8 results about "Secondary bonding" patented technology

This application discloses a fabrication process for a secondary-bonded lithium tantalate composite substrate and a flexible lithium tantalate composite substrate, belonging to the field of flexible ultrathin lithium tantalate wafer fabrication technology. The process includes the following steps: (1) ion implantation of a lithium tantalate wafer and pre-annealing of a substrate wafer; (2) activation and bonding of the implantation surface of the lithium tantalate wafer and the substrate wafer to obtain a first bond, and thinning the lithium tantalate wafer of the first bond to a thickness of 2-50 μm; (3) secondary bonding of the lithium tantalate wafer of the first bond to a flexible substrate to obtain a second bond; (4) annealing and peeling of the second bond to obtain a flexible lithium tantalate composite substrate and a heterogeneous thin-film bonded substrate. This method achieves permanent bonding between an ultrathin lithium tantalate wafer and a flexible substrate through a two-step bonding process, transforming the lithium tantalate wafer from a "fragile thin sheet" into a practical, integrable, and flexible lithium tantalate composite substrate suitable for flexible devices.

This utility model relates to the field of precast composite slabs. Its purpose is to provide an ultra-heavy precast composite slab, comprising a composite slab body. Within the composite slab body, a reinforcing cage, several strip-shaped reinforcing trusses, and prestressed reinforcing bars are pre-embedded. The upper part of the reinforcing cage extends beyond the top surface of the composite slab body, with both ends of the extended portion pre-cast with concrete to form reinforcing beam ends, while the middle section of the extended portion forms a reinforcing beam casting area. The strip-shaped reinforcing trusses are located around the reinforcing beams, and their upper parts also extend beyond the top surface of the composite slab body. The prestressed reinforcing bars are located below the strip-shaped reinforcing trusses, with their ends extending beyond the left and right end faces of the composite slab body. This utility model possesses excellent structural rigidity, load-bearing capacity, and superior secondary bonding with cast-in-place concrete.

The application belongs to the field of sandwich composite materials, and relates to a honeycomb sandwich metamaterial resistant to 350 DEG C high temperature and a preparation method thereof. The honeycomb sandwich metamaterial resistant to 350 DEG C high temperature comprises high-temperature-resistant upper and lower skins, high-temperature-resistant adhesive films and high-temperature-resistant honeycomb metamaterials. The high-temperature-resistant honeycomb metamaterials are located between the high-temperature-resistant upper skin and the high-temperature-resistant lower skin, and the high-temperature-resistant adhesive films are located between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant upper skin and between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant lower skin. According to the forming process of the resin system of the skin, the forming method of the honeycomb sandwich metamaterial resistant to 350 DEG C high temperature can be divided into two types: co-curing forming and secondary bonding forming. The honeycomb sandwich metamaterial resistant to high temperature with frequency selection effect is innovatively prepared, the current preparation problem of the honeycomb sandwich composite material resistant to 350 DEG C high temperature is solved, and the honeycomb sandwich composite material resistant to 350 DEG C high temperature is endowed with superior filtering response characteristics.

1. Name of the product in this design: Table tennis racket rubber re-attachment aid. 2. Purpose of this design: To assist in the secondary bonding of rubber on table tennis rackets. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The utility model provides a pre-die for supporting synchronous extrusion of a sidewall and a shoulder pad, which comprises a main plate, a sidewall rubber runner which is obliquely arranged downwards is arranged at the top of the main plate, a seam allowance rubber runner which is obliquely arranged upwards is arranged in the middle of the main plate, and a shoulder pad rubber runner which is obliquely arranged upwards and extends to the sidewall rubber runner is arranged at the bottom of the main plate. The shoulder pad rubber runner and the seam allowance rubber runner are arranged on the left side and the right side of the sidewall rubber runner respectively, and the top of a rubber outlet of the shoulder pad rubber runner and the top of a rubber outlet of the seam allowance rubber runner are located on the same horizontal plane, so that subsequent secondary fitting operation is not needed, the operation steps are reduced, the labor intensity is reduced, the working efficiency is improved, and meanwhile, the production cost is reduced. When the three rubber materials are extruded, a continuous composite interface can be formed, the problem that the tire side is adhered after being reversely wrapped due to deviation of the attaching position in the prior art is solved, the pressure distribution of the rubber materials in the runner is more uniform during synchronous extrusion, the bubble defect of the tire shoulder can be effectively reduced, and the product quality is ensured.

This invention relates to the field of micro / nanomaterial fabrication and micro energy storage device technology. The invention discloses an in-situ fabrication method for on-chip integrated nanotube array supercapacitor electrodes, comprising the following steps: in-situ construction of an on-chip patterned template; in-situ electrochemical growth of a metal nanotube array; in-situ conversion of a metal / metal oxide composite structure; and the forming of an integrated electrode. This invention directly constructs a patterned anodic aluminum oxide template on a chip substrate with a pre-prepared patterned conductive layer (non-aluminum material) and completes material growth. The resulting nanotube array electrode and the current collector on the chip are grown in situ and integrally formed, avoiding complex material transfer and secondary bonding steps. This achieves perfect compatibility with planar microelectronic processes and can be mass-produced on 4-inch and larger wafers.

The application provides a composite material rotary body stiffened secondary bonding positioning and detecting device and method. The positioning device comprises: a composite material rotary body, the outer surface of which has a flange part, two first positioning lugs are symmetrically arranged on the flange part, and a first pin hole is formed in each first positioning lug; a composite material tool for rib positioning, the inner surface of which is fitted with at least the area of the cylinder part and the flange part of the outer surface of the composite material rotary body, a second positioning lug is arranged on the composite material tool for rib positioning, a second pin hole is formed in the second positioning lug, and the position of the second pin hole corresponds to the position of the first pin hole one by one; a rotary curvature rib, the two ends of the adhesive surface side of which are respectively provided with third positioning lugs, and a third pin hole is formed in the third positioning lugs; a positioning pin, the positioning pin is configured to selectively pass through the first pin hole and the second pin hole to position the composite material tool for rib positioning on the composite material rotary body; and the positioning pin is configured to pass through the first pin hole and the third pin hole to position the rotary curvature rib on the composite material rotary body.

The objective of this invention is to ensure the reliability of primary bonding (also known as first bonding, FAB bonding, ball bonding) and secondary bonding (also known as second bonding, wedge bonding), improve the anti-deposition properties of the cutting edge, and maintain and improve the productivity of the bonding process. The aim is to provide an Ag bonding line that achieves the above objectives. The bonding line that achieves these objectives is an Ag bonding line composed of an Ag alloy comprising: In: 0.05% to 3.0% by mass; Pd, Pt, and Au: 0.010% to 5.0% by mass; Sc, Ti, and Mn: 0.0005% to 0.050% by mass; and P, Zn, Bi, and Cu: 0% to 0.030% by mass.