49 results about "Secondary bonding" patented technology

The disclosed technology can provide an improved connection system for multiple conductors. A grounding connector system can include a connector body with a main bonding receptacle and a secondary bonding receptable, to receive and provide an electrical connection between a first conductor and one or more second conductors. The secondary bonding receptacle can include tapered side walls or a substantially planar area.

The invention belongs to the technical field of polymer composite materials, and discloses a leather collagen fiber / polyurethane composite material and a preparation method thereof. The metal-polyphenol coordination network interface layer provided by the invention is accurately positioned on the surface of the leather collagen fiber and is between the fiber and a waterborne polyurethane matrix, and a three-stage structure of'fiber-interface layer-matrix 'is constructed. The interface layer forms a stable network through coordination of metal nanoparticles and polyphenol, and forms chemical bridging with a WPU matrix through secondary bonding. According to the structure, the tearing strength and the tensile capacity of the composite material are greatly improved, the limitation that reinforcement and toughening are difficult to consider in traditional physical blending modification is broken through, and a synergistic reinforcement effect is generated.

The invention relates to the technical field of bio-based polyamide modification, and discloses a bio-based polyamide modified raw material composition for improving the surface hairiness distribution of bunchy yarn, which comprises the following components in percentage by mass: 2.5-6.0% of bio-based polyamide 1010 resin, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3500-5500g / mol, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3,500-5,500 g / mol, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3,500-5,500 g / mol, the functional components are driven to migrate to a surface layer and generate interface secondary bonding by utilizing reaction activity and temperature drop rate coupling among the components and a temperature drop rate difference generated corresponding to an axial variable cross section of the slub yarn, and a thickness heterogeneous interface layer is spontaneously constructed at slubs and details; the technical contradiction that a homogeneous modified material cannot be matched with a non-uniform thermal field is solved, and the physical integrity of the fiber surface is improved.

The invention discloses a precipitation-free rubber material for a stabilizer bar bushing and a preparation method of the precipitation-free rubber material, and particularly relates to the technical field of automobile part materials. The precipitation-free rubber material for the stabilizer bar bushing comprises 100 parts of natural rubber; 4-8 parts of zinc oxide; 1-3 parts of stearic acid; 3-8 parts of a compound anti-aging agent; 20 to 60 parts of carbon black; 0.3-2 parts of a vulcanizing agent; 1.5 to 5.5 parts of a compound accelerant; and 0.1 to 0.5 part of scorch retarder. The anti-aging agent in the formula is reasonably matched to replace traditional protective paraffin, the problem of protective paraffin precipitation is avoided while the excellent ozone resistance of the rubber material is ensured, the problem of secondary bonding degumming of the stabilizer bar bushing is effectively solved, and the rubber material also has good hardness, breaking strength, elongation at break, pressure change and other physical properties, and is suitable for popularization and application. The anti-aging performance is better, and the service life is long.

The present application relates to the technical field of light collecting plate manufacturing, and particularly relates to a light collecting plate film pasting process and a film pasting device for a solar combined heat and power assembly, which comprises the following steps: a plurality of secondary parabolic support plates are stacked from top to bottom to form a support plate array; an adhesive is coated on the film pasting surface of the top secondary parabolic support plate of the support plate array by using an adhesive coating assembly; a reflective film is placed on the film pasting surface of the secondary parabolic support plate coated with the adhesive and is aligned, and an external force is applied to the reflective film to perform primary bonding; the secondary parabolic support plate after the film is placed is placed at the bottom layer of the support plate array, and secondary bonding is performed by relying on the self weight of the support plate array; the aforementioned steps are cycled until the film pasting is completed, and a light collecting plate array is formed. The present application can realize fast film pasting of the light collecting plate of the solar combined heat and power assembly and ensure the pasting quality by relying on the self weight of the support plate array for secondary bonding.

The invention discloses a preparation method of high-performance powder metallurgy heat-resistant stainless steel, and belongs to the technical field of heat-resistant stainless steel preparation. S2, water and gas combined atomization is carried out; s3, powder pretreatment; s4, cold isostatic pressing forming is carried out; s5, vacuum or nitrogen sintering is carried out; the method has the advantages of being short in preparation process, high in material utilization rate, uniform in component structure distribution, high in second-phase bonding strength, good in mechanical property and free of metallurgical defects, and solves the problems that heat-resistant stainless steel prepared through an existing smelting method has component segregation and metallurgical defects and is not uniform in structure distribution, the preparation process is long, the material utilization rate is low, and the cost is low. Particularly, when ceramic particles are introduced, due to the fact that the density difference between a ceramic reinforced phase and a stainless steel matrix is large, wettability is poor, and the problems that the distribution of the reinforced phase of the heat-resistant stainless steel is not uniform and the bonding strength is low are easily caused.

