Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same

A composition and adhesive technology, applied in the field of flexible copper clad laminates, halogen-free flame retardant adhesive composition, can solve the problem of insufficient adhesion between substrate and copper foil, poor mechanical properties of materials, and poor dispersion of fillers Equal problems, achieve high peel strength, good heat resistance, and improve production efficiency

Active Publication Date: 2010-12-22
ALLSTAE TECH ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are problems such as uneven dispersion of fillers, poor mechanical properties of materials, and insufficient adhesion between substrate and copper foil.

Method used

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  • Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] Halogen-free epoxy resin GESR901 (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 475g / eq) 12 parts by weight, FC Hard XI-1072 (Resinous Kasei Co., Ltd. epoxy equivalent: 253g / eq) 9.3 parts by weight , GELR128E (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 185g / eq) 7.5 parts by weight; HyPox RK 84L (CVC Thermoset Specialties, elastomer content 32 mass%, epoxy equivalent: 1350g / eq) 6.0 parts by weight, synthetic 27 parts by weight of rubber 1072CG (Nantex Industry Co., Ltd. acrylonitrile content 27% by mass); 5 parts by weight of diaminodiphenylsulfone; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN ) 0.2 parts by weight; SPB-100 phosphazene flame retardant (Otsuka Chemical Co., Ltd, phosphorus content 13 mass%) 15 parts by weight; EXOLIT OP 935 hypophosphite chemicals (Clariant Produkte (Deutschland) GmbH, phosphorus content 23 mass %) 9.5 parts by weight; aluminum hydroxide (average particle size 0.8-1.2 μm, purity above 99%) 7.5 parts by w...

Embodiment 2

[0072] Halogen-free epoxy resin GESR901 (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 475g / eq) 12 parts by weight, FC Hard XI-1072 (Resinous Kasei Co., Ltd. epoxy equivalent: 253g / eq) 9.3 parts by weight , GELR128E (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 185g / eq) 7.5 parts by weight; HyPox RK 84L (CVC Thermoset Specialties, elastomer content 32 mass%, epoxy equivalent: 1350g / eq) 6.0 parts by weight, synthetic 20 parts by weight of rubber 1072CG (Nantex Industry Co., Ltd. acrylonitrile content 27% by mass); 7 parts by weight of PPO*MX-90 (phenoxy resin, SABIC INNOVATIVE PLASTICS); 5 parts by weight of diaminodiphenyl sulfone; 1 - cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.2 parts by weight; SPB-100 (Otsuka Chemical Co., Ltd, phosphorus content 13% by mass) 9.5 parts by weight; EXOLIT OP 935 (Clariant Produkte (Deutschland) GmbH, phosphorus content 23% by mass) 14 parts by weight; Aluminum hydroxide (average particle diameter 0.8-1.2 μ ...

Embodiment 3

[0075] Halogen-free epoxy resin GESR901 (Hongchang Electronic Materials Co., Ltd., epoxy equivalent: 475g / eq) 5.8 parts by weight, MX-257 (Kaneka Corporation, CSR content 27% by mass, epoxy equivalent: 294g / eq) 29.8 parts by weight , HyPox RK 84L (CVC Thermoset Specialties, elastomer content 32% by mass, epoxy equivalent: 1350g / eq) 4.5 parts by weight, synthetic rubber 1072CG (Nantex Industry Co., Ltd. acrylonitrile content 27% by mass) 20.3 parts by weight; 5.5 parts by weight of diaminodiphenylsulfone; 0.3 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); SPB-100 (Otsuka Chemical Co., Ltd, phosphorus content 13 mass % ) 9.7 parts by weight; EXOLIT OP 935 (Clariant Produkte (Deutschland) GmbH, phosphorus content 23% by mass) 15 parts by weight; aluminum hydroxide (average particle diameter 0.8-1.2 μm, purity more than 99%) 7.6 parts by weight; antioxidant 1010 (CIBA GEIGY Co., Ltd.) 0.3 parts by weight. Put the above components in a sand mill, add butanon...

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Abstract

The invention discloses a halogen-free flame-retardant adhesive composition. The composition comprises the following components in part by weight: 15 to 45 parts of halogen-free epoxy resin, 15 to 60 parts of thermoplastic resin and/or synthetic rubber, 0.1 to 8 parts of curing agent and 5 to 60 parts of phosphorus-containing composite flame retardant. The invention also discloses a flexible copper-clad plate using the adhesive composition. The cured product of the adhesive composition provided by the invention shows high flame retardance, peeling strength, electric performance and welding heat resistance, does not comprise harmful substances or elements such as halogen, antimonide and the like and does not pollute environment; the flame retardant rating of the flexible copper-clad plate prepared from the composition of the invention reaches UL-94V0, and the flexible copper-clad plate also has the advantages of high heat resistance, high peeling strength, soldering resistance, no demixing after being subjected to dip soldering at the temperature of 300 DEG C for 1 minute and no bubbles; and because the halogen-free composition of the invention has high sticking performance, the speed of a production line can be increased and the production efficiency is improved.

Description

technical field [0001] The invention relates to an adhesive composition, in particular to a halogen-free flame-retardant adhesive composition, and also relates to a flexible copper-clad laminate using the composition. Background technique [0002] In recent years, with the light weight, miniaturization and high density of electronic products, the demand for various printed circuit boards has increased, which also puts forward stricter requirements on the performance of copper clad laminate materials. At present, flame retardant copper clad laminate materials use a large amount of brominated epoxy resin and antimony compounds as flame retardants, but when electronic products made of such copper clad laminates are burned under abnormal conditions or waste products are burned, among them The bromine-containing substances and their synergistic flame retardant antimony trioxide will produce toxic gas dioxins and hydrogen halides, which are harmful to the environment and human hea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J113/00C09J163/02C09J163/00C09J171/12C09J167/00C09J133/00C09J179/08C09J11/06B32B15/08B32B7/12
Inventor 李国法徐海斌张家骥
Owner ALLSTAE TECH ZHONGSHAN
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