41 results about "Secondary bonding" patented technology

The invention belongs to the technical field of polymer composite materials, and discloses a leather collagen fiber / polyurethane composite material and a preparation method thereof. The metal-polyphenol coordination network interface layer provided by the invention is accurately positioned on the surface of the leather collagen fiber and is between the fiber and a waterborne polyurethane matrix, and a three-stage structure of'fiber-interface layer-matrix 'is constructed. The interface layer forms a stable network through coordination of metal nanoparticles and polyphenol, and forms chemical bridging with a WPU matrix through secondary bonding. According to the structure, the tearing strength and the tensile capacity of the composite material are greatly improved, the limitation that reinforcement and toughening are difficult to consider in traditional physical blending modification is broken through, and a synergistic reinforcement effect is generated.

The invention relates to the technical field of bio-based polyamide modification, and discloses a bio-based polyamide modified raw material composition for improving the surface hairiness distribution of bunchy yarn, which comprises the following components in percentage by mass: 2.5-6.0% of bio-based polyamide 1010 resin, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3500-5500g / mol, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3,500-5,500 g / mol, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3,500-5,500 g / mol, the functional components are driven to migrate to a surface layer and generate interface secondary bonding by utilizing reaction activity and temperature drop rate coupling among the components and a temperature drop rate difference generated corresponding to an axial variable cross section of the slub yarn, and a thickness heterogeneous interface layer is spontaneously constructed at slubs and details; the technical contradiction that a homogeneous modified material cannot be matched with a non-uniform thermal field is solved, and the physical integrity of the fiber surface is improved.

The invention discloses a precipitation-free rubber material for a stabilizer bar bushing and a preparation method of the precipitation-free rubber material, and particularly relates to the technical field of automobile part materials. The precipitation-free rubber material for the stabilizer bar bushing comprises 100 parts of natural rubber; 4-8 parts of zinc oxide; 1-3 parts of stearic acid; 3-8 parts of a compound anti-aging agent; 20 to 60 parts of carbon black; 0.3-2 parts of a vulcanizing agent; 1.5 to 5.5 parts of a compound accelerant; and 0.1 to 0.5 part of scorch retarder. The anti-aging agent in the formula is reasonably matched to replace traditional protective paraffin, the problem of protective paraffin precipitation is avoided while the excellent ozone resistance of the rubber material is ensured, the problem of secondary bonding degumming of the stabilizer bar bushing is effectively solved, and the rubber material also has good hardness, breaking strength, elongation at break, pressure change and other physical properties, and is suitable for popularization and application. The anti-aging performance is better, and the service life is long.

The present application relates to the technical field of light collecting plate manufacturing, and particularly relates to a light collecting plate film pasting process and a film pasting device for a solar combined heat and power assembly, which comprises the following steps: a plurality of secondary parabolic support plates are stacked from top to bottom to form a support plate array; an adhesive is coated on the film pasting surface of the top secondary parabolic support plate of the support plate array by using an adhesive coating assembly; a reflective film is placed on the film pasting surface of the secondary parabolic support plate coated with the adhesive and is aligned, and an external force is applied to the reflective film to perform primary bonding; the secondary parabolic support plate after the film is placed is placed at the bottom layer of the support plate array, and secondary bonding is performed by relying on the self weight of the support plate array; the aforementioned steps are cycled until the film pasting is completed, and a light collecting plate array is formed. The present application can realize fast film pasting of the light collecting plate of the solar combined heat and power assembly and ensure the pasting quality by relying on the self weight of the support plate array for secondary bonding.

The invention discloses a preparation method of high-performance powder metallurgy heat-resistant stainless steel, and belongs to the technical field of heat-resistant stainless steel preparation. S2, water and gas combined atomization is carried out; s3, powder pretreatment; s4, cold isostatic pressing forming is carried out; s5, vacuum or nitrogen sintering is carried out; the method has the advantages of being short in preparation process, high in material utilization rate, uniform in component structure distribution, high in second-phase bonding strength, good in mechanical property and free of metallurgical defects, and solves the problems that heat-resistant stainless steel prepared through an existing smelting method has component segregation and metallurgical defects and is not uniform in structure distribution, the preparation process is long, the material utilization rate is low, and the cost is low. Particularly, when ceramic particles are introduced, due to the fact that the density difference between a ceramic reinforced phase and a stainless steel matrix is large, wettability is poor, and the problems that the distribution of the reinforced phase of the heat-resistant stainless steel is not uniform and the bonding strength is low are easily caused.

