Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same

A flame retardant adhesive and content technology, used in the field of flame retardant adhesives and flexible copper clad laminates, can solve the heat resistance of the adhesive, the decrease in flexibility and adhesion, the resistance to dip soldering, the resistance to bending, the poor resistance to bending, the smoke It can achieve the effects of excellent flexibility, reducing bromine content, improving heat resistance and flame retardancy

Inactive Publication Date: 2010-11-24
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To make the flame retardancy of adhesive-type flexible copper-clad laminate reach UL94VTM-0 or V-0, the key is to make the adhesive used in it flame-retardant. The flame-retardant of the adhesive is generally achieved by adding a flame retardant or using a flame-retardant resin. , For a long time, the flame retardant of the adhesive for flexible copper clad laminates is the use of bromine flame retardant mechanism, JP 2001-015876 uses brominated epoxy resin, antimony trioxide flame retardant, US6709741, CN1407049A uses brominated epoxy resin, hydrogen Alumina is flame retardant. Since flammable synthetic rubber is used as a toughening agent, the adhesive needs a high bromine content to be flame retardant. Experiments have found that if only bromine is flame retardant, the bromine content

Method used

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  • Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same
  • Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same
  • Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same

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preparation example Construction

[0051] The preparation steps of the flame retardant adhesive of the present invention are as follows: firstly dissolve the synthetic rubber and the biphenyl type epoxy resin into 20% and 60% pre-solutions respectively with methyl ethyl ketone, then mix the glues in a certain order, mix the curing agent, the curing accelerator After the agent is dissolved, add the remaining components and pre-solution, and fully mix by using mixing and dispersing equipment such as ball mill, pot mill, sand mill, high-shear stirring disperser or high-speed disperser to prepare a flame-retardant adhesive.

[0052] The above-mentioned adhesive is used to prepare flexible copper-clad laminates: the flame-retardant adhesive prepared above is coated on a polyimide film, the solvent is removed by oven baking, and the adhesive is partially cross-linked and cured, and then laminated with copper foil, and finally placed on the Curing at high temperature in an oven to make a flexible copper clad laminate. ...

Embodiment 1

[0056] Synthetic rubber (trade name Nipol 1072CGX, manufactured by U.S. ZEON company, solid content 100%) 35 parts by weight, brominated epoxy resin (trade name DER530-A80, manufactured by DOW company, epoxy equivalent 425-440g / eq, solid content 80 %) 25 parts by weight, brominated epoxy resin (trade name Epiclon 153-60M, manufactured by Dainippon Ink Co., Ltd., epoxy equivalent 390-410g / eq, solid content 60%) 33.3 parts by weight, biphenyl type epoxy resin (trade name NC-3000-H, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 288g / eq, solid content 100%) 25 parts by weight, 4,4'-diaminodiphenyl sulfone 10.1 parts by weight (India Atul Corporation Manufacturing), 1-cyanoethyl-2-ethyl-4-methylimidazole (trade name 2E4MZ-CN, manufactured by Japan Shikoku Chemicals Co., Ltd.) 0.2 parts by weight, antioxidant 1010 (manufactured by Ciba, Switzerland) 0.3 weight Parts, 0.5 parts by weight of ion exchanger (trade name IXE-700, manufactured by Toagosei Co., Ltd.), 15 parts b...

Embodiment 2

[0058] Synthetic rubber (trade name Nipol 1072CGX, U.S. ZEON company manufactures, solid content 100%) 17.5 parts by weight, synthetic rubber XER-32 (Japan JSR Co., Ltd. manufactures, solid content 100%) 17.5 parts by weight brominated epoxy resin (trade name DER530-A80, manufactured by DOW Company, epoxy equivalent 425-440g / eq, solid content 80%) 25 parts by weight, brominated epoxy resin (trade name Epiclon 153-60M, manufactured by Dainippon Ink Co., Ltd., epoxy equivalent 390 -410g / eq, solid content 60%) 33.3 parts by weight, biphenyl type epoxy resin (trade name NC-3000-H, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 288g / eq, solid content 100%) 25 weight Parts, 10.1 parts by weight of 4,4'-diaminodiphenyl sulfone (manufactured by Attu, India), 1-cyanoethyl-2-ethyl-4-methylimidazole (trade name 2E4MZ-CN, Japan Shikoku Chemicals Co., Ltd. Co., Ltd.) 0.2 parts by weight, antioxidant 1010 (made by Ciba, Switzerland) 0.3 parts by weight, ion exchanger (trade name ...

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Abstract

The invention relates to a low-halogen-content fire-retardant adhesive and a flexible copper clad laminate prepared from the same. The low-halogen-content fire-retardant adhesive comprises synthetic rubber, brominated epoxy resin, biphenyl type epoxy resin, phosphonitrile compounds, an aromatic amine curing agent, an imidazole curing accelerator, inorganic filler, an ion exchanger, an oxidation inhibitor and a solvent. The flexible copper clad laminate prepared from the fire-retardant adhesive comprises a polyimide film, a low-halogen-content fire-retardant adhesive layer and copper foil, wherein the low-halogen-content fire-retardant adhesive layer is coated on the polyimide film, and the copper foil is pressed on the low-halogen-content fire-retardant adhesive layer. The fire-retardant adhesive has low halogen content, excellent flexibility, heat resistance, adhesion property and humidity resistance. The flexible copper clad laminate has excellent flexibility, folding resistance, deflection resistance, dip soldering resistance, ion mobility resistance and high peeling strength, the flame retardance reaches the UL94V-0 grade, and the flexible copper clad laminate is suitable for manufacturing a flexible printed circuit board.

Description

technical field [0001] The invention relates to an adhesive, in particular to a flame-retardant adhesive with low halogen content and a flexible copper-clad board prepared therefrom. Background technique [0002] Flexible copper clad laminate (FCCL) is mainly used to make flexible printed circuit board (FPC). FPC has the distinctive characteristics of thin, light and flexible structure. In addition to static bending, it can also be dynamically bent, curled and folded. , Widely used in mobile phones, digital cameras, digital video cameras, notebook computers, automotive electronics, missiles, rockets, aerospace and other fields. [0003] Flexible copper-clad laminates are divided into adhesive-type flexible copper-clad laminates and adhesive-free flexible copper-clad laminates. Adhesive-free flexible copper-clad laminates are also called two-layer flexible copper-clad laminates (2-layer FCCL), which are made of polyimide Composed of film and copper foil, it can be made by co...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/00C09J113/00C09J11/06H05K1/03
Inventor 茹敬宏刘生鹏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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