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87 results about "Bonding problems" patented technology

Fluorine-containing nanoparticles with high dispersibility and bonding property and superamphiphobic surface

The invention discloses fluorine-containing nanoparticles with high dispersibility and bonding property and a superamphiphobic surface prepared from the nanoparticles. The fluorine-containing nanoparticles with high dispersibility and bonding property are prepared by the steps of grafting a fluorine-containing polymer with an upper terminal group to be a compound D on the surfaces of the nanoparticles, and reacting an epoxy resin polymer with a terminal group to be a compound A with the fluorine-containing polymer through a heat-breaking Diels-Alder reaction. The superamphiphobic surface disclosed by the invention is prepared by the steps of dispersing the fluorine-containing nanoparticles with high dispersibility and bonding property in a low-boiling-point fluorine-free solvent, uniformly mixing with an epoxy resin curing agent, carrying out spray coating on the surface of a substrate material, and carrying out vacuum drying. According to the fluorine-containing nanoparticles disclosed by the invention, the epoxy resin polymer with high dispersibility is introduced, as the epoxy functional group contained in the dispersing polymer can take place a curing reaction with the epoxy group by using the epoxy resin curing agent in the solvent to fix the fluorine-containing nanoparticles on the surfaces of most substrates, the bonding problem of the fluorine-containing nanoparticles on the substrate surface is solved.
Owner:中科瑞丽分离科技无锡有限公司

Oxygen supply sizing agent groove system and ceramic surface exposure 3D continuous printing method

The invention discloses an oxygen supply sizing agent groove system and a ceramic surface exposure 3D continuous printing method. The oxygen supply sizing agent groove system comprises an oxygen supply device, a base plate, a connecting pipe, an air-permeable thin film and a sizing agent groove which is of a cylindrical structure; an annular protrusion is horizontally arranged on the inner wall of the sizing agent groove, the upper surface of an annular groove is covered with the air-permeable thin film, the annular groove is formed in the lower surface of the annular protrusion, the base plate is fixed to the bottom of the sizing agent groove, an annular seal structure is defined by the annular groove and the base plate, and a seal chamber is defined by the base plate, the annular protrusion and the air-permeable thin film; multiple through holes are evenly formed in the side wall of the annular protrusion, the annular seal structure is communicated with the seal chamber through the through holes, one end of the connecting pipe is connected with the oxygen supply device, and the other end of the connecting pipe passes through the wall surface of the sizing agent groove and the side face of the annular groove and is inserted into the annual seal structure. By means of the oxygen supply sizing agent groove system, the bonding problem of ceramic biscuits and base plates can be effectively solved, and thereby the continuous ceramic printing is achieved.
Owner:陕西科陶增材智造科技有限公司

High sealing flexible composite film material for cold punching molding and its manufacturing method

The invention provides a high sealing flexible composite film material for cold punching molding. The composite film material comprises: a thermoplastic resin film inner layer, an aluminum foil metal core layer, and a heat resistant film outer layer. Specifically, the aluminum foil metal core layer is positioned between the thermoplastic resin film inner layer and the heat resistant film outer layer. The thermoplastic resin film inner layer is a multi-layer coextrusion layer containing at least two resin layers. The multi-layer coextrusion layer at least includes a surface heat seal layer and an inner composite layer, and the inner composite layer contacts the aluminum foil metal core layer. The surface heat seal layer contains a non-migrating inorganic additive with lubrication. The upper and lower surfaces of the aluminum foil metal core layer both undergo surface pretreatment. By adding the non-migrating inorganic additive with lubrication to the surface heat seal layer, the bonding problem caused by clinging of a composite material surface and a die can be prevented, and at the same time, air can permeate into the space between the composite material and the die along the gaps between tiny protuberances, so that the whole composite material is easy to undergo cold punching molding and die release. The invention also provides a preparation method of the flexible composite film material.
Owner:FSPG HI TECH

Sintered brick layered composite brick unloading method and device thereof

Provided are a sintered brick layered composite brick unloading method and a device thereof. The device comprises a hanging frame, an upper clamping hand and a lower clamping hand, wherein the upper clamping hand and the lower clamping hand are arranged on the hanging frame through a linear moving pair, the lower clamping hand is arranged on the outer side of the upper clamping hand, the upper clamping hand and the lower clamping hand are respectively provided with a set of driving mechanism, and the driving mechanisms drive the upper clamping hand and the lower clamping hand to be unfolded and folded. The lower clamping hand comprises two sets of lower clamping arm components, each lower clamping arm component comprises a lower clamping arm, a lower clamping sheet and a guide rod which is connected with the lower clamping arm and the lower clamping sheet, each lower clamping arm and each guide rod or each guide rod and each lower clamping sheet can move freely in an up-down relative mode, and the lower edge of each lower clamping sheet is lower than the lower edge of the upper clamping hand. According to the sintered brick layered composite brick unloading method and the device thereof, a layered composite is adopted, after seam closing is conducted on bricks, the bricks are clamped and stacked, the labor of manual seam closing is replaced, moreover, when the upper clamping hand clamps the bricks on the upper layer, the lower clamping hand can fix the bricks on the adjacent lower layer, the bricks on the upper layer are prevented from being driven to move or rise, the bonding problem of adjacent layers of bricks is solved, mechanical brick loading is achieved, the production efficiency is greatly improved, and the labor intensity of workers is lowered.
Owner:LUOYANG ZHONGYE HEAVY IND GRP CO LTD