The invention relates to the technical field of composite materials, and discloses an impact resistance-wave absorption integrated fiber reinforced composite material and a preparation method thereof.The preparation method comprises the following steps that 1, N layers of carbon fiber prepregs and M layers of wave-transparent fiber prepregs are sequentially laid from bottom to top, and laminated prepregs are obtained; 2, pre-arranging conductive fibers which are arranged in an array mode and are perpendicular to the direction of the plane where the surface of the base body is located in the plate-shaped base body to obtain a fiber carrier; 3, after the laminated prepreg is preheated and softened, the fiber carrier is implanted into the laminated prepreg under the heating and pressurizing conditions, meanwhile, curing and cooling are conducted, and then the needed composite material plate can be obtained; a carrier pre-fixing-one-step hot-pressing curing method is adopted, and the implanting process of the conductive fibers and the integral forming process of the composite material are combined into a whole; the preparation method is simple, secondary bonding or complex post-treatment is avoided, and synchronous forming and firm combination of the structural layer, the conductive fibers and the resin matrix on the microscopic scale are achieved.

This invention discloses a method for manufacturing a non-uniform diameter, thick, closed-type tubular carbon fiber beam in the field of carbon fiber beam technology for wind tunnel blades. The method includes: S1, disassembling the carbon fiber beam structure and preparing a specially designed mold with corresponding cavities; S2, laying a carbon fiber preform on the mold; S3, assembling the preform after demolding and fixing the mold; S4, setting vacuum bags and placing vacuum nozzles on the inner and outer sides of the assembled mold; S5, placing the mold in a thermosetting device and using a gradient curing process with vacuum pressure for curing; S6, demolding after cooling. This invention, by employing co-curing in a thermosetting tank, results in excellent overall performance of the carbon fiber beam, eliminating the need for additional adhesives and secondary bonding steps, reducing air bubbles and defects. Simultaneously, dividing the carbon fiber beam into three parts disperses the thickness, improving the laying quality and efficiency, increasing the bonding surface of the carbon fiber beam, and enhancing the bonding strength.

The invention belongs to the field of semiconductor integrated circuit packaging, and discloses a bare copper carrier thermal ultrasonic bonding and chip packaging method and a chip, an oxide layer of a bare copper carrier bonding area is ground and broken through a chopper to form a clean grinding bonding area, chip / pin interconnection is achieved through direct thermal ultrasonic bonding in the grinding bonding area, then silver glue is dispensed to wrap welding spots, then curing is conducted, and the chip / pin is packaged. And finally, chip-pin bonding is completed. The oxidation layer is physically broken through grinding, so that the problem of bare copper bonding oxidation is fundamentally solved, and a traditional plating process is omitted; silver colloid wrapping not only can isolate secondary oxidation of the welding spots, but also enhances the bonding interface of the molding compound, and secondary bonding after curing ensures that the silver colloid does not interfere with lead bonding. A precious metal coating and an anti-oxidation gas protection system are thoroughly eliminated, and the frame material and equipment modification cost is greatly reduced; the bonding reliability is guaranteed through oxide layer breaking, the welding spot oxidation resistance and the packaging structure binding force are synchronously improved through elargol wrapping, and the dual purposes of high-reliability packaging and remarkable cost reduction are achieved on a bare copper carrier as a whole.

The present invention provides a reflector structure capable of rapid passive temperature equalization and a preparation method thereof, comprising an inner skin, an outer skin, and a sandwich layer, wherein the inner skin is arranged on the concave side of the reflector, the outer skin is arranged on the protruding side of the reflector, and the sandwich layer is arranged between the inner skin and the outer skin; the inner skin and the outer skin are both carbon fiber laminates; the sandwich layer comprises a supporting structure and a heat-conducting functional structure, and the supporting structure is filled between the heat-conducting functional structure and the inner skin and the outer skin. The present invention can effectively improve the thermal conductivity by using a sandwich layer containing a supporting structure and a heat-conducting functional structure, thereby improving the uniformity of the reflector's own temperature field under conditions of extreme temperature distribution differences. The present invention realizes the integrated manufacturing of the reflector through RTM one-piece molding, reduces the structural deformation caused by secondary bonding, and thus improves the molding accuracy of the reflector itself.

