Thermosetting resin composition, prepreg prepared from composition, and laminated board prepared from composition and used for printed circuit board

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of insufficient moisture resistance and chemical resistance, and achieve good processability, excellent metal Effect of foil peel strength, high glass transition temperature
CN102585480AActive Publication Date: 2012-07-18GUANGDONG SHENGYI SCI TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GUANGDONG SHENGYI SCI TECH
Publication Date
2012-07-18

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Abstract

The invention relates to a thermosetting resin composition, a prepreg prepared from the composition, and a laminated board prepared from the composition and used for a printed circuit board. The thermosetting resin composition comprises phosphorus-containing low molecular weight polyphenyl ether resin, epoxy resin, cyanate resin and an accelerator. The prepreg prepared from the resin composition comprises a base material and the thermosetting resin composition which is impregnated and dried and attached to the base material. The laminated board prepared from the resin composition and used for the printed circuit board comprises a plurality of superposed prepregs and metal foils laminated on one side or two sides of the superposed prepregs, wherein each prepreg comprises the base material and the thermosetting resin composition which is impregnated and dried and attached to the base material. The thermosetting resin composition has low dielectric constant and dielectric loss factor and high heat resistance, glass transition temperature, flame retardance and the like; and the laminated board prepared from the composition and used for the printed circuit board has high metal foil peeling strength, heat resistance and dielectric property and is suitable for a high-frequency high-speed electronic circuit board.
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Description

technical field

[0001] The invention relates to a resin composition, in particular to a thermosetting resin composition and a prepreg and a laminate for a printed circuit board made by using the composition. Background technique

[0002] At present, the electronic and electrical industry is developing rapidly, and the development direction of electronic products is light and thin, high performance, high reliability and environmental protection. The specific requirements of electronic circuit boards are also manifested in high heat resistance, low thermal expansion coefficient, high humidity and heat resistance, environmental protection and flame retardancy, low dielectric constant and dielectric loss, and high elastic modulus. Therefore, traditional epoxy resins cannot fully meet the development needs of electronic circuit boards, and polyphenylene ether resins with high heat resistance, low dielectric constant and dielectric loss, and excellent toughness are increasingly us...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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