Conductive silver paste for microelectronic packaging and preparation method thereof

A technology of microelectronic packaging and conductive silver glue, which is applied in the field of conductive glue, can solve the problems of poor impact resistance and conductivity (unstable contact resistance) of glue joints, and achieve the effect of stable contact resistance and strong impact resistance

Inactive Publication Date: 2011-06-08
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, to completely replace alloy solder paste, there are some major obstacles. Among them, under different temperatures and humidity, the conductivity (contact resistance) is unstable and the impact resistance of adhesive joints is poor. It is the application of conductive adhesives in the field of microelectronic assembly. two fatal flaws

Method used

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  • Conductive silver paste for microelectronic packaging and preparation method thereof
  • Conductive silver paste for microelectronic packaging and preparation method thereof
  • Conductive silver paste for microelectronic packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] First, equip each component by the following mass percentages:

[0037] Liquid epoxy resin: 12 parts, using a mixture of bisphenol A diglycidyl ether and bisphenol F diglycidyl ether, and the mass ratio of bisphenol A diglycidyl ether: bisphenol F diglycidyl ether is 2:1 ;

[0038] Diluent: 10 parts, using a mixture of cyclohexyl glycidyl ether and diethylene glycol ethyl ether acetate, and the mass ratio of the two is: 2:1;

[0039] 13 parts of spherical silver powder with a particle size of 3-7 μm, and 57 parts of flake silver powder with a particle size of 5-9 μm;

[0040] Latent curing agent: 1 part, using TH-2833;

[0041] Curing accelerator: 0.3 parts, using organic urea accelerator, such as Dyhard UR200;

[0042] Coupling agent: 1.7 parts, using K-550;

[0043] Defoamer: 1 part, using lecithin;

[0044] Conduction accelerator: 1 part, using β-phenylacrolein;

[0045] Anti-aging agent: 1 part, using TNPP;

[0046] 2 parts of toughening agent, using a self-s...

Embodiment 2

[0049] First, equip each component by the following mass percentages:

[0050] Liquid epoxy resin: 12 parts, using a 1:1 mixture of epoxy acrylic resin and bisphenol A diglycidyl ether;

[0051] Diluent: 10 parts, using a mixture of 1,4 butanediol diglycidyl ether: diethylene glycol ethyl ether acetate = 2:1;

[0052] 13 parts of spherical silver powder with a particle size of 3-7 μm, and 57 parts of flake silver powder with a particle size of 5-9 μm;

[0053] Latent curing agent: 1 part, using TH-2844;

[0054] Curing accelerator: 0.3 parts, using imidazole accelerators, such as 2-ethyl-4-methylimidazole;

[0055] Coupling agent: 1.7 parts, using K-570;

[0056] Defoamer: 1 part, using lecithin;

[0057] Conduction accelerator: 1 part, using o-hydroxybenzaldehyde;

[0058] Anti-aging agent: 1 part, using TNPP;

[0059] Toughener: 2 parts, modified epoxy resin with self-shell-core structure polymer, the core is butadiene polymer, and the shell is plastic with a higher gl...

Embodiment 3

[0062] This example is a comparative example. (Whether the ratio of the comparative example can exceed the ratio of the content of the invention, such as diluent > 10 parts,)

[0063] First, equip each component by the following mass percentages:

[0064] Liquid epoxy resin: 12 parts, using a 1:1 mixture of epoxy acrylic resin and bisphenol A diglycidyl ether;

[0065] Diluent: 11 parts, using a mixture of 1,4 butanediol diglycidyl ether: diethylene glycol ethyl ether acetate = 2:1;

[0066] 13.5 parts of spherical silver powder of 3-7 μm, 59.5 parts of flake silver powder of 5-9 μm;

[0067] Latent curing agent: 1 part, using dicyandiamide;

[0068] Curing accelerator: 0.3 parts, using imidazole accelerators, such as 2-ethyl-4-methylimidazole;

[0069] Coupling agent: 1.7 parts, using K-570;

[0070] Defoamer: 1 part, using lecithin;

[0071] Conduction accelerator: 0 parts;

[0072] Anti-aging agent: 1 part, using TNPP;

[0073] Toughener: 0 parts.

[0074] Then, st...

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Abstract

The invention discloses a conductive silver paste for microelectronic packaging, which contains the following components in parts by mass: 10-12 parts of liquid epoxy resins, 9-10 parts of diluents, 10-13 parts of spherical silver powder, 50-57 parts of platy silver powder, 0.5-1.5 parts of latent curing agents, 0.2-0.8 part of curing promoter, 1-2 parts of coupling agents, 0.5-1 part of conductive promoters, 0.5-1 part of aging resister and 1.5-2.3 parts of toughening agents. The body resistivity of the conductive silver paste prepared by the invention reaches 10-5 omega.cm, the shear strength is greater than 9MPa, and the conductive silver paste has stable contact resistance; and after low-temperature circulation, high-temperature humidity aging tests and other aging tests, the shear strength, the impact-resistant toughness and the contact resistance change are all less than 18%. The prepared conductive silver paste is suitable for microelectronic packaging and has the advantages of stable contact resistance and strong impact resistance.

Description

technical field [0001] The present invention relates to conductive adhesives, in particular to silver conductive adhesives for microelectronic packaging. Background technique [0002] Conductive adhesive is an ideal alternative to lead-tin soldering to achieve conductive connections. Advanced electronic assembly technology is developing in the direction of miniaturization and high density, and miniaturization and high density mean that components are getting smaller and smaller, and the finer particle size and stability of conductive adhesives reflect the Better fine-line printability of tin-lead solders. Secondly, the conductive adhesive has a lower curing temperature, which greatly reduces the thermal stress and stress cracking failure problems during the interconnection process compared with solder interconnection, so it is especially suitable for the interconnection and non-solderability of heat-sensitive components Surface interconnection; third, the conductive adhesi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/10C09J163/04C09J11/04C09J11/06C09J9/02H01L23/29
Inventor 陈伟付振晓
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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