Copper-based composite conductive paste, preparation method and application thereof

A conductive paste and copper-based composite technology, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of poor conductivity, narrow selection of printing substrate materials, and conductive copper paste. Solve problems such as high curing temperature to achieve the effect of improving electrical conductivity

Active Publication Date: 2020-10-02
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of high curing temperature of conductive copper paste, narrow selection range of printing substrate materials and poor conductivity in the prior art, the present invention provides a copper paste with high conductivity and low curing temperature that can be used on jet-printed film circuit boards. Base composite conductive paste, preparation method and application thereof

Method used

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  • Copper-based composite conductive paste, preparation method and application thereof
  • Copper-based composite conductive paste, preparation method and application thereof
  • Copper-based composite conductive paste, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (1) Take 7 parts of spherical copper powder of about 6 μm and 3 parts of SnAgCu alloy powder of about 3 μm and mix thoroughly to obtain a composite conductive filler.

[0037] (2) Take 3.98 parts of triethanolamine as a curing agent, and sequentially add 0.2 parts of 2-ethyl-4 methylimidazole, 0.4 parts of 3-aminopropyltriethoxysilane, 2.5 parts of twelve to ten Tetraglycidyl ether, 1 part of tributyl phosphate, 0.42 part of ascorbic acid, 0.7 part of polyethylene glycol, and 0.8 part of NA acid anhydride are fully stirred to obtain an organic carrier system.

[0038] (3) Take 5 parts of organic carrier system and add 10 parts of epoxy resin E-44, after fully stirring evenly, add 85 parts of composite conductive filler, stir in a planetary mixer at 10r / min for 5 minutes, and vacuum at 25r / min Stir for 20 minutes, pause for 5 minutes and then stir for 10 minutes at 15 r / min. A copper-based composite conductive paste for thin film circuit boards is obtained.

[0039] (4...

Embodiment 2

[0041] (1) Take 8 parts of spherical copper powder of about 6 μm and 2 parts of SnAgCu alloy powder of about 3 μm and fully mix to obtain a composite conductive filler.

[0042] (2) Take 3.98 parts of triethanolamine as a curing agent, and sequentially add 0.2 parts of 2-ethyl-4 methylimidazole, 0.4 parts of 3-aminopropyltriethoxysilane, 2.5 parts of twelve to ten Tetraglycidyl ether, 1 part of tributyl phosphate, 0.42 part of ascorbic acid, 0.7 part of polyethylene glycol, and 0.8 part of NA acid anhydride are fully stirred to obtain an organic carrier system.

[0043] (3) Take 5 parts of organic carrier system and add 10 parts of epoxy resin E-44, after fully stirring evenly, add 85 parts of composite conductive filler, stir in a planetary mixer at 10r / min for 5 minutes, and vacuum at 25r / min Stir for 20 minutes, pause for 5 minutes and then stir for 10 minutes at 15 r / min. A copper-based composite conductive paste for thin film circuit boards is obtained.

[0044] (4) Aft...

Embodiment 3

[0046] (1) Take 6 parts of spherical copper powder of about 6μm and 4 parts of SnAgCu alloy powder of about 3um and fully mix to obtain a composite conductive filler

[0047] (2) Take 3.98 parts of triethanolamine as a curing agent, and sequentially add 0.2 parts of 2-ethyl-4 methylimidazole, 0.4 parts of 3-aminopropyltriethoxysilane, 2.5 parts of twelve to ten Tetraglycidyl ether, 1 part of tributyl phosphate, 0.42 part of ascorbic acid, 0.7 part of polyethylene glycol, and 0.8 part of NA acid anhydride are fully stirred to obtain an organic carrier system.

[0048] (3) Take 10 parts of organic carrier system and add 15 parts of epoxy resin E-44, after fully stirring evenly, add 75 parts of composite conductive filler, stir in a planetary mixer at 10r / min for 5 minutes, and vacuum at 25r / min Stir for 20 minutes, pause for 5 minutes and then stir for 10 minutes at 15 r / min. A copper-based composite conductive paste for thin film circuit boards is obtained.

[0049] (4) After...

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Abstract

The invention discloses copper-based composite conductive paste and a preparation method and an application thereof. The copper-based composite conductive paste comprises a binder, an organic carrierand metal conductive fillers. In the low-temperature curing of the copper-based composite conductive paste under the temperature of 180 DEG C-250 DEG C, SnAgCu alloy powders in the metal conductive fillers melt and chemically reacts with the surface of copper powders to produce an intermetallic compound, wherein the intermetallic compound comprises a Cu6Sn5 phase and a Cu3Sn phase; and the copperpowders in the cured copper-based composite conductive paste are connected with the SnAgCu alloy powders through the Cu6Sn5 phase and the Cu3Sn phase. Compared with the prior art, the copper-based composite conductive paste adopts the SnAgCu alloy powders and micrometer copper powders to improve the conductivity of a copper film, has a large tap density and a relatively low curing temperature, andis convenient for practical use; the low-cost copper powders are used to replace silver paste prepared by more expensive silver powders in some respects, so that the cost is greatly reduced; and meanwhile, the copper-based composite conductive paste does not cause pollution to the environment, accords with the environmental protection concept, and has a broad application prospect.

Description

technical field [0001] The invention relates to the field of electronic material science, in particular to a copper-based composite conductive paste with high conductivity and low curing temperature, a preparation method and application thereof. Background technique [0002] With the rapid development of the information age, the requirements for the miniaturization, multi-layering and chipping of electronic components are getting higher and higher. In the market, electronic pastes with gold, silver, nickel, copper and other metal powders as conductive functional phases are required. The demand for materials is also increasing. The physical characteristics of gold are low electrical resistivity, high thermal conductivity, and stable chemical properties, etc., but gold has disadvantages such as easy wear and high price, so gold is only selected under strict requirements for reliability and stability. as a conductive filler. Silver has the lowest resistivity and the highest t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00H05K1/09
CPCH01B1/22H01B13/00H05K1/092
Inventor 周健蒋成明许琪曼李赛鹏魏明震薛烽白晶
Owner SOUTHEAST UNIV
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