Easy-cold-punch-molding soft packaging composite material, and preparation method and molding method thereof

ActiveCN103331957AAvoid "sticking" problemsThe surface coefficient of friction value is reducedMetal layered productsAluminum foilBonding problems
The invention provides an easy-cold-punch-molding soft packaging composite material. The composite material comprises a thermoplastic resin film layer, an aluminum foil metal core layer, and a heatproof or printing film layer; the aluminum foil metal core layer is positioned between the thermoplastic resin film layer and the heatproof or printing film layer; the thermoplastic resin film layer comprises a surface heat-sealing layer and a hot melt adhesive resin layer compounded with the aluminum foil metal core layer; and the surface of the heat-sealing layer has fine slight convex-concave lines formed through heating roll molding in the compounding process, and the convex-concave depth of the fine slight convex-concave lines is 0.5-25mum. By utilizing the fine convex-concave characteristics of the fine slight convex-concave lines, a bonding problem formed by the clinging of the surface of the composite material and a die can be avoided during stamping, and air can be residual in a slit between the die and the convex-concave lines on the surface of the composite material during the stamping, so the surface friction coefficient value of the composite material is greatly reduced, and it is in favor of demolding the composite material in the cold punch molding process. The invention also provides a preparation method of the composite material, and a molding method when used.
Owner:FSPG HI TECH

Double-effect isolation liquid for oil-based mud cementing, and preparation method thereof

The present invention discloses a double-effect isolation liquid for oil-based mud cementing, and a preparation method thereof, wherein the raw materials comprise, by weight, 100 parts of clear water, 10-20 parts of a rinsing agent, 10-15 parts of a filler, 1-5 parts of a retarding agent, 0.1-0.2 part of an antifoaming agent, 0-260 parts of a weighting agent, and 1-2 parts of an isolation agent. The preparation method comprises: adding 1-2 parts of an isolation agent to 100 parts of clear water, completely and uniformly stirring at a low speed, slowly adding 15-20 parts of a filler and 1-5 parts of a retarding agent, adding a weighting agent according to a density requirement after the base liquid preparation is completed, uniformly stirring, adding 10-15 parts of a rinsing agent, maintaining low speed rotation, adding 0.1-0.2 part of an antifoaming agent after the liquid distribution is uniform, and continuously stirring for 1-2 h while maintaining the rotation speed. According to the present invention, with the double-effect isolation liquid for oil-based mud cementing, the lipophilic interface is converted into the hydrophilic interface, such that the pollution of the oil-based on the conventional cement slurry system is reduced, the bonding problem of the two interfaces is solved, the high quality cementing and the sealing fixing of the annulus interface are achieved, and the stability of the mud is ensured.
Owner:成都欧美克石油科技股份有限公司

Raw gas waste heat recycling and exchanging unit of anti-bonding gravity-flowing coke oven

The invention discloses a raw gas waste heat recycling and exchanging unit of an anti-bonding gravity-flowing coke oven, and belongs to the technical field of recycling raw gas waste heat produced in the coking process. A heat exchange unit body comprises a plurality of single-row components, the plurality of the single-row components are arranged in same spaces and fixed together to form a cuboid structural heat exchange unit body, the single-row components are formed by welding heat exchange vertical pipes, heat exchange transverse pipes and heat exchange working medium conveying pipes in a permutation and combination way. Non-viscous coatings are coated on the surfaces of the single-row components, and the heat exchange unit body is inclined upwards along a horizontal plane. According to the arrangement, the tar bonding problem, which is produced in the process of recycling the raw gas waste heat, is solved; and meanwhile, recycled tar is reused, and resources are saved. According to the raw gas waste heat recycling and exchanging unit of the anti-bonding gravity-flowing coke oven, after heat is exchanged, the discharge temperature of the raw gas is reduced below 250 DEG C, the heat exchange effect of the raw gas is greatly improved, effective sensible heat in the raw gas is completely recycled, heat waste is prevented, and requirements on energy conservation and emission reduction are met.
Owner:MAANSHAN TIANZHOU ENERGY SAVING ENG TECH

