Environment-friendly fiber framework material dip solution and dipping process
An environment-friendly, fiber-skeleton technology, applied in the field of environment-friendly fiber-skeleton material dipping solution and dipping process, can solve pollution and other problems, and achieve good bonding effect and low stiffness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 9-15
[0039] Examples 9-15 were tested, test method: H adhesion was tested according to GB / T 19390-2014 method, peeling surface adhesion was measured and rated according to ASTM-D4393 method, the results are shown in Table 4.
[0040] Table 4
[0041]
[0042]
[0043] It can be seen from Table 4 that the results of Example 10 show that the one-bath dipping process is not easy to use if the solid content is below 10%, otherwise the adhesive performance will be adversely affected. Examples 11 and 12 show that below 5% solids, even with double-bath immersion, the adhesive properties will be adversely affected. Example 13 shows that when the total solid content is more than 10%, reducing the rubber latex consumption to 80 parts, H extraction adhesion has adverse effects. Example 14 shows that when the solid content is more than 10%, the rubber latex consumption is 80 parts, the rubber modifier consumption is 0.5 part, and the carboxylated styrene-butadiene latex with higher acti...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com