Thermosetting resin composition, prepreg prepared from composition, and laminated board prepared from composition and used for printed circuit board

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of insufficient moisture resistance and chemical resistance, and achieve good processability, excellent metal Effect of foil peel strength, high glass transition temperature

Active Publication Date: 2012-07-18
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the halogen-free polyphenylene ether resin composition used in electronic circuit boards usually adopts the addition of phosphor

Method used

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  • Thermosetting resin composition, prepreg prepared from composition, and laminated board prepared from composition and used for printed circuit board
  • Thermosetting resin composition, prepreg prepared from composition, and laminated board prepared from composition and used for printed circuit board
  • Thermosetting resin composition, prepreg prepared from composition, and laminated board prepared from composition and used for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 50 parts of polyphenylene ether resin (Asahi Kasei Chemical Co., Ltd., trade name: S201A) with a number average molecular weight of 20000 and 50 parts of dicyclopentadiene epoxy resin (Changchun Artificial Resin Factory Co., Ltd., trade name: DNE260) were added to In 120 parts of toluene, stir and heat to 90°C to dissolve completely, then fully disperse 10 parts of DOPO-HQ (Huizhou Shengshida Technology Co., Ltd., trade name: ODOPB) in the reaction material, and then 8 parts of BPO (Dongguan Kangxin reagent, trade name: benzoyl peroxide) is divided into 10 parts and put into it evenly within 30 minutes. After 90 minutes of heat preservation at 90°C, stop heating. When the temperature drops to around 40°C, add 50 parts of bisphenol A type cyanate ( Jiangdu Wuqiao Resin Factory, trade name: CY-10), 0.02 parts of zinc isooctanoate and 30 parts of phosphazene flame retardant (Huizhou Shengshida Science and Technology Co., Ltd., trade name: SPB100), after stirring evenly, glu...

Embodiment 2

[0043] 50 parts of polyphenylene ether resin (Asahi Kasei Chemical Co., Ltd., trade name: S201A) with a number average molecular weight of 20000 and 50 parts of bisphenol A type epoxy resin (Dow Chemical, trade name: D.E.R.330) were added to 120 parts of toluene , stir and heat to 90°C to dissolve completely, then fully disperse 10 parts of DOPO-HQ (Huizhou Shengshida Technology Co., Ltd., trade name: ODOPB) in the reaction material, and then 8 parts of BPO (Dongguan Kangxin Reagent , product name: benzoyl peroxide) is divided into 10 parts and put into it evenly within 30 minutes. After 90 ℃ heat preservation for 90 minutes, stop heating, and when the temperature drops to around 40 ℃, add 50 parts of bisphenol A type cyanate Resin factory, trade name: CY-10), 0.02 parts of zinc isooctanoate and 30 parts of phosphazene flame retardant (Huizhou Shengshida Technology Co., Ltd., trade name: SPB100), after stirring evenly, glue is obtained. Take flat and smooth E-type glass fiber ...

Embodiment 3

[0045] 50 parts of polyphenylene ether resin with a number average molecular weight of 20000 (Asahi Kasei Chemical Co., Ltd., trade name: S201A) and 50 parts of biphenyl type epoxy resin (Nippon Kayaku Co., trade name: NC3000H) were added to 120 parts of toluene , stirred and heated to 90°C to dissolve completely, then 10 parts of DOPO-HQ (Huizhou Shengshida Technology Co., Ltd., trade name: ODOPB) was fully dispersed in the reaction material, and then 8 parts of BPO (Dongguan Kangxin Reagent, Product name: benzoyl peroxide) is divided into 10 parts and put into it evenly within 30 minutes. Stop heating after 90°C for 90 minutes, and add 50 parts of bisphenol A cyanate (Jiangdu Wuqiao Resin factory, trade name: CY-10), 0.02 parts of zinc isooctanoate and 30 parts of phosphazene flame retardant (Huizhou Shengshida Technology Co., Ltd., trade name: SPB100), after stirring evenly, obtain glue. Take flat and smooth E-type glass fiber cloth of model 2116 and evenly impregnate the a...

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PUM

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Abstract

The invention relates to a thermosetting resin composition, a prepreg prepared from the composition, and a laminated board prepared from the composition and used for a printed circuit board. The thermosetting resin composition comprises phosphorus-containing low molecular weight polyphenyl ether resin, epoxy resin, cyanate resin and an accelerator. The prepreg prepared from the resin composition comprises a base material and the thermosetting resin composition which is impregnated and dried and attached to the base material. The laminated board prepared from the resin composition and used for the printed circuit board comprises a plurality of superposed prepregs and metal foils laminated on one side or two sides of the superposed prepregs, wherein each prepreg comprises the base material and the thermosetting resin composition which is impregnated and dried and attached to the base material. The thermosetting resin composition has low dielectric constant and dielectric loss factor and high heat resistance, glass transition temperature, flame retardance and the like; and the laminated board prepared from the composition and used for the printed circuit board has high metal foil peeling strength, heat resistance and dielectric property and is suitable for a high-frequency high-speed electronic circuit board.

Description

technical field [0001] The invention relates to a resin composition, in particular to a thermosetting resin composition and a prepreg and a laminate for a printed circuit board made by using the composition. Background technique [0002] At present, the electronic and electrical industry is developing rapidly, and the development direction of electronic products is light and thin, high performance, high reliability and environmental protection. The specific requirements of electronic circuit boards are also manifested in high heat resistance, low thermal expansion coefficient, high humidity and heat resistance, environmental protection and flame retardancy, low dielectric constant and dielectric loss, and high elastic modulus. Therefore, traditional epoxy resins cannot fully meet the development needs of electronic circuit boards, and polyphenylene ether resins with high heat resistance, low dielectric constant and dielectric loss, and excellent toughness are increasingly us...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L63/00C08L79/04B32B15/08B32B27/12
Inventor 孟运东方克洪
Owner GUANGDONG SHENGYI SCI TECH
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