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Low-viscosity epoxy resin system for resin transfer molding and preparation and using method thereof

An epoxy resin system and epoxy resin technology, applied in the field of epoxy resin systems and low-viscosity epoxy resin systems, can solve the problems of low mechanical and thermal properties of epoxy resin, easy formation of turbulent flow, and increased porosity of products. Achieve good mechanical properties, improve the effect of operating technology

Inactive Publication Date: 2010-11-10
ZHUZHOU TIMES NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the ordinary epoxy resin has a high viscosity. If it is directly applied to RTM, not only the penetration is difficult, the injection pressure is high, and the filling time is long, but also the air bubbles in the resin are not easy to remove; if the viscosity is too low, the resin flow is easy to form turbulent flow, thus A large number of air bubbles are entrained into the mold. After the mold is closed and solidified, the porosity of the product increases, which affects its performance
At present, the industry generally adopts the use of monofunctional epoxy diluent or non-reactive diluent to reduce the viscosity of epoxy resin, but the mechanical properties and thermal properties of the diluted epoxy resin are significantly reduced.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. Take 60 parts by weight of bisphenol A epoxy resin CYD-128, 30 parts of bisphenol F epoxy resin, and 10 parts of polyethylene glycol diglycidyl ether and stir for 1 hour at 20-35°C Until the mixture is uniform, add 0.05 BYK-A530 defoamer dropwise, keep the temperature constant, stir for 10-30 minutes, and finally stand for 24 hours to obtain component A;

[0026] 2. Take 16 parts by weight of isophorone diamine and 14 parts of polyetheramine and mix them uniformly to prepare component B;

[0027] 3. Mix and stir component A and component B according to the weight ratio of 100:30, vacuumize and debubble at room temperature for 10-15 minutes to obtain a resin mixture;

[0028] 4. Heat the mold in the temperature range of 40°C to 80°C for 40 to 80 minutes, pour the resin mixture, and vacuumize and remove air bubbles at room temperature for 10 to 20 minutes;

[0029] 5. The cast body can be obtained by heating at 80°C for 6 hours. The performance test results of the cas...

Embodiment 2

[0032] 1. Take 55 parts by weight of bisphenol A epoxy resin CYD-128, 25 parts of cyclohexane diglycidyl ether, and 20 parts of 1,2-hexanediol diglycidyl ether under the condition of 20-35°C Stir for 1 hour until it is evenly mixed, add 0.1 part of BYK-A530 defoamer dropwise, keep the temperature constant, stir for 10-30 minutes, and finally let it stand for 24 hours to obtain component A;

[0033] 2. Take 16 parts by weight of isophorone diamine and 14 parts of polyetheramine and mix them uniformly to prepare component B, mix and stir evenly;

[0034] 3. Mix and stir component A and component B according to the weight ratio of 100:10. Vacuumize and debubble at room temperature for 10 to 15 minutes to obtain a resin mixture. Others are the same as those in Example 1. The performance test results of the cast body are as follows:

[0035] Test items

[0036] Test items

Embodiment 3

[0038] 1. Take 60 parts by weight of bisphenol A type epoxy resin CYD-128, 25 parts of bisphenol F type epoxy resin, and 14.5 parts of 1,4-butanediol diglycidyl ether at 20-35 ° C. Stir for 1 hour until the mixture is uniform, add 0.1 part of BYK-A500 defoamer dropwise, keep the temperature constant, stir for 10-30 minutes, and finally stand for 24 hours to obtain component A;

[0039] 2. Take 30 parts by mass of straight-chain aliphatic amine, cycloaliphatic amine, aliphatic aromatic amine and lactam as component B;

[0040] 3. Mix and stir component A and component B according to the weight ratio of 100:15, vacuumize and debubble at room temperature for 10 to 15 minutes to obtain a resin mixture, and the performance test results of the cast body prepared in the same example as in Example 1 are as follows:

[0041] Test items

[0042] Test items

[0043] In the above examples 1-3, the tensile test is carried out according to GB / T2568, the bending test is c...

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Abstract

The invention relates to a low-viscosity epoxy resin system for resin transfer molding and a preparation and using method thereof. The epoxy resin system consists of a component A and a component B, wherein in the component A, the weight ratio of epoxy resin to reactive diluent to antifoaming agent is 55-90: 10-45: 0.05-1; and the weight ratio of the component B (curing agent) to the component A is 100: 10-30. The preparation and using method comprises the following steps of: mixing and stirring the components A and B of the epoxy resin system uniformly in a ratio, pumping vacuum and removing bubbles at room temperature, and finally heating the components for 6 hours at the temperature of 80 DEG C to obtain a casting. The epoxy resin system can improve the gelling time and viscosity, meanwhile keeps good mechanical property and thermal property, and can be used for manufacturing large-sized composite structural members of automobiles, ships, wind-power blades, aerospace and the like.

Description

technical field [0001] The invention relates to an epoxy resin system, in particular to a low-viscosity epoxy resin system with a longer gel time, better mechanical properties and applicable to the field of resin transfer molding and its application method, belonging to polymer materials technology field. Background technique [0002] Resin Transfer Molding, referred to as RTM (Resin Transfer Molding), originated from the cold mold casting process in the 1950s and has a history of more than 50 years. Its principle is that under a certain temperature and pressure, a low-viscosity liquid resin is injected In the mold covered with the preform (reinforcement material), the resin is injected, cured and molded, and then demolded. Since its process includes the processing of the preform and the injection and curing of the resin, these two steps can be carried out separately, so RTM is highly flexible and combinable, and it is easy to realize "material design". It has been widely u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08G59/22C08G59/20C08G59/50
Inventor 廖波李鸿岩王锴李儒剑宋欢
Owner ZHUZHOU TIMES NEW MATERIALS TECH
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