Low dielectric material

A low-dielectric material, polyphenylene ether technology, applied in the field of low-dielectric materials, can solve the problems of difficult forming, falling off, difficult processing, etc., and achieve the effects of high Tg, low water absorption, and low thermal expansion coefficient

Inactive Publication Date: 2014-08-06
ITEQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, polyphenylene ether is a kind of thermoplastic resin, and it has the following disadvantages when it is directly used in copper foil substrates: high melt viscosity, difficult to process and shape; poor solvent resistance, easy to cause corrosion in the solvent cleaning environment of the printed circuit board manufacturing process The wire is not firmly attached or falls off; and the m

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] The influence of embodiment 1PPE ratio difference

[0058]

[0059] Comparing the proportion relationship between Tg, Dk, Df and PPE, if the amount of PPE is too high or too low, Tg will be too low. At the same time, the amount of PPE will also affect Dk and Df. When the amount of PPE is high, both Dk and Df will be high. When the amount of PPE is low, both Dk and Df are low. In the best situation, both Dk and Df are low. In addition, adding PPE will increase the coefficient of thermal expansion, so the way of adding BMI is to reduce the coefficient of thermal expansion. The PPE (polyphenylene ether) model SA9000 in the table was purchased from Sabic Company. The chemical name is poly 2,6-dimethyl 1,4-phenylene ether, referred to as PPO (Polyphenylene Oxide) or PPE (Polypheylene ether), also known as polyphenylene oxide or polyphenylene ether.

Embodiment 2B

[0060] The influence of embodiment 2BMI resin structure and ratio difference

[0061]

[0062] Comparing the relationship between thermal expansion coefficient and BMI (bismaleimide), the higher the ratio of BMI, the lower the thermal expansion coefficient. The comparison of BMI in this example can be divided into three parts, A1-A5 are the same type of BMI resin with different proportions, A6-A8 are the same proportion but different types of BMI, A9-A15 is the comparison of mixing multiple BMIs. The BMI models 2300, 4000, 5100, and TMH in the table are purchased from Daiwakaseilndustry CO., LTD. The chemical names are as follows.

[0063] BMI-2300

[0064] From A1 to A5, different proportions of the same type of BMI can effectively reduce the thermal expansion coefficient, but also have the effect of improving the water absorption rate. From A6-A8, different BMI can effectively reduce the thermal expansion coefficient, but it will also affect the water absorptio...

Embodiment 3

[0065] Embodiment 3 The impact of polymer additive structure and ratio difference

[0066]

[0067]

[0068] Comparing the relationship between water absorption and the use ratio of polymer additives (polymeradditves), using polybutadiene (Polybutadiene) and styrene-maleic anhydride copolymer (SMA), when using the same polybutadiene, The higher the ratio, the lower the water absorption, but the coefficient of thermal expansion will also increase. When using different kinds of polybutadiene and using it with SMA, it can be seen that SMA is more effective in reducing water absorption and can also reduce the coefficient of thermal expansion, but the performance in the Df part is poor, and the use of polybutadiene can make up for it Insufficiency of SMA in the Df part. The butadiene types Ricon100, Ricon130MA8, Ricon150 and Ricon257 in the table are purchased from Sartomer, and the chemical names are as follows.

[0069] Ricon100

[0070] The SMA listed in the ta...

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PUM

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Abstract

The invention relates to a low dielectric material. The low dielectric material includes, by weight, 40-80 parts of polyphenyl ether with the number average molecular weight Mn of 1000-4000, the weight average molecular weight Mw of 1000-7000 and the Mw/Mn ratio of 1.0-1.8, 5-30 parts of bimaleimide and 5-30 parts of a polymer additive, and the Dk value and the Df value of the low dielectric material are 3.75-4.0 and 0.0025-0.0045 respectively. The low dielectric material can be applied to semi-cured films or circuit substrate insulating layers, and has the characteristics of high Tg, low thermal expansion coefficient, low water absorption rate, and excellent dielectric properties like dielectric constant (Dk) and dielectric loss (Df).

Description

technical field [0001] The invention relates to a low dielectric material, in particular to a thermosetting resin composition. Background technique [0002] With the vigorous development of wireless transmission products and the advancement of high-frequency transmission technology, the existing epoxy resin and phenolic resin system materials can no longer meet the advanced applications, especially the needs of high-frequency printed circuit boards. [0003] Fluorine-based resins are used as substrate materials for printed circuit boards with low dielectric loss, but such resins are expensive and difficult to process, and their applications are limited to military and aerospace applications. In addition, polyphenylene ether (PPE) resin has become the preferred resin material for the substrate of high-frequency printed circuit boards due to its good mechanical properties and excellent dielectric properties, such as dielectric constant (Dk) and dielectric loss (Df). [0004] ...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L47/00C08L35/06C08K5/3415
Inventor 鄞盟松陈礼君
Owner ITEQ CORP
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