UV moisture dual-curing type acrylate pressure-sensitive adhesive and preparation method thereof

A technology of acrylate and ester acrylate, which is used in the field of synthesis and preparation of acrylate pressure-sensitive adhesives. It can solve the problems of low initial adhesion and peel strength, poor mechanical properties, and weak cohesion, and achieve less volatile matter and comprehensive performance. Well-balanced, low-cost effect

Active Publication Date: 2015-10-14
深圳沃尔提莫电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of improving the performance of pressure-sensitive adhesives, especially for the bonding of TP and shell brackets, it is the production and research of pressure-sensitive adhesive products with comprehensive performance indicators such as good initial adhesion, adhesion, and holding power. The ideal goal, and this balance of comprehensive properties is often difficult to achieve, for example, acrylate...

Method used

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  • UV moisture dual-curing type acrylate pressure-sensitive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Mix hydroquinone monomethyl ether and diglycidyl phthalate evenly, heat to dissolve, raise the temperature to 85°C, add acrylic acid containing tetraethylammonium bromide dropwise, keep warm, and react until the acid value is less than 3mgKOH / g stops, and the epoxy acrylate monoester containing hydroxyl is obtained after the reaction is completed. N 2 Under a protective atmosphere, after dehydrating hexanediol, add isophorone diisocyanate containing dibutyltin dilaurate dropwise to it while stirring, heat to 60°C for 4 hours after the dropwise addition, and cool to room temperature after the reaction is completed. Obtain an isocyanate-terminated oligomer; then continue to add dropwise the prepared hydroxyl-containing epoxy acrylate monoester, after the dropwise addition, heat to 85°C for 3 hours, stop heating and lower the temperature; then carry out low-pressure distillation on the obtained product, After removing low-molecular substances, the desired epoxy-modified ...

Embodiment 2

[0051] After mixing 5 parts by weight of 2-ethylhexyl acrylate monomer and 0.05 parts by weight of azobisisobutyronitrile, the temperature was raised to 65 ° C, stirred at a speed of 120 rad / min and nitrogen was introduced, and then 10 parts by weight of acrylic acid was added dropwise A mixture of 2-ethylhexyl ester monomer and 0.05 parts by weight of azobisisobutyronitrile, after the dropwise addition, 0.05 parts by weight of azobisisobutyronitrile is added, the reaction is continued for 2 to 4 hours, cooled to room temperature and discharged to obtain The viscosity of the first prepolymer is (25° C.) 7000-8000 mPa·s.

[0052] 10 parts by weight of butyl methacrylate monomer, 10 parts by weight of hexyl acrylate monomer, 1 part by weight of urethane acrylate (25°C viscosity 7cps), 5 parts by weight of 2-ethylhexyl acrylate monomer and After mixing 0.2 parts by weight of azobisisobutyronitrile, the temperature was raised to 65° C., stirred at a speed of 120 rad / min and nitrog...

Embodiment 3

[0056] Mix 30 parts by weight of 2-ethylhexyl acrylate monomer and 0.005 parts by weight of benzoin butyl ether, heat to 75°C, use a maximum wavelength of 250-400nm, and an intensity of 1-2mW / cm 2 When the viscosity of the mixture reaches 3500-4500mPa·s, add 7 parts by weight of hydrogenated rosin resin and stir, continue mixing for 2-4 hours, and then stand at room temperature for 20-30 hours to obtain the first prepolymer. It is (25°C) 6000-6500mPa·s.

[0057]10 parts by weight of butyl methacrylate monomer, 18.5 parts by weight of hexyl acrylate monomer, 1.5 parts by weight of urethane acrylate (25°C viscosity 9cps), 10 parts by weight of 2-ethylhexyl acrylate monomer and Mix 0.005 parts by weight of benzoin butyl ether, heat to 75°C, use a maximum wavelength of 250-400nm, and an intensity of 1-2mW / cm 2 The ultraviolet light source is irradiated to carry out the polymerization reaction for 2-4 hours, and then it is left to stand at room temperature for 20-30 hours to obtai...

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Abstract

The invention provides a UV moisture dual-curing type acrylate pressure-sensitive adhesive and a preparation method thereof. The adhesive is prepared by mixing and polymerizing the following components step by step: a (methyl) butyl acrylate monomer and/or a (methyl) ethyl acrylate monomer, a (methyl) acrylic 2-hexyl acetate monomer, a (methyl) methyl acrylate monomer, an N-methylol acrylamide monomer and/or an N-methylol methyl acrylamide monomer, carbamate acrylate, a polyamide type thermoplastic elastomer, rosin resin, epoxy modified polyurethane copolymer and a photoinitiator. The pressure-sensitive adhesive provided by the invention can be particularly suitable for a process for adhering TP to a shell bracket in portable electronic equipment.

Description

technical field [0001] The invention relates to the field of synthesis and preparation of acrylate pressure-sensitive adhesives, in particular to a UV moisture double-curing acrylic acid suitable for bonding electronic products, especially the touch screen (TP) and frame of portable devices such as mobile phones and tablet computers Ester pressure sensitive adhesive. Background technique [0002] In the assembly process of portable electronic devices such as mobile phones and tablet computers, the bonding effect between TP and the shell bracket is one of the key factors that directly affect the operation and maintenance efficiency of mobile phones. At present, most TPs are bonded to the shell bracket by foam glue and hot melt glue. With the development trend of electronic devices towards large screens and narrow borders, existing adhesive products are increasingly exposed to their limitations in the application of bonding electronic devices. Foam glue requires a wide bondi...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J151/00C09J151/08C08F289/00C08F283/00C08F220/18C08F220/14C08F220/58
Inventor 何千舟
Owner 深圳沃尔提莫电子材料有限公司
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