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Epoxy resin composition and high frequency circuit board made of same

A technology of epoxy resin and circuit substrate, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc., can solve the problems of poor manufacturability, etc., and achieve the goal of overcoming poor heat and humidity resistance, optimizing dielectric properties, and excellent dielectric properties Effect

Inactive Publication Date: 2011-02-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, in order to further optimize the dielectric properties, polyphenylene ether resin was introduced, but there were problems such as poor manufacturability in the process of introducing polyphenylene ether resin

Method used

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  • Epoxy resin composition and high frequency circuit board made of same
  • Epoxy resin composition and high frequency circuit board made of same
  • Epoxy resin composition and high frequency circuit board made of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Take a container, add 60 parts by weight of NC-3000H, then add 20 parts by weight of HF-CE and 20 parts by weight of 9460S, stir, add appropriate amount of accelerator zinc octanoate and DMAP, and dissolve toluene, continue to stir evenly to form a gel liquid. The above glue solution is impregnated with glass fiber cloth and controlled to a suitable thickness, and then dried to remove the solvent to prepare a prepreg. Several prepared prepregs are laminated with each other, and a copper foil is laminated on both sides of the prepregs, and they are put into a hot press to be cured to form the high-frequency circuit substrate. The physical data is shown in Table 1.

Embodiment 2

[0073] The manufacturing process is the same as in Example 1, and the formula composition and its physical properties are shown in Table 1.

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PUM

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Abstract

The invention relates to an epoxy resin composition and a high frequency circuit board made of the same. The epoxy resin composition comprises the following solid components in part by weight: 10 to 70 parts of component (A) and component (B) and 30 to 90 parts of component (C), wherein the component (A) is a cyanate compound or prepolymer thereof, of which the molecules comprise at least two cyanatos; the component (B) is active ester; the component (C) is epoxy resin of which the molecular structure comprises at least one biphenyl structure; and the weight ratio of the component (A) to the component (B) is 0.2-5. The high-frequency circuit board made of the epoxy resin composition comprises a plurality of layers of semi-solidification sheets which are superimposed and copper foils which are covered on the two sides of the board respectively, wherein the plurality of layers of semi-solidification sheets comprise base materials and the epoxy resin composition which is subjected to soaking and drying and attached to the base materials.

Description

Technical field [0001] The present invention relates to a resin composition, in particular to an epoxy resin composition and a high-frequency circuit substrate made using the epoxy resin composition. Background technique [0002] The application frequency of traditional electronic products is mostly concentrated below 1GHz, and the DK / Df characteristics of traditional FR-4 materials are sufficient to meet its requirements. Even if it cannot be met, it can be achieved by changing the circuit design. However, with the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. Substrate materials will no longer play the role of mechanical support in the traditional sense, but will become PCB and electronic components together. An important way for terminal manufacturer designers to improve product performance. Because high DK will slow down the signal transmission rate...

Claims

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Application Information

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IPC IPC(8): C08G59/40B32B15/092C08L63/00H05K1/03C08G59/42
Inventor 曾宪平张江陵唐军旗
Owner GUANGDONG SHENGYI SCI TECH
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