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Formula of organic silicon rubber for light-emitting diode (LED) chip packaging

A technology of silicone rubber and LED chips, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem of heat dissipation, cold and heat shock, light transmission and poor toughness, which affect the service life of LEDs and cannot meet the requirements of power LED chips. Performance requirements and other issues, to achieve the effects of easy control of gel time, smooth vulcanization process, and high hardness

Inactive Publication Date: 2012-03-28
常熟市广大电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most of the general-purpose LED chip packaging materials use transparent epoxy resin as the main organic material. Poor, unable to meet the performance requirements of power LED chips, affecting the service life of LEDs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Its production process is as follows:

[0016] a) Material selection, vinyl silicone oil 55%, methyl hydrogen silicone oil 43%, platinum catalyst 0.5%, catalytic inhibitor 0.2%, functional filler 1.3%;

[0017] b) Material separation preparation, divide the raw materials into material A and material B, and mix and prepare them separately;

[0018] Material A: use vinyl silicone oil, platinum catalyst and catalytic inhibitor, of which vinyl silicone oil accounts for 75% of the total, the ratio of platinum catalyst to catalytic inhibitor is 10:1, and the main component of catalytic inhibitor is alicyclic Nitrogen-containing compounds;

[0019] The mixing method is as follows: First, add vinyl silicone oil and platinum catalyst in the reaction furnace, control the temperature at about 85°C, and stir thoroughly for 0.5-1 hour; then, add catalytic inhibitors, reduce pressure and heat up to about 180°C, and stir for 1- After 1.5 hours, material A was prepared;

[0020]...

Embodiment 2

[0029] Its production process is as follows:

[0030] a) Material selection, vinyl silicone oil 60%, methyl hydrogen silicone oil 38%, platinum catalyst 0.4%, catalytic inhibitor 0.25%, functional filler 1.35%;

[0031] b) Material separation preparation, divide the raw materials into material A and material B, and mix and prepare them separately;

[0032] Material A: use vinyl silicone oil, platinum catalyst and catalytic inhibitor, of which vinyl silicone oil accounts for 65% of the total, the ratio of platinum catalyst to catalytic inhibitor is 10:1, and the main component of catalytic inhibitor is alicyclic Nitrogen-containing compounds;

[0033] The mixing method is as follows: First, add vinyl silicone oil and platinum catalyst in the reaction furnace, control the temperature at about 75°C, and stir thoroughly for 0.6-1 hour; then, add catalytic inhibitors, reduce pressure and heat up to about 160°C, and stir for 1- After 1.5 hours, material A was prepared;

[003...

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Abstract

The invention discloses a formula of organic silicon rubber for light-emitting diode (LED) chip packaging. According to the formula, the organic silicon rubber mainly comprises 45 to 85 percent of vinyl silicon oil, 35 to 65 percent of methyl hydrogen-containing silicon oil, 0.3 to 0.7 percent of platinum catalyst, 0.2 to 0.45 percent of catalysis inhibitor, and 1.2 to 1.8 percent of functional filler. The invention discloses the formula of the organic silicon rubber for LED packaging; the components in the formula are reasonable, the sources of the raw materials are rich, and the prepared organic silicon rubber can fully meet the packaging requirements of LED chips with different power, and has high hardness, light transmission, cold and heat resistance, and toughness; meanwhile, a vulcanization process in the process for preparing the organic silicon rubber is smooth, gelling time is easy to control, harmful substances are not breeded, and the organic silicon rubber is a more environment-friendly organic material.

Description

technical field [0001] The invention relates to a formula of LED chip packaging materials, in particular to a formula of organic silicon rubber for LED chip packaging, and belongs to the technical field of LED chip packaging. Background technique [0002] Chip packaging technology is a process technology that wraps the chip to avoid contact between the chip and the outside world and prevent damage to the chip from the outside world. Impurities and bad gases in the air, and even water vapor will corrode the precision circuits on the chip, resulting in a decrease in electrical performance. Different packaging technologies differ greatly in terms of manufacturing processes and processes, and packaging also plays a vital role in the performance of the memory chip itself. With the rapid development of optoelectronic and microelectronic manufacturing technology, electronic products are always developing in the direction of smaller, lighter and cheaper, so the packaging form of ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05H01L33/56
Inventor 徐子旸
Owner 常熟市广大电器有限公司
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