Heat vulcanization bonding technology for fluorine rubber and silica gel

The invention belongs to the technical field of rubber manufacture, and relates to a heat vulcanization bonding technology for fluorine rubber and silica gel with low cost and excellent performance, the technology enabling ordinary fluorine rubber and silica gel to bond vulcanizedly. The heat vulcanization bonding technology for the fluorine rubber and the silica gel rolls bonding compositions to thin sheets, puts the bonding compositions between the inner layer fluorine rubber and the silica gel to form a semi-finished product having a structure of the inner layer fluorine rubber, the bonding compositions and the silica gel, and then heats and vulcanizes to fixedly bond the inner layer fluorine rubber and the silica gel. The inner layer fluorine rubber is mixed from the following components in part by weight: 100 parts of fluorine rubber, 8 to 10 parts of active magnesium oxide, 5 to 6 parts of calcium hydrate, 0.5 to 1 part of magnesium methacrylate, 8 to 10 parts of carbon black, 5 to 6 parts of calcium silicate, 1.2 to 1.5 parts of bisphenol AF, 2 to 3 parts of a cross-linking agent and 2 to 2.5 parts of a vulcanizing agent. The bonding compositions is mixed from the inner layer fluorine rubber, the silica gel and a fluorine coupling agent F-1 in a weight ratio of 3.8-4.2 : 4.6-5.5 : 1. The technology employs an intermediate transition layer to solve the bonding problem of the fluorine rubber and the silica gel.
Owner:NINGBO FENGMAO FAR EAST RUBBER

3D printer head and 3D printer

The invention provides a 3D printer head and a 3D printer. The 3D printer head comprises a printer head main body and a machine frame, wherein the printer head main body comprises a feeding end and adischarging end; a feeding cavity is formed between the feeding end and the discharging end, and two end parts of the feeding cavity are correspondingly in communication with the feeding end and the discharging end; a rotating shaft is arranged in the feeding cavity, the machine frame is connected with the top of the rotating shaft through a connecting block, and a material extruding mechanism isconnected with the bottom of the rotating shaft; a heating and melting mechanism is annularly arranged on the outer wall of the feeding cavity, a crushing mechanism is arranged on the inner wall of the printer head body, and the heating and melting mechanism is connected with the bottom of the crushing mechanism; and a pre-heating mechanism is arranged on the side portion of the discharging end, and the pre-heating mechanism is connected with the bottom of the heating and melting mechanism. The 3D printer is not limited to a feeding form, the bonding problem among printing layers are effectively improved, and bad bonding phenomena such as cracking, faults, warping and the like among the printing layers are solved.
Owner:KUNSHAN KADAM NEW MATERIAL TECH CO LTD

COB display screen packaging method based on copper wire bonding

The invention provides a COB display screen packaging method based on copper wire bonding. The COB display screen packaging method comprises the following steps of S1, carrying out die bonding; S2, baking and curing the die bonding glue; S3, welding copper wires, and forming a COB display module based on copper wire bonding; S4, carrying out a lightening test, if the product is a good product or adie bonding problem exists, carrying out the next step, if a wire bonding problem exists, removing damaged wires or pseudo soldering wires, and returning to the step S3 again; S5, carrying out packaging for the first time, adopting discrete glue for packaging, and manufacturing an inner protective colloid on each pixel point, wherein the inner protective colloids are not connected with one another and n a discrete state; S6, removing the inner protective colloid at a failure position; S7, cleaning the failed chip and the copper wires; S8, repairing the chip, baking and curing the die bondingglue, and repairing and welding the copper wires; and S9, carrying out the lightening test, if the product is a defective product, returning to the step S7, and if the product is a good product, carrying out secondary packaging. The beneficial effects are that the copper wire welding technology is applied to production of the COB display screen, and the cost is reduced.
Owner:深圳市科米三悠科技有限公司

Chip bonding pad layout design method suitable for multiple different encapsulation requirements

ActiveCN103903996AMeet the requirements of adapting to different packagesLow costSolid-state devicesSemiconductor/solid-state device manufacturingEngineeringBonding problems
The invention discloses a chip bonding pad layout design method suitable for multiple different encapsulation requirements. According to the total number of bonding pads, the number of the bonding pads at each side of a chip and the dimensions of the chip in the length direction and in the width direction are determined; a basic encapsulation type is determined; the number and the positions of the bonding pads at each side of the chip are adjusted; another encapsulation type is selected, and a bonding figure is designed; optimizing methods of bonding the different bonding pads that the bonding pads with the bonding problem or different encapsulation types are replaced by moving the bonding pad positions with the bonding problem and increasing the number of the bonding pads are adopted, so that the bonding pads can meet the requirements of the different encapsulation types; the final bonding figure is designed. By means of the optimized layout of the chip bonding pads designed by the adoption of the design method, the phenomenon that the different encapsulating can not be conducted to the same chip unless the layout design is changed is solved, the requirement that the same chip can be suitable for different encapsulating is met, flexibility of chip encapsulating and chip applying is achieved, and cost is reduced.
Owner:EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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