The invention relates to the technical field of composite materials, and discloses an impact resistance-wave absorption integrated fiber reinforced composite material and a preparation method thereof.The preparation method comprises the following steps that 1, N layers of carbon fiber prepregs and M layers of wave-transparent fiber prepregs are sequentially laid from bottom to top, and laminated prepregs are obtained; 2, pre-arranging conductive fibers which are arranged in an array mode and are perpendicular to the direction of the plane where the surface of the base body is located in the plate-shaped base body to obtain a fiber carrier; 3, after the laminated prepreg is preheated and softened, the fiber carrier is implanted into the laminated prepreg under the heating and pressurizing conditions, meanwhile, curing and cooling are conducted, and then the needed composite material plate can be obtained; a carrier pre-fixing-one-step hot-pressing curing method is adopted, and the implanting process of the conductive fibers and the integral forming process of the composite material are combined into a whole; the preparation method is simple, secondary bonding or complex post-treatment is avoided, and synchronous forming and firm combination of the structural layer, the conductive fibers and the resin matrix on the microscopic scale are achieved.

The absorbent article includes a first waist region and a second waist region, and a crotch region disposed between the first waist region and the second waist region. The absorbent article includes a chassis having a topsheet, a backsheet, and an absorbent core disposed between the topsheet and the backsheet. At least one elastic ear including a laminate is joined to the chassis. The laminate is an ultrasonic bonded laminate of an elastomer layer and a nonwoven layer. The bonding pattern includes a plurality of separate primary ultrasonic bonds and a plurality of secondary ultrasonic bonds. The primary bonds permanently attach the layers of the laminate, and the secondary bonds releasably attach the layers of the laminate. The secondary bonds release when the laminate is stretched in the longitudinal direction.

This invention discloses a method for manufacturing a non-uniform diameter, thick, closed-type tubular carbon fiber beam in the field of carbon fiber beam technology for wind tunnel blades. The method includes: S1, disassembling the carbon fiber beam structure and preparing a specially designed mold with corresponding cavities; S2, laying a carbon fiber preform on the mold; S3, assembling the preform after demolding and fixing the mold; S4, setting vacuum bags and placing vacuum nozzles on the inner and outer sides of the assembled mold; S5, placing the mold in a thermosetting device and using a gradient curing process with vacuum pressure for curing; S6, demolding after cooling. This invention, by employing co-curing in a thermosetting tank, results in excellent overall performance of the carbon fiber beam, eliminating the need for additional adhesives and secondary bonding steps, reducing air bubbles and defects. Simultaneously, dividing the carbon fiber beam into three parts disperses the thickness, improving the laying quality and efficiency, increasing the bonding surface of the carbon fiber beam, and enhancing the bonding strength.

The invention belongs to the field of semiconductor integrated circuit packaging, and discloses a bare copper carrier thermal ultrasonic bonding and chip packaging method and a chip, an oxide layer of a bare copper carrier bonding area is ground and broken through a chopper to form a clean grinding bonding area, chip / pin interconnection is achieved through direct thermal ultrasonic bonding in the grinding bonding area, then silver glue is dispensed to wrap welding spots, then curing is conducted, and the chip / pin is packaged. And finally, chip-pin bonding is completed. The oxidation layer is physically broken through grinding, so that the problem of bare copper bonding oxidation is fundamentally solved, and a traditional plating process is omitted; silver colloid wrapping not only can isolate secondary oxidation of the welding spots, but also enhances the bonding interface of the molding compound, and secondary bonding after curing ensures that the silver colloid does not interfere with lead bonding. A precious metal coating and an anti-oxidation gas protection system are thoroughly eliminated, and the frame material and equipment modification cost is greatly reduced; the bonding reliability is guaranteed through oxide layer breaking, the welding spot oxidation resistance and the packaging structure binding force are synchronously improved through elargol wrapping, and the dual purposes of high-reliability packaging and remarkable cost reduction are achieved on a bare copper carrier as a whole.

