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Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga

A sn-cu-ni, lead-free solder technology, applied in the direction of welding/cutting media/materials, welding media, metal processing equipment, etc., to achieve excellent mechanical properties, improved oxidation resistance and creep resistance, wettability good performance

Active Publication Date: 2010-10-20
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sn-Cu-Ni solder has good comprehensive performance, moderate price, and good application prospects [US patent US 6180055B1, Chinese patent ZL99800339.5], but there are still many areas to be improved

Method used

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  • Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga, proportioned by mass percentage, its composition is: 0.07% Cu, 1.5% Ni, 0.001% Pr, 0.03% Sr, 0.01% Ga, 0.001 %Pb, the balance is Sn. The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga" obtained by the above composition ratio is about 220°C, and the liquidus temperature is about 227°C (experimental error is considered). The wetting balance method was used to test the wetting performance of the solder on the copper plate. The maximum wetting force was 2.9mN, the wetting time was 0.72s, and the wetting and spreading effect was excellent. The tensile force of the QFP solder joint is 9.1N, the shear strength of the chip resistor is 60N, and the creep fatigue life of the solder joint is 145h.

Embodiment 2

[0047]A Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga, proportioned by mass percentage, its composition is:, 2.5% Cu, 0.01% Ni, 0.05% Pr, 0.05% Sr, 0.05% Ga, 0.05% Pb, the balance is Sn. The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga" obtained by the above composition ratio is about 217°C, and the liquidus temperature is about 225°C (experimental error is considered). The wetting balance method was used to test the wetting performance of the solder on the copper plate. The maximum wetting force was 3.2mN, and the wetting time was 0.58s. The wetting and spreading effect was excellent. The tensile force of the QFP solder joint is 9.4N, the shear strength of the chip resistor is 62N, and the creep fatigue life of the solder joint is 162h.

Embodiment 3

[0049] A Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga, proportioned by mass percentage, its composition is: 0.5% Cu, 0.06% Ni, 0.001% Pr, 0.1% Sr, 0.001% Ga, 0.05 %Pb, the balance is Sn. The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga" obtained by the above composition ratio is about 219°C, and the liquidus temperature is about 227°C (experimental error is considered). The wetting balance method was used to test the wetting performance of the solder on the copper plate. The maximum wetting force was 3.4mN, the wetting time was 0.69s, and the wetting and spreading effect was excellent. The tensile force of the QFP solder joint is 9.3N, the shear strength of the chip resistor is 57N, and the creep fatigue life of the solder joint is 147h.

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Abstract

The invention relates to a Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga, belonging to the metal material and the brazing material in the metallurgical field. The solder comprises the following chemical compositions by weight percent: 0.07-2.5% of Cu, 0.01-1.5% of Ni, 0.001-0.5% of Pr, 0.001-0.1% of Sr, 0.001-0.1% of Ga and the balance Sn. The solder has good wettability and soldering point (brazing seam) mechanical property and extremely good creep resistance, and is suitable for the welding methods such as wave-soldering, dip-soldering, manual welding and reflow soldering in the electronic industry.

Description

technical field [0001] The invention relates to a Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga, belonging to metal materials and brazing materials in the field of metallurgy. It is mainly used in the field of surface assembly and packaging. It is a new type of green and environmentally friendly lead-free solder with good brazing performance (such as wetting performance) and excellent mechanical properties of solder joints (brazing seams). Background technique [0002] With the entry into force of the RoHS (The Restriction of the Use of certain Hazardous Substance in Electrical and Electronic Equipment) directive, the replacement of tin-lead solder has become a hot research topic for technicians in the electronics industry. At present, representative lead-free solders include alloy systems such as Sn-Ag-Cu, Sn-Cu, and Sn-Zn. Among them, Sn-Ag-Cu solder has a high melting point and high price, which restricts its wide application; Cu-based solder is cheap, and the cost ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 薛鹏薛松柏曾广顾立勇顾文华
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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