The application discloses a MEMS sensor structure and a forming method, which can reduce the probability of edge area fragmentation of a first wafer, and reduce the probability of device failure. The MEMS sensor structure comprises the first wafer, a surface and / or an internal functional device, the first wafer comprises a first surface and a second surface arranged oppositely, the first surface is provided with a pad, the pad is located outside the area of the functional device, and is electrically connected to the functional device and used for bonding wire to electrically connect the functional device to the outside of the first wafer. The second wafer is supported by a first bonding assembly and is bonded to the second surface of the first wafer oppositely. The first bonding assembly comprises a main bonding piece, which is arranged around the functional device, is annular, and forms a first cavity between the main bonding piece, the first wafer and the second wafer. A secondary bonding piece is bonded between the first wafer and the second wafer and is arranged outside the main bonding piece. The distribution area of the secondary bonding piece is opposite to the position of the pad, and the pad of the first wafer is supported.

The invention discloses a composite material and a co-bonding method thereof, and relates to the technical field of composite material forming. The composite material co-bonding method comprises the steps of pre-assembly, honeycomb dehumidification, pre-leveling, skin checking, heat sealing and pressing, pre-bonding, skin wet laying and co-bonding forming. The composite material co-bonding method disclosed by the invention has the advantages of simple process and low cost, and compared with secondary bonding in the prior art, the composite material co-bonding process disclosed by the invention is easier to realize industrial production.

This application discloses a fabrication process for a secondary-bonded lithium tantalate composite substrate and a flexible lithium tantalate composite substrate, belonging to the field of flexible ultrathin lithium tantalate wafer fabrication technology. The process includes the following steps: (1) ion implantation of a lithium tantalate wafer and pre-annealing of a substrate wafer; (2) activation and bonding of the implantation surface of the lithium tantalate wafer and the substrate wafer to obtain a first bond, and thinning the lithium tantalate wafer of the first bond to a thickness of 2-50 μm; (3) secondary bonding of the lithium tantalate wafer of the first bond to a flexible substrate to obtain a second bond; (4) annealing and peeling of the second bond to obtain a flexible lithium tantalate composite substrate and a heterogeneous thin-film bonded substrate. This method achieves permanent bonding between an ultrathin lithium tantalate wafer and a flexible substrate through a two-step bonding process, transforming the lithium tantalate wafer from a "fragile thin sheet" into a practical, integrable, and flexible lithium tantalate composite substrate suitable for flexible devices.

The invention provides a double-layer SOI substrate and a preparation method thereof, and the preparation method comprises the following steps: providing a first silicon wafer, and forming a first oxide layer on the surface of the first silicon wafer; providing a second silicon wafer, and performing primary bonding on the first oxide layer and the second silicon wafer; performing primary thinning and polishing treatment on the surface of the bonded second silicon wafer to form a first device layer; providing a third silicon wafer, and forming a second oxide layer on the surface of the second silicon wafer or the third silicon wafer; carrying out secondary bonding on the second oxide layer and the second silicon wafer or the third silicon wafer on which the second oxide layer is not formed; the secondary bonding is high-pressure vacuum bonding, the pressure is 5-20 KN, the vacuum degree is 10 <-3 >-10 <-5 > mbar, and the bonding time is 5-20 min; and carrying out secondary thinning and polishing treatment on the surface of the bonded third silicon wafer to form a second device layer. The invention also discloses the double-layer SOI substrate obtained by the preparation method. According to the method, the double-layer SOI substrate with the adjustable thickness of the device layer and the oxide layer can be obtained, the technological process for manufacturing a device by using the substrate is simplified, or a special structure is easy to obtain.

This utility model relates to the field of precast composite slabs. Its purpose is to provide an ultra-heavy precast composite slab, comprising a composite slab body. Within the composite slab body, a reinforcing cage, several strip-shaped reinforcing trusses, and prestressed reinforcing bars are pre-embedded. The upper part of the reinforcing cage extends beyond the top surface of the composite slab body, with both ends of the extended portion pre-cast with concrete to form reinforcing beam ends, while the middle section of the extended portion forms a reinforcing beam casting area. The strip-shaped reinforcing trusses are located around the reinforcing beams, and their upper parts also extend beyond the top surface of the composite slab body. The prestressed reinforcing bars are located below the strip-shaped reinforcing trusses, with their ends extending beyond the left and right end faces of the composite slab body. This utility model possesses excellent structural rigidity, load-bearing capacity, and superior secondary bonding with cast-in-place concrete.