The present invention provides a reflector structure capable of rapid passive temperature equalization and a preparation method thereof, comprising an inner skin, an outer skin, and a sandwich layer, wherein the inner skin is arranged on the concave side of the reflector, the outer skin is arranged on the protruding side of the reflector, and the sandwich layer is arranged between the inner skin and the outer skin; the inner skin and the outer skin are both carbon fiber laminates; the sandwich layer comprises a supporting structure and a heat-conducting functional structure, and the supporting structure is filled between the heat-conducting functional structure and the inner skin and the outer skin. The present invention can effectively improve the thermal conductivity by using a sandwich layer containing a supporting structure and a heat-conducting functional structure, thereby improving the uniformity of the reflector's own temperature field under conditions of extreme temperature distribution differences. The present invention realizes the integrated manufacturing of the reflector through RTM one-piece molding, reduces the structural deformation caused by secondary bonding, and thus improves the molding accuracy of the reflector itself.

The application discloses a MEMS sensor structure and a forming method, which can reduce the probability of edge area fragmentation of a first wafer, and reduce the probability of device failure. The MEMS sensor structure comprises the first wafer, a surface and / or an internal functional device, the first wafer comprises a first surface and a second surface arranged oppositely, the first surface is provided with a pad, the pad is located outside the area of the functional device, and is electrically connected to the functional device and used for bonding wire to electrically connect the functional device to the outside of the first wafer. The second wafer is supported by a first bonding assembly and is bonded to the second surface of the first wafer oppositely. The first bonding assembly comprises a main bonding piece, which is arranged around the functional device, is annular, and forms a first cavity between the main bonding piece, the first wafer and the second wafer. A secondary bonding piece is bonded between the first wafer and the second wafer and is arranged outside the main bonding piece. The distribution area of the secondary bonding piece is opposite to the position of the pad, and the pad of the first wafer is supported.

The invention discloses a composite material and a co-bonding method thereof, and relates to the technical field of composite material forming. The composite material co-bonding method comprises the steps of pre-assembly, honeycomb dehumidification, pre-leveling, skin checking, heat sealing and pressing, pre-bonding, skin wet laying and co-bonding forming. The composite material co-bonding method disclosed by the invention has the advantages of simple process and low cost, and compared with secondary bonding in the prior art, the composite material co-bonding process disclosed by the invention is easier to realize industrial production.

This application discloses a fabrication process for a secondary-bonded lithium tantalate composite substrate and a flexible lithium tantalate composite substrate, belonging to the field of flexible ultrathin lithium tantalate wafer fabrication technology. The process includes the following steps: (1) ion implantation of a lithium tantalate wafer and pre-annealing of a substrate wafer; (2) activation and bonding of the implantation surface of the lithium tantalate wafer and the substrate wafer to obtain a first bond, and thinning the lithium tantalate wafer of the first bond to a thickness of 2-50 μm; (3) secondary bonding of the lithium tantalate wafer of the first bond to a flexible substrate to obtain a second bond; (4) annealing and peeling of the second bond to obtain a flexible lithium tantalate composite substrate and a heterogeneous thin-film bonded substrate. This method achieves permanent bonding between an ultrathin lithium tantalate wafer and a flexible substrate through a two-step bonding process, transforming the lithium tantalate wafer from a "fragile thin sheet" into a practical, integrable, and flexible lithium tantalate composite substrate suitable for flexible devices.

The invention provides a double-layer SOI substrate and a preparation method thereof, and the preparation method comprises the following steps: providing a first silicon wafer, and forming a first oxide layer on the surface of the first silicon wafer; providing a second silicon wafer, and performing primary bonding on the first oxide layer and the second silicon wafer; performing primary thinning and polishing treatment on the surface of the bonded second silicon wafer to form a first device layer; providing a third silicon wafer, and forming a second oxide layer on the surface of the second silicon wafer or the third silicon wafer; carrying out secondary bonding on the second oxide layer and the second silicon wafer or the third silicon wafer on which the second oxide layer is not formed; the secondary bonding is high-pressure vacuum bonding, the pressure is 5-20 KN, the vacuum degree is 10 <-3 >-10 <-5 > mbar, and the bonding time is 5-20 min; and carrying out secondary thinning and polishing treatment on the surface of the bonded third silicon wafer to form a second device layer. The invention also discloses the double-layer SOI substrate obtained by the preparation method. According to the method, the double-layer SOI substrate with the adjustable thickness of the device layer and the oxide layer can be obtained, the technological process for manufacturing a device by using the substrate is simplified, or a special structure is easy to obtain.

