Thermal conductive adhesive and substrate-free high-thermal-conductivity double-faced adhesive tape made of thermal conductive adhesive

Abstract

The invention relates to the technical field of adhesives, in particular to a thermal conductive adhesive and a substrate-free high-thermal-conductivity double-faced adhesive tape made of the thermalconductive adhesive. The thermal conductive adhesive is prepared from the following component raw materials in parts by weight: 80 to 120 parts of acrylate resin, 20 to 50 parts of thermal conductivedispersion liquid, and 1 to 5 parts of isocyanate crosslinking agent, wherein the acrylate resin is prepared from an acrylate monomer, an initiator, a solvent, rosin pentaerythritol ester and rosin sorbitol ester; the acrylate monomer is prepared from butyl acrylate, diethyl hexyl acrylate, hydroxyethyl acrylate, methyl methacrylate and acrylic acid phosphate; the solvent is ethyl acetate; the initiator is azodiisobutyronitrile or dicumyl peroxide. The substrate-free high-thermal-conductivity double-faced adhesive tape comprises the thermal conductive adhesive and a first release liner and a second release liner respectively arranged on two faces of the thermal conductive adhesive. After a thermal conductive filler is added, the thermal conductive adhesive provided by the invention is highin viscidity and firm to adhere at high temperature, and has a higher thermal conductivity coefficient under the condition of adding the same proportion of thermal conductive filler.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a heat-conducting adhesive and a substrate-free high-thermal-conductivity double-sided adhesive produced therefrom. Background technique [0002] With the densification and miniaturization of integrated circuits, electronic components become smaller and operate at higher speeds, and the heat dissipation requirements are also higher and higher. In order to dissipate heat from the heat source as soon as possible, we use high thermal conductivity The heat dissipation material transfers heat to the air or other substances, so as to achieve the effect of heat dissipation. At present, the light source is gradually changing from incandescent lamps to LED energy-saving lamps. LED is a solid-state semiconductor component. Different types of LEDs can emit light of different wavelengths from infrared to blue, and from violet to ultraviolet. A large amount of heat is generated during use,...

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Problems solved by technology

[0004] However, the adhesives used in the prior art have the following problems: ①The thermal conductivity is not high, the heat dissipation effect is not good, the specific surface area of ​​the micron-sized thermal conductive filler is not large enough, and the adhesiveness of the tape must be ensured, and excessive thermal conductive fillers cannot be added. It will not form a good heat conduction channel. In addition, the nano-scale heat conduction filler is easy to agglomerate and unevenly dispersed, which also cannot guarantee a good heat conduction channel; ② Adding heat conduction filler will greatly reduce the viscosity of the tape. Risk of degumming. To achieve better thermal conductivity in the adhesive, a higher proportion of thermally conductive filler needs to be added. The filler will dilute the proportion of the adhesive, and most of the thermally conductive fillers are polar substances, which will combine with the polar functional groups of the adhesive to provide a viscous polarity. Sexual functional groups fail, greatly reducing the adhesive performance of the adhesive

At high temperature, the fluidity of the adhesive increases, the viscosity will further decrease, and there will be a risk of poor bonding

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