Water-soluble acrylic-modified epoxy organic silicon resin and preparation method and application

A water-soluble acrylic, epoxy silicone technology, applied in the direction of coating, can solve the problems of low cost advantage, low water ratio of emulsion, etc., and achieve the effect of reducing production cost, excellent brightness, and not easy to delaminate

Inactive Publication Date: 2017-08-18
佛山市顺德区地缘电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a water-soluble acrylic modified epoxy silicone resin and its preparation method and application, aiming to solve the problem of the existing water-soluble epoxy resin. low cost advantage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] 20 parts of methyl methacrylate, 40 parts of butyl acrylate, 7 parts of octyl acrylate, 3 parts of hydroxypropyl acrylate, 1.5 parts of fumed silica, 7 parts of methacrylic acid, 3 parts of acrylic acid, 2 parts of silicone oil, Mix 2.5 parts of benzoyl peroxide evenly to obtain a mixed solution; 8 parts of epoxy resin, 30 parts of propylene glycol methyl ether, 1.5 parts of fumed silicon dioxide and 3 parts of tert-butyl peroxide-2-ethylhexanoate, heat to dissolve , when the temperature rises to 120 degrees Celsius, start to stir and keep warm for half an hour; then evenly drop the mixed solution under the condition of 100 degrees Celsius (3-5 hours to complete the drop), keep warm for 1 hour; add 2.5 parts of benzoyl peroxide and propylene glycol butyl A mixed solution of 15 parts of ether, keep warm at the same temperature for 1 hour; take a sample, add amine water, wait until the sample can be fully dissolved in water, then stop the reaction and start to cool down; w...

Embodiment 2

[0075] 25 parts of methyl methacrylate, 42 parts of butyl acrylate, 8 parts of octyl acrylate, 5 parts of hydroxypropyl acrylate, 0.5 parts of fumed silica, 8 parts of methacrylic acid, 4 parts of acrylic acid, and 3 parts of silicone rubber , 6 parts of benzoyl peroxide, and 30 parts are mixed evenly to obtain a mixed solution;

[0076] 10 parts of epoxy resin, 32 parts of propylene glycol methyl ether, 0.5 parts of fumed silicon dioxide and 4 parts of tert-butyl peroxybenzoate are heated to dissolve, and when the temperature rises to 120 degrees Celsius, start stirring and keep warm for half an hour;

[0077] Then evenly drop the mixed solution under the condition of 105 degrees centigrade (3 hours dropwise), and keep warm for 1 hour; add the mixed solution of 6 parts of benzoyl peroxide and 20 parts of propylene glycol butyl ether, and then keep warm for 1 hour at the same temperature; Take a sample, add amine water, wait until the sample can be fully dissolved in water, st...

Embodiment 3

[0081] 30 parts of methyl methacrylate, 45 parts of butyl acrylate, 10 parts of octyl acrylate, 7 parts of hydroxypropyl acrylate, 10 parts of methacrylic acid, 1 part of fumed silica, 5 parts of acrylic acid, polydimethyl Mix 4 parts of siloxane and 7 parts of benzoyl peroxide evenly to obtain a mixed solution; 12 parts of epoxy resin, 35 parts of propylene glycol methyl ether, 1 part of fumed silicon dioxide and 5 parts of dicumyl peroxide, heat and dissolve , when the temperature rises to 120 degrees Celsius, start stirring and keep warm for half an hour; then evenly drop the mixed solution at 110 degrees Celsius (2-3 hours to complete the drop), keep warm for 1 hour; add 7 parts of benzoyl peroxide and diethyl peroxide A mixed solution of 20 parts of glycol ether is kept at the same temperature for 1 hour; sampling is added to amine water, and the reaction can be terminated and the temperature is lowered when the sample can be fully dissolved in water; when the temperature ...

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PUM

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Abstract

The invention discloses water-soluble acrylic-modified epoxy organic silicon resin and a preparation method and application. The water-soluble acrylic-modified epoxy organic silicon resin is prepared from the following components in parts by weight: methyl methacrylate, butyl acrylate, ethyl hexyl acrylate, hydroxypropyl acrylate, methacrylic acid, acrylic acid, silanoxide, benzoyl peroxide, fumed silica, epoxy resin, an initiator, propylene glycol monomethyl ether, an ether solvent and a neutralizer. The water-soluble acrylic-modified epoxy organic silicon resin and water can be mixed and dissolved at any ratio, so that the water-soluble acrylic-modified epoxy organic silicon resin is green, clean and free of pollution, meanwhile, the production cost is greatly reduced, and a water-based coating prepared from the resin is stable in storage and also has excellent brightness, hardness and adhesive force.

Description

technical field [0001] The invention relates to the field of water-based coatings, and mainly relates to a water-soluble acrylic modified epoxy silicone resin, a preparation method and an application thereof. Background technique [0002] Solvent-based coatings have become the mainstream coating products in the market due to their superior brightness, hardness, adhesion and other characteristics, but most of them use organic solvents as dispersants, the cost remains high, and the volatile organic compounds (VOC) produced are seriously polluted At the same time, there are unsafe factors such as flammable and explosive, so green and environmentally friendly coatings are the development trend of the coatings industry. Water-based coatings use water-soluble resins as film-forming materials. Most of the water-soluble epoxy resins on the market are in the form of emulsions, which have the following disadvantages: 1. The proportion of water added to the emulsion is not high, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/12C08F283/10C08F220/14C08F220/18C08F220/28C08F220/06C09D151/08
CPCC09D151/08C09D151/085C08F283/10C08F283/12C08F220/1808C08F220/281C08F220/1804
Inventor 张孟强
Owner 佛山市顺德区地缘电子科技有限公司
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