The invention belongs to the technical field of anti-elastic composite materials, and particularly relates to a heterostructure aramid fiber composite material and a preparation method thereof.A panel of the composite material is an aramid fiber reinforced thermosetting phenolic resin composite material, and a back plate of the composite material is an aramid fiber reinforced thermoplastic polyurethane resin composite material; the heterogeneous prepreg is prepared in a glue solution brushing mode, the integral heterogeneous composite material is prepared through a common laying one-step hot press molding method, and the layering problem caused by secondary bonding of the heterogeneous material is avoided. Compared with a single aramid fiber composite material, the heterostructure anti-elastic composite material prepared by the method has the advantages that the mechanical property and the anti-elastic property are improved in a balanced manner. The method is simple in process, the heterostructure composite material is good in integrity and suitable for large-scale industrial production, and a feasible way is provided for structural regulation and control of the anti-elastic composite material prepared through the hot press molding process.

The invention discloses a frame and truss integrated combined foam interlayer integral forming device, and relates to the technical field of injection molding equipment, the frame and truss integrated combined foam interlayer integral forming device comprises a workbench, a lower forming mold is fixedly arranged on the upper portion of the workbench, a supporting plate is vertically and fixedly arranged on the side wall of one side of the workbench, and a mounting plate is transversely and fixedly arranged on the upper portion of the supporting plate; a hydraulic oil cylinder A is fixedly arranged on the upper portion of the mounting plate, an upper forming die is fixedly arranged on a piston rod of the hydraulic oil cylinder A through a fixing plate, a frame truss is placed on the upper portion of an inner cavity of a lower forming die, and the upper forming die and the lower forming die are matched to enable the frame truss to be embedded and fixed in the foam plate. The lower forming die and the upper forming die can completely wrap the frame truss serving as a sandwich in the inner cavity of the foam board, and compared with a traditional secondary cementing mode, the frame truss and the foam board are subjected to integrated injection molding, so that erosion of the external environment can be effectively resisted.

The invention relates to the technical field of mobile phone panel production equipment, and discloses secondary attaching equipment for flexible transparent materials, which comprises an X-direction module, a Y-direction module, a long edge rolling unit and two short edge rolling units, the long edge rolling unit and the two short edge rolling units are arranged side by side, the X-direction module is positioned above the long edge rolling unit, and the Y-direction module is positioned above the Y-direction module. The two Y-direction modules are located above the two short edge rolling units correspondingly. The long edge rolling unit and the short edge rolling unit each comprise a pressure applying assembly, the pressure applying assembly of the long edge rolling unit is arranged on the X-direction module, the pressure applying assembly of the short edge rolling unit is arranged on the Y-direction module, and a rolling module is arranged at the power output end of each pressure applying assembly. According to the secondary attaching equipment for the flexible transparent material, the problem that corner areas of an existing mobile phone panel are not fully attached is solved.

The invention discloses a multi-curvature thin-wall composite material pipe fitting forming tool and method, and belongs to the technical field of composite material forming. The forming tool comprises an upper half die, a lower half die, a first check block and a second check block, and the first check block and the second check block are detachably connected with the lower half die through guide columns; the inner sides of the first check block and the second check block extend into a cavity of the lower half die, the side walls of the inner sides of the first check block and the second check block are stepped surfaces or inclined surfaces or curved surfaces, and the side walls of the inner sides of the first check block and the second check block are used for inwards and obliquely limiting the part, extending out of the molded surface of the lower half die, of a lower half die blank. The forming method comprises the steps that stepped material spreading is conducted on the upper half die and the lower half die, and the problem that the extending blank part is easily clamped between the upper half die and the lower half die during die assembly is solved through the forming tool. According to the forming tool and the forming method, the product quality and the qualified rate are improved, the cost is reduced, secondary bonding is not needed, the manufacturing period is shortened, and the production efficiency is improved.

The application belongs to the field of sandwich composite materials, and relates to a honeycomb sandwich metamaterial resistant to 350 DEG C high temperature and a preparation method thereof. The honeycomb sandwich metamaterial resistant to 350 DEG C high temperature comprises high-temperature-resistant upper and lower skins, high-temperature-resistant adhesive films and high-temperature-resistant honeycomb metamaterials. The high-temperature-resistant honeycomb metamaterials are located between the high-temperature-resistant upper skin and the high-temperature-resistant lower skin, and the high-temperature-resistant adhesive films are located between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant upper skin and between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant lower skin. According to the forming process of the resin system of the skin, the forming method of the honeycomb sandwich metamaterial resistant to 350 DEