Modified graphene oxide, slurry and composite film, and preparation methods and applications thereof

Abstract

The invention provides modified graphene oxide, slurry and a composite film, and preparation methods and applications thereof. The modified graphene oxide is graphene oxide modified by a curing accelerator; the slurry comprises modified graphene oxide, polyimide and / or a polyimide precursor, and an organic solvent; the composite film is formed by solidifying the slurry; the composite film has a high imidization rate, a low dielectric constant and a low curing temperature, so that the composite film can be used as a special functional plastic to be applied to advanced packaging of semiconductors, warping of ultrathin wafers and reconstructed wafers can be well avoided, and damage to heat-labile elements can be effectively avoided.

Description

technical field [0001] The invention belongs to the field of thin films, and relates to a modified graphene oxide, a slurry, a composite thin film and a preparation method and application thereof. Background technique [0002] Polyimide (PI) is a special engineering plastic with excellent performance. It has excellent high and low temperature resistance, electrical properties, mechanical properties, etc. Its dielectric constant is 3.4 to 3.6. In fields such as high-frequency communication, it is necessary to further reduce the dielectric constant of polyimide to below 3.0 or even below 2.5. At the same time, polyimide usually uses aromatic diamine and aromatic dianhydride as the basic raw materials, and is prepared by first polymerizing to form polyamic acid (PAA), and then thermal imidization at high temperature (above 300°C). Due to the rapid development of semiconductor integrated circuits, thermal imidization above 300 °C will cause warping of ultra-thin wafers and reco...

AI Technical Summary

Problems solved by technology

Among them, the cost of introducing fluorine atoms and monomer modification into polyimide is high, and the introduction of air micropores will greatly reduce the mechanical properties

[0004] CN105601921A discloses a preparation method of a low dielectric constant reinforced graphene oxide / polyimide composite film, which reduces the dielectric constant of the composite film by hyperbranched polyester-graphene oxide, and the prepared composite film has a dielectric The electrical constant can be reduced to 2.28, but it still needs to be cured at a high temperature of 300°C

However, the use of high boiling point solvents has high toxicity and does not produce polyamic acid intermediates, does not have flexible processability, and the prepared polyimide does not have the performance of low dielectric constant

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