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COB display screen packaging method based on copper wire bonding

An encapsulation method and display technology, which can be applied to identification devices, instruments, electrical components, etc., can solve problems such as hindering the application of copper wire welding technology, and achieve the effect of reducing costs.

Inactive Publication Date: 2019-10-22
深圳市科米三悠科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem of copper wire baking oxidation hinders the application of copper wire welding technology in the production of COB display screens

Method used

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  • COB display screen packaging method based on copper wire bonding
  • COB display screen packaging method based on copper wire bonding
  • COB display screen packaging method based on copper wire bonding

Examples

Experimental program
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Embodiment Construction

[0033] The present invention will be further described below in conjunction with the description of the drawings and specific embodiments.

[0034] like Figure 3 to Figure 6 As shown, a COB display packaging method based on copper wire bonding includes the following steps:

[0035] S1, solid crystal;

[0036] S2, the crystal-bonding glue is baked and solidified;

[0037] S3, copper wire welding, based on copper wire bonding, to form a COB display module (module for short), including PCB1, chip 2, and IC3;

[0038] S4, lighting test, if it is a good product or there is a problem of die bonding, then enter the next step, if there is a problem with the bonding wire, clear the broken wire or virtual bonding wire and return to step S3;

[0039] S5. For the first packaging, separate plastic packaging is used, and an inner protective colloid 5 is made on each pixel, and each inner protective colloid 5 is not connected to each other and is in a discrete state;

[0040] S6, remove...

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PUM

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Abstract

The invention provides a COB display screen packaging method based on copper wire bonding. The COB display screen packaging method comprises the following steps of S1, carrying out die bonding; S2, baking and curing the die bonding glue; S3, welding copper wires, and forming a COB display module based on copper wire bonding; S4, carrying out a lightening test, if the product is a good product or adie bonding problem exists, carrying out the next step, if a wire bonding problem exists, removing damaged wires or pseudo soldering wires, and returning to the step S3 again; S5, carrying out packaging for the first time, adopting discrete glue for packaging, and manufacturing an inner protective colloid on each pixel point, wherein the inner protective colloids are not connected with one another and n a discrete state; S6, removing the inner protective colloid at a failure position; S7, cleaning the failed chip and the copper wires; S8, repairing the chip, baking and curing the die bondingglue, and repairing and welding the copper wires; and S9, carrying out the lightening test, if the product is a defective product, returning to the step S7, and if the product is a good product, carrying out secondary packaging. The beneficial effects are that the copper wire welding technology is applied to production of the COB display screen, and the cost is reduced.

Description

technical field [0001] The invention relates to a COB display packaging method, in particular to a COB display packaging method based on copper wire bonding. Background technique [0002] In the packaging process of LED display lamp beads, there are mainly two types of bonding wires: gold wires and copper wires. Gold wire bonding has high stability and low process difficulty. The process control of copper wire bonding is difficult, copper wire is easy to oxidize, and the contact resistance of copper wire is smaller than that of gold wire. Due to the high price of gold wires, many LED display lamp beads on the market now use copper wire bonding technology. The price of using copper wire bonding is more than 20% higher, and some products are even more than 30%. [0003] The COB display is a new product that combines the LED lamp bead manufacturing process with the display manufacturing process, reducing many unnecessary process steps. In the traditional SMT display, the LE...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62G09F9/33H01L33/00
CPCG09F9/33H01L25/0753H01L33/005H01L33/48H01L33/62H01L2224/48091H01L2924/181H01L2924/00012H01L2924/00014
Inventor 罗新房
Owner 深圳市科米三悠科技有限公司
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