Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound

a technology of tetrakisphenol and epoxy resin, which is applied in the field of composition of epoxy resin and clathrate of tetrakisphenol and epoxyreactive curing compound, can solve the problems of increasing the viscosity of the composition, not being economical from operation, and not being easy to handle and operate economically

Inactive Publication Date: 2004-04-27
NIPPON SODA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Normally, the epoxy resin compositions are prepared into two-pack mixture-types, which are widely used for parts to be used in the fields of electric appliances industry, automobile industry and aircrafts industry, since two-pack mixture type has excellent properties in terms of the strength of cured-products, thermal property, electricity property, etc., though it is not easy to handle and not economical from operation point of view.
However, the two-pack mixture type has problems that, (1) since it has short pot life, that means time maintainable the state of prepared composition to be usable for curing, operational performance is ceased due to starting of partial curing of the composition during the preparation, which causes the increase of viscosity of the composition, and (2) the physicochemical property of the composition is ceased by incorrect mixing or incomplete preparation.
For stabilizing the effect of curatives and curing accelerators, microcapsules thereof have been used, however, such microcapsules do not have sufficient mechanical strength, and therefore, there have been a problem in stability of those microcapsules such that they cannot stand for a process of blending to adjust resin compositions.
However, we have still problems when using any of existing curatives such that (1) curing reaction by using any of existing curatives stops before the completion of the reaction due to increase of viscosity of resins, (2) there are many inhibitory factors against a curing reaction, (3) some severe conditions are required for completing a cur

Method used

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  • Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound
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  • Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound

Examples

Experimental program
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Effect test

example 2

Measurement of Prolonged Pot Life of Resin Compositions (Part 1)

To 100 parts of a base resin (uncured resin) UVR-6410 (Trade name, Manufactured by Union Carbide Co., Ltd.), was added 13.7 parts (corresponding to 4.0 parts by weight as 2MZ) of the inventive curative, sample No. 32, described in Table 1. The mixture was kneaded for 10 min. at 25.degree. C. and was further allowed to stand for 20 min. at 25.degree. C. Then, the initial viscosity of the resin composition prepared was measured. The resin composition was then placed under 25.degree. C., and periodical change in viscosity was measured. The viscosity measurement was accorded to JIS K-6833-1994, and B8R-type rotational viscosity meter (Manufactured by Tokyo Keiki) was used for the measurement. The results of the measurement are shown in Table 4 and FIG. 48. When prolonged pot life of the resin composition is defined as the time requiring for the viscosity of a resin to be the double value of the initial viscosity value, the ...

example 3

Measurement of Prolonged Pot Life of Resin Compositions (Part 2)

To 100 parts of a base resin (uncured resin) UVR-6410 (Trade name, Manufactured by Union Carbide Co., Ltd.), was added 11.2 parts by weight (corresponding to 4.0 parts by weight as 2B4MZ) of the inventive curative of sample No. 24 described in Table 1. Then, the viscosity of the resulting resin composition was measured according to the procedure as described in the example 2. The results of the measurement are shown in Table 5 and FIG. 49. When using the inventive curative of sample No. 24, the prolonged pot life, which is the time required for the viscosity of the resin composition to be a double value of the initial viscosity value, was found to be 180 hours.

example 4

Measurement of Prolonged Pot Life of Resin Compositions (Part 3)

To 100 parts by weight of a base resin (uncured resin) UVR-6410 (Trade name, Manufactured by Union Carbide Co., Ltd.), was added 30.5 parts by weight (corresponding to 4.0 parts by weight based on EDA) of the inventive curative of sample No. 10 described in Table 1. The viscosity of the resultant resin composition was measured according to the procedure described in the example 2. Similarly, the viscosity measurements were also done about a resin composition, in which 34.2 parts by weight (equivalent to 4.0 parts by weight based on EDA) of a curative of sample No. 11 described in Table 1 was used instead of the curative of sample No. 10. The results of the measurement are shown in Table 6 and FIG. 50. When using the curative of sample No. 10, the prolonged pot life, which is defined as time required for the viscosity of the resin to be a double value of the initial viscosity value, was found to be 180 hours. Whereas, wh...

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Abstract

The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula [I];wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R<1 >to R<8 >each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula [I] shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.

Description

The present invention is related to epoxy resin compositions and to a curative for epoxy resins and a curing accelerator for epoxy resins, both of which contain a tetrakisphenol compound.Epoxy resins are characterized as one having various excellent properties, such as chemical proof, corrosion resistance, mechanical property, thermal property, adhesive property to various materials, electric property, and easy handling property under any condition, and are widely used for adhesives, paints, electrometal materials and complex materials. An epoxy group in an epoxy resin is a functional group which has great distortion therein and enormous reactivity, being reactive to both acids and bases, and is capable of curing epoxy resins by virtue of such high reactivity to make a resin into three dimension structure. An epoxy resin composition is composed of an epoxy prepolymer, which contains more than 2 epoxy groups in a molecule, and a curative, and is normally added with a curing accelerat...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/56C08G59/62C08G59/00C08G59/18C08G59/68C08L63/00
CPCC08G59/18C08G59/5093C08G59/56C08G59/621C08G59/68
Inventor SUZUKI, HIROSHIABE, SATORUAOKI, IZUO
Owner NIPPON SODA CO LTD
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