Epoxy resin composition and high frequency circuit board made of same
A technology of epoxy resin and circuit substrate, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc., can solve the problems of poor manufacturability, etc., and achieve the goal of overcoming poor heat and humidity resistance, optimizing dielectric properties, and excellent dielectric properties Effect
Inactive Publication Date: 2011-02-09
GUANGDONG SHENGYI SCI TECH
View PDF14 Cites 38 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
At the same time, in order to further optimize the dielectric properties, polyphenylene ether resin was introduce
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0071] Take a container, add 60 parts by weight of NC-3000H, then add 20 parts by weight of HF-CE and 20 parts by weight of 9460S, stir, add appropriate amount of accelerator zinc octanoate and DMAP, and dissolve toluene, continue to stir evenly to form a gel liquid. The above glue solution is impregnated with glass fiber cloth and controlled to a suitable thickness, and then dried to remove the solvent to prepare a prepreg. Several prepared prepregs are laminated with each other, and a copper foil is laminated on both sides of the prepregs, and they are put into a hot press to be cured to form the high-frequency circuit substrate. The physical data is shown in Table 1.
Embodiment 2
[0073] The manufacturing process is the same as in Example 1, and the formula composition and its physical properties are shown in Table 1.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Login to view more Abstract
The invention relates to an epoxy resin composition and a high frequency circuit board made of the same. The epoxy resin composition comprises the following solid components in part by weight: 10 to 70 parts of component (A) and component (B) and 30 to 90 parts of component (C), wherein the component (A) is a cyanate compound or prepolymer thereof, of which the molecules comprise at least two cyanatos; the component (B) is active ester; the component (C) is epoxy resin of which the molecular structure comprises at least one biphenyl structure; and the weight ratio of the component (A) to the component (B) is 0.2-5. The high-frequency circuit board made of the epoxy resin composition comprises a plurality of layers of semi-solidification sheets which are superimposed and copper foils which are covered on the two sides of the board respectively, wherein the plurality of layers of semi-solidification sheets comprise base materials and the epoxy resin composition which is subjected to soaking and drying and attached to the base materials.
Description
Technical field [0001] The present invention relates to a resin composition, in particular to an epoxy resin composition and a high-frequency circuit substrate made using the epoxy resin composition. Background technique [0002] The application frequency of traditional electronic products is mostly concentrated below 1GHz, and the DK / Df characteristics of traditional FR-4 materials are sufficient to meet its requirements. Even if it cannot be met, it can be achieved by changing the circuit design. However, with the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. Substrate materials will no longer play the role of mechanical support in the traditional sense, but will become PCB and electronic components together. An important way for terminal manufacturer designers to improve product performance. Because high DK will slow down the signal transmission rate...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more IPC IPC(8): C08G59/40B32B15/092C08L63/00H05K1/03C08G59/42
Inventor 曾宪平张江陵唐军旗
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap