An addition-curable silicone composition comprising a phenyl group and capable of obtaining a cured product excellent in heat resistance, with little weight change and little discoloration at high temperatures. The addition-curable silicone composition of the present invention comprises the following components: (A-1) branched organopolysiloxane represented by formula (1); (A-2) linear organopolysiloxane represented by formula (2) Organopolysiloxanes, (B) organohydrogenpolysiloxanes, which have at least 2 or more hydrogen atoms bonded to silicon atoms in one molecule; (C) polyorganometallic siloxanes, containing Si‑O -Ce bond and Si-O-Ti bond, the Ce content is 50-5000ppm, the Ti content is 50-5000ppm, the viscosity at 25°C is 10-10000mPa·s, relative to the total number of organic groups contained in one molecule, having at least 10 mole percent aryl groups; and (D) a hydrosilylation catalyst comprising a platinum group metal.