This utility model relates to the field of precast composite slabs. Its purpose is to provide an ultra-heavy precast composite slab, comprising a composite slab body. Within the composite slab body, a reinforcing cage, several strip-shaped reinforcing trusses, and prestressed reinforcing bars are pre-embedded. The upper part of the reinforcing cage extends beyond the top surface of the composite slab body, with both ends of the extended portion pre-cast with concrete to form reinforcing beam ends, while the middle section of the extended portion forms a reinforcing beam casting area. The strip-shaped reinforcing trusses are located around the reinforcing beams, and their upper parts also extend beyond the top surface of the composite slab body. The prestressed reinforcing bars are located below the strip-shaped reinforcing trusses, with their ends extending beyond the left and right end faces of the composite slab body. This utility model possesses excellent structural rigidity, load-bearing capacity, and superior secondary bonding with cast-in-place concrete.

The invention belongs to the technical field of anti-elastic composite materials, and particularly relates to a heterostructure aramid fiber composite material and a preparation method thereof.A panel of the composite material is an aramid fiber reinforced thermosetting phenolic resin composite material, and a back plate of the composite material is an aramid fiber reinforced thermoplastic polyurethane resin composite material; the heterogeneous prepreg is prepared in a glue solution brushing mode, the integral heterogeneous composite material is prepared through a common laying one-step hot press molding method, and the layering problem caused by secondary bonding of the heterogeneous material is avoided. Compared with a single aramid fiber composite material, the heterostructure anti-elastic composite material prepared by the method has the advantages that the mechanical property and the anti-elastic property are improved in a balanced manner. The method is simple in process, the heterostructure composite material is good in integrity and suitable for large-scale industrial production, and a feasible way is provided for structural regulation and control of the anti-elastic composite material prepared through the hot press molding process.

The present invention relates to a method for recycling a current collector, comprising the following steps: S1, laminating the A surface of the waste current collector with the A surface of the normal current collector; S2, plating through an acid plating tank and then a conductive tank; S3, drying; S4, peeling, obtaining separated waste current collectors and a normal current collector with single-sided coating; S5, laminating the B surface of the waste current collector with the B surface of the normal current collector; S6, repeating the above steps S2-S4; S7, obtaining a recyclable current collector and a normal current collector with double-sided coating; S8, recycling the current collector, crushing, and remaking. The present invention laminates and peels the waste current collector with the normal current collector twice, and processes one side each time with the same processing steps, so that the metal on one side of the waste current collector is dissolved and the one side of the normal current collector is plated, so that the current collector film is produced while the waste current collector is effectively processed, and the recycling and production are carried out simultaneously, which greatly improves the efficiency.

The utility model discloses an acupoint pressure stimulation patch, and relates to the technical field of pressure stimulation patches. The acupoint pressure stimulation patch comprises a body, two main bonding areas are arranged on the surface of the upper side of the body, an ointment bonding area is arranged on the surface of the upper side of the body, the ointment bonding area is round, a connecting area is arranged between the ointment bonding area and the two main bonding areas, release paper is arranged on the surface of the upper side of the body, and the connecting area is arranged between the ointment bonding area and the two main bonding areas. The shape of the release paper is the same as the shape of the main bonding area, the shape of the ointment bonding area and the shape of the connecting area, the upper side surface of the circular area of the release paper is fixedly connected with a positioning protrusion, an auxiliary bonding area is arranged on the upper side surface of the body, and second release paper is arranged on the auxiliary bonding area. According to the acupoint pressure stimulation patch, the application position can be accurately positioned when the acupoint pressure stimulation patch is autonomously applied, the patch can be easily torn off when the patch is wrongly applied through the auxiliary bonding area, and the viscosity during subsequent complete application is not affected.

