Low-temperature curing epoxy resin and coating containing epoxy resin

An epoxy resin and low-temperature technology, applied in the direction of epoxy resin coating, coating, etc., can solve the problems of longer operation process, higher cost, complex coating composition, etc., and achieve stable coating film, high strength and wide application prospects Effect

Active Publication Date: 2018-07-31
西安天元化工有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above solution will lead to complex components of epoxy resin-containing coatings, increased costs, and has the disadvantage of lengthening the operation process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Dissolve 240 parts by mass of E44 epoxy resin in a mixture of 200 parts by mass of xylene and butanol (mixing mass ratio of 7:3), then add it to 60 parts by mass of ethylenediamine while stirring, and stir vigorously evenly After heating to 60° C., maintaining the temperature and stirring for 2 hours, a low-temperature curable epoxy resin was obtained.

[0027] The resin liquid was mixed with polyurethane curing agent TDI adduct L75 in a mass ratio of 100 parts: 90 parts, and the curing tests were carried out at 0 degrees and -5 degrees respectively. When the curing time was 24 hours, the curing degree of the system reached 60 degrees. %above. It shows that the system can be cured at -5℃~5℃.

Embodiment 2

[0029] Dissolve 200 parts of E51 epoxy resin in 120 parts of dimethylformamide, then add it to 250 parts of MDI and 2 parts of tetrabutylammonium chloride and mix, stir evenly, and then heat to 200 ° C to maintain temperature and stirring for 3 hours to obtain a low temperature curable epoxy resin.

[0030] The resin liquid was mixed with the curing agent cashew nut shell oil modified amine MD650 by mass ratio of 100 parts: 8 parts, and the curing tests were carried out at 0 degrees and -5 degrees respectively. When the curing time was 24 hours, the curing degree of the system reached more than 60%. It shows that the system can be cured at -5℃~5℃.

Embodiment 3

[0032] Dissolve 450 parts of CYD-001 epoxy resin in 350 parts of butyl acetate, mix it with 250 parts of MDI during stirring, stir evenly, heat to 100 ° C, maintain the temperature and stir for 3 hours to obtain epoxy resin that can be cured at low temperature resin.

[0033] Mix 100 parts of the resin liquid with 3 parts of polyamide curing agent 650, and carry out curing tests at 0 degrees and -5 degrees respectively. When the curing time is 24 hours, the curing degree of the system reaches more than 60%. It shows that the system can be cured at -5℃~5℃.

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PUM

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Abstract

The invention provides low-temperature curing epoxy resin. The epoxy resin is epoxy resin of which an epoxy group is modified, and the modified group is a primary amine group or an isocyanate group. The invention also provides a coating containing the epoxy resin. According to the epoxy resin provided by the invention, a chemical modification method is used to convert all epoxy groups on a molecular chain of the epoxy resin into terminal amino-NH2 or isocyanate groups; and when the epoxy resin is applied, modified amino-containing epoxy resin and an isocyanate group-containing curing agent aremixed, or modified isocyanate group-containing epoxy resin and an amino-containing epoxy curing agent are mixed, rapid curing can be performed at the temperature of 0 DEG C or less, and a coating film is stable, and has high strength and wide application prospects.

Description

technical field [0001] The invention belongs to the field of organic material compositions, in particular to a composition containing epoxy resin. Background technique [0002] Epoxy resin generally refers to an organic compound containing two or more epoxy groups in the molecule, and the epoxy group can be located at the end of the molecular chain, in the middle or in a cyclic structure. Due to the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble polymers with a three-way network structure. The cured epoxy resin has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small deformation shrinkage, good dimensional stability of products, high hardness, and stable to alkali and most solvents. The curing agents used for epoxy resins include aliphatic amines, alicyclic amines, aromatic amines, polyamides, acid anhydrides, resins, tertiary amines, etc....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C09D163/00
CPCC08G59/1477C09D163/00
Inventor 张建红
Owner 西安天元化工有限责任公司
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