preparing a hard polyvinyl chloride plastic toughening and reinforcing agent. The method mainly comprises the following steps: (1) preparation and ultrasonic auxiliary dispersion for inorganic powder slurry, namely mixing inorganic mineral powder calcium carbonate (or calcium sulfate, talc powder, mica powder or kaolin) and ethylene glycol methyl ether solvent, and heating, stirring and ultrasonically dispersing the mixed slurry to obtain powder slurry; (2) coupling modification for inorganic mineral powder, wherein a silane coupling agent adopted by the coupling modification is one of vinyl triethoxy silane and vinyl trimethoxy silane; (3) multilayer modification for organic monomers of the inorganic mineral powder, wherein a soft organic monomer adopted by the inorganic mineral powder modification is one of ethyl acrylate, butyl acrylate and ethyl hexyl acrylate; and a hard organic monomer is one of styrene, methyl methacrylate and vinyl acetate, acrylonitrile and acrylic amide; and (4) post treatment for the modified powder. The method is suitable for preparing the hard polyvinyl chloride plastic toughening and reinforcing agent.
Owner:EAST CHINA JIAOTONG UNIVERSITY

Thermal conductive adhesive and substrate-free high-thermal-conductivity double-faced adhesive tape made of thermal conductive adhesive

The invention relates to the technical field of adhesives, in particular to a thermal conductive adhesive and a substrate-free high-thermal-conductivity double-faced adhesive tape made of the thermalconductive adhesive. The thermal conductive adhesive is prepared from the following component raw materials in parts by weight: 80 to 120 parts of acrylate resin, 20 to 50 parts of thermal conductivedispersion liquid, and 1 to 5 parts of isocyanate crosslinking agent, wherein the acrylate resin is prepared from an acrylate monomer, an initiator, a solvent, rosin pentaerythritol ester and rosin sorbitol ester; the acrylate monomer is prepared from butyl acrylate, diethyl hexyl acrylate, hydroxyethyl acrylate, methyl methacrylate and acrylic acid phosphate; the solvent is ethyl acetate; the initiator is azodiisobutyronitrile or dicumyl peroxide. The substrate-free high-thermal-conductivity double-faced adhesive tape comprises the thermal conductive adhesive and a first release liner and a second release liner respectively arranged on two faces of the thermal conductive adhesive. After a thermal conductive filler is added, the thermal conductive adhesive provided by the invention is highin viscidity and firm to adhere at high temperature, and has a higher thermal conductivity coefficient under the condition of adding the same proportion of thermal conductive filler.
Owner:DONGGUAN TARRY ELECTRONICS
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