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Hot melt adhesive composition

A technology of hot-melt adhesives and adhesives, applied in the direction of adhesives, etc., can solve the problems of reducing heat resistance, application viscosity damage, burns, etc.

Inactive Publication Date: 2006-04-12
NAT STARCH & CHEM INVESTMENT HLDG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High temperatures increase operator hazards involving burns and inhalation of residual volatiles
In addition, the use of high temperature requires more energy, which places higher demands on the production facilities
Although adhesive formulations that can be used at temperatures below 300°F (151°C) can be prepared by using low molecular weight components or high wax content, application viscosity may be compromised and adhesive properties may be compromised. Losses such as toughness, heat resistance, and often specific adhesion to the substrate
Although softeners or more random components can be added to improve adhesion, these components reduce the effective heat resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] The adhesive composition of the present invention is prepared by blending the components in the molten state at a temperature above about 120°C, typically above about 150°C, until a homogeneous blend is obtained, usually about 2 hours is sufficient . A variety of blending methods are known in the art, and any method that produces a homogeneous blend will suffice.

[0041]The resulting adhesive is characterized by a viscosity at 120°C of from about 500 cps to about 1750 cps. They can be applied at low temperatures and have excellent adhesive bonds even when exposed to a wide range of temperature conditions. Low temperature application means that the adhesive is applied at a temperature below about 150°C, preferably below about 140°C, more preferably below about 135°C. The adhesive has good heat and cold resistance. High heat resistance refers to the ability to maintain the tearing bond of the fibers at elevated temperatures of about 140°F.

[0042] The hot melt adhes...

Embodiment 1

[0052] Adhesive samples having the compositions shown in Table 1 were prepared.

[0053] sample 1

[0054] Rosin Ester SP

[0055] Adhesive formulations were prepared using the following equipment: a long countertop heating mantle; a single blade agitator shaft; a variable speed motor; a 1 quart volume tin can; and an electronic temperature controller. Adhesives were prepared in 200 gram batches according to the recipe shown in Table 1. The amounts stated in Table 1 refer to parts by weight of each component based on ~100 parts used to prepare the formulation.

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PUM

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Abstract

A low application temperature, high heat resistant hot melt adhesive comprising an ethylene vinyl acetate and / or ethylene 2-ethyl hexyl acrylate polymer having a melt index of at least 550 grams / 10 minutes, a paraffin wax and a rosin derived tackifier.

Description

field of invention [0001] The present invention relates to a low application temperature hot melt adhesive composition having high heat resistance. The adhesive is especially suitable for automatic assembly applications such as the production of boxes, cartons and trays. Background of the invention [0002] Hot melt adhesives (hot melt adhesives, hot melt adhesives, hot melt adhesives) are widely used in a variety of commercial applications, such as product assembly and packaging, including case sealing and carton closing operations. Such hot melt adhesives are applied to the substrate in its molten state and cooled to allow the adhesive layer to set. [0003] Many commercially available hot melt adhesives require temperatures of 350°F (177°C) or higher to ensure complete melting of all components and also to achieve satisfactory application viscosity. The need for such high temperatures is not without its problems. High temperatures increase operator risks involving burn...

Claims

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Application Information

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IPC IPC(8): C09J123/08C08L91/06C08L93/04
CPCC08L93/04C09J123/0853C08L91/06C08L2666/02
Inventor W·K·舒S·M·比尔德特D·古德
Owner NAT STARCH & CHEM INVESTMENT HLDG CORP
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