Environment-friendly fiber framework material dip solution and dipping process

An environment-friendly, fiber-skeleton technology, applied in the field of environment-friendly fiber-skeleton material dipping solution and dipping process, can solve pollution and other problems, and achieve good bonding effect and low stiffness

Active Publication Date: 2016-11-09
JIANGSU TAIJI IND NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to solve the problem that the existing RFL adhesive system contains resorcinol and formaldehyde which are easy to cause pollution, and provides a kind of environment-friendly fiber skeleton ma...

Method used

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  • Environment-friendly fiber framework material dip solution and dipping process
  • Environment-friendly fiber framework material dip solution and dipping process
  • Environment-friendly fiber framework material dip solution and dipping process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 9-15

[0039] Examples 9-15 were tested, test method: H adhesion was tested according to GB / T 19390-2014 method, peeling surface adhesion was measured and rated according to ASTM-D4393 method, the results are shown in Table 4.

[0040] Table 4

[0041]

[0042]

[0043] It can be seen from Table 4 that the results of Example 10 show that the one-bath dipping process is not easy to use if the solid content is below 10%, otherwise the adhesive performance will be adversely affected. Examples 11 and 12 show that below 5% solids, even with double-bath immersion, the adhesive properties will be adversely affected. Example 13 shows that when the total solid content is more than 10%, reducing the rubber latex consumption to 80 parts, H extraction adhesion has adverse effects. Example 14 shows that when the solid content is more than 10%, the rubber latex consumption is 80 parts, the rubber modifier consumption is 0.5 part, and the carboxylated styrene-butadiene latex with higher acti...

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PUM

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Abstract

The invention relates to an environment-friendly fiber framework material dip solution and a dipping process. The dip solution comprises, by weight parts, 3.3-190 parts of blocked isocyanate compound by dry weight, 6.6-140 parts of epoxy compound by dry weight, 80-100 parts of rubber latex by dry weight, 0.5-20 parts of rubber modifier by dry weight, and the balance water. The content of the dip solution is 5-25%, and a one-bath or double-bath dipping process is adopted to perform coating on a fiber framework material. The dip solution does not contain harmful substances such as resorcinol and formaldehyde and does not cause pollution to the environment, the dipping process is simple in steps and easy to operate, an organic fiber after dipping treatment is low in rigidity and facilitates postprocessing, and the dip solution has a good effect of being bonded to rubber and has a better dipping effect than conventional RFL.

Description

technical field [0001] The invention relates to an environment-friendly fiber skeleton material dipping solution and a dipping process, belonging to the technical field of dipping preparation. Background technique [0002] Since the application of organic fiber as a skeleton reinforcement material in rubber elastic materials, people have started the development and research of fiber bonding technology. In order to improve the bonding between these fibers and rubber materials, people have invented the RFL (resorcinol, formaldehyde, latex) bonding system through research. Because the RFL (resorcinol, formaldehyde, latex) system can form a good bonding effect between organic fibers and rubber materials, and has good economical practicability, it has been widely recognized and has been used worldwide until now . The RFL (resorcinol, formaldehyde, latex) system is also time-proven, the most effective and economical bonding system for rubber-fiber bonding, and has always been th...

Claims

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Application Information

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IPC IPC(8): C08L9/10C08L9/08C08L13/02C08L75/04C08L67/02C08L77/06C08L77/10C08K3/04C08K9/00C08K3/34
CPCC08L9/10C08L67/02C08L75/04C08L77/06C08L77/10C08L2205/02C08L2205/03C08L2205/035C08L2205/16C08L9/08C08L13/02C08K3/04C08K9/00C08K3/34C08K3/346
Inventor 许其军王晓龙华润稼
Owner JIANGSU TAIJI IND NEW MATERIALS CO LTD
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