The invention discloses a frame and truss integrated combined foam interlayer integral forming device, and relates to the technical field of injection molding equipment, the frame and truss integrated combined foam interlayer integral forming device comprises a workbench, a lower forming mold is fixedly arranged on the upper portion of the workbench, a supporting plate is vertically and fixedly arranged on the side wall of one side of the workbench, and a mounting plate is transversely and fixedly arranged on the upper portion of the supporting plate; a hydraulic oil cylinder A is fixedly arranged on the upper portion of the mounting plate, an upper forming die is fixedly arranged on a piston rod of the hydraulic oil cylinder A through a fixing plate, a frame truss is placed on the upper portion of an inner cavity of a lower forming die, and the upper forming die and the lower forming die are matched to enable the frame truss to be embedded and fixed in the foam plate. The lower forming die and the upper forming die can completely wrap the frame truss serving as a sandwich in the inner cavity of the foam board, and compared with a traditional secondary cementing mode, the frame truss and the foam board are subjected to integrated injection molding, so that erosion of the external environment can be effectively resisted.

The invention relates to the technical field of mobile phone panel production equipment, and discloses secondary attaching equipment for flexible transparent materials, which comprises an X-direction module, a Y-direction module, a long edge rolling unit and two short edge rolling units, the long edge rolling unit and the two short edge rolling units are arranged side by side, the X-direction module is positioned above the long edge rolling unit, and the Y-direction module is positioned above the Y-direction module. The two Y-direction modules are located above the two short edge rolling units correspondingly. The long edge rolling unit and the short edge rolling unit each comprise a pressure applying assembly, the pressure applying assembly of the long edge rolling unit is arranged on the X-direction module, the pressure applying assembly of the short edge rolling unit is arranged on the Y-direction module, and a rolling module is arranged at the power output end of each pressure applying assembly. According to the secondary attaching equipment for the flexible transparent material, the problem that corner areas of an existing mobile phone panel are not fully attached is solved.

The invention discloses a multi-curvature thin-wall composite material pipe fitting forming tool and method, and belongs to the technical field of composite material forming. The forming tool comprises an upper half die, a lower half die, a first check block and a second check block, and the first check block and the second check block are detachably connected with the lower half die through guide columns; the inner sides of the first check block and the second check block extend into a cavity of the lower half die, the side walls of the inner sides of the first check block and the second check block are stepped surfaces or inclined surfaces or curved surfaces, and the side walls of the inner sides of the first check block and the second check block are used for inwards and obliquely limiting the part, extending out of the molded surface of the lower half die, of a lower half die blank. The forming method comprises the steps that stepped material spreading is conducted on the upper half die and the lower half die, and the problem that the extending blank part is easily clamped between the upper half die and the lower half die during die assembly is solved through the forming tool. According to the forming tool and the forming method, the product quality and the qualified rate are improved, the cost is reduced, secondary bonding is not needed, the manufacturing period is shortened, and the production efficiency is improved.

The application belongs to the field of sandwich composite materials, and relates to a honeycomb sandwich metamaterial resistant to 350 DEG C high temperature and a preparation method thereof. The honeycomb sandwich metamaterial resistant to 350 DEG C high temperature comprises high-temperature-resistant upper and lower skins, high-temperature-resistant adhesive films and high-temperature-resistant honeycomb metamaterials. The high-temperature-resistant honeycomb metamaterials are located between the high-temperature-resistant upper skin and the high-temperature-resistant lower skin, and the high-temperature-resistant adhesive films are located between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant upper skin and between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant lower skin. According to the forming process of the resin system of the skin, the forming method of the honeycomb sandwich metamaterial resistant to 350 DEG C high temperature can be divided into two types: co-curing forming and secondary bonding forming. The honeycomb sandwich metamaterial resistant to high temperature with frequency selection effect is innovatively prepared, the current preparation problem of the honeycomb sandwich composite material resistant to 350 DEG C high temperature is solved, and the honeycomb sandwich composite material resistant to 350 DEG C high temperature is endowed with superior filtering response characteristics.

1. Name of the product in this design: Table tennis racket rubber re-attachment aid. 2. Purpose of this design: To assist in the secondary bonding of rubber on table tennis rackets. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The invention discloses an infrared emission assembly, a cover body and a cooking utensil. The infrared emission assembly comprises a supporting frame which is provided with a bearing surface; the infrared emission layer comprises an ore particle layer and an adhesive layer, the ore particle layer is constructed to be formed by arranging a plurality of ore particles, the ore particle layer is adhered to the bearing surface through the adhesive layer, and the ore particles can emit infrared rays; the infrared emission layer is formed by the following processes: applying an adhesive to the bearing surface, arranging an ore particle layer, applying the adhesive to the ore particle layer again, and solidifying. According to the infrared emission assembly, through a secondary bonding process, bonding between the ore particle layer and the bearing surface and bonding between the ore particles are firmer, falling or shaking of the ore particles is avoided, the stability of the assembly structure is guaranteed, and the use experience of a user is improved.

The invention provides an automobile loudspeaker magnetic circuit bonding device. The automobile loudspeaker magnetic circuit bonding device comprises a machine base, a conveying mechanism, a primary bonding mechanism and a secondary bonding mechanism. The conveying mechanism comprises a rail, a plurality of jigs and a conveying driving assembly. The primary bonding mechanism comprises an upper clamping plate feeding assembly, a primary gluing assembly, a magnet feeding assembly, a primary pressing assembly, a primary drying assembly and a cleaning assembly. The secondary bonding mechanism comprises a secondary gluing assembly, a T iron feeding assembly, a secondary pressing assembly and a secondary drying assembly. According to the magnetic circuit bonding device for the automobile loudspeaker, after the magnet is bonded to the surface of the upper clamping plate, through the cleaning assembly, adhesive left on the inner circumferential side of the magnet, the side, facing the magnet, of the upper clamping plate and the inner circumferential side of the upper clamping plate can be cleaned, the adhesive can be prevented from interfering installation of T iron and a voice coil, the forming quality of a product can be improved, and the production efficiency is improved. And smooth processing can be ensured.

The application discloses a reversible acrylate adhesive with excellent secondary bonding strength and a preparation method, a use method and an application thereof. The adhesive is a new reversible acrylate adhesive formed by combining the reversible anthracene group with the good double bond environment and pressure-sensitive characteristics of the acrylate system. Through the steps of photocuring, thermal depolymerization and photocuring, the problem of reduced strength after secondary bonding of the existing reversible adhesive is overcome, and the shear strength after secondary bonding is increased by 42% compared with that after primary bonding. In addition, the debonding rates of the adhesive in the present application in two debonding processes are 91% and 82% respectively, and the adhesive has good debonding performance. Therefore, the reversible acrylate adhesive can be effectively applied in the electronic field and solve the problem of poor mechanical properties after secondary bonding in the existing reversible electronic adhesive field.

The invention provides a preparation method of a composite substrate, the composite substrate and a surface acoustic wave filter, and the preparation method comprises the steps: providing a first substrate, a second substrate and a piezoelectric wafer, carrying out the thermal oxidation treatment of the second substrate, forming an oxidation layer on a to-be-bonded surface of the second substrate, and carrying out the bonding of the to-be-bonded surface of the second substrate; carrying out ion implantation processing on one end, close to the oxide layer, of the second substrate, and forming a first useful layer and a first multiplexing layer through isolation of an ion implantation layer; carrying out primary bonding on the oxide layers of the first substrate and the second substrate to obtain a first combination body, and then carrying out primary splitting treatment to crack the ion implantation layer to obtain a first multiplexing layer and an intermediate bonding body; and carrying out secondary bonding on the piezoelectric wafer and the first useful layer in the middle bonding body to form a nanopore layer on a bonding interface of the piezoelectric wafer and the first useful layer to obtain the composite substrate. The interface bonding energy of the prepared composite substrate is high, clutter scattering is relieved, and the requirement for device miniaturization is met.

The utility model provides a pre-die for supporting synchronous extrusion of a sidewall and a shoulder pad, which comprises a main plate, a sidewall rubber runner which is obliquely arranged downwards is arranged at the top of the main plate, a seam allowance rubber runner which is obliquely arranged upwards is arranged in the middle of the main plate, and a shoulder pad rubber runner which is obliquely arranged upwards and extends to the sidewall rubber runner is arranged at the bottom of the main plate. The shoulder pad rubber runner and the seam allowance rubber runner are arranged on the left side and the right side of the sidewall rubber runner respectively, and the top of a rubber outlet of the shoulder pad rubber runner and the top of a rubber outlet of the seam allowance rubber runner are located on the same horizontal plane, so that subsequent secondary fitting operation is not needed, the operation steps are reduced, the labor intensity is reduced, the working efficiency is improved, and meanwhile, the production cost is reduced. When the three rubber materials are extruded, a continuous composite interface can be formed, the problem that the tire side is adhered after being reversely wrapped due to deviation of the attaching position in the prior art is solved, the pressure distribution of the rubber materials in the runner is more uniform during synchronous extrusion, the bubble defect of the tire shoulder can be effectively reduced, and the product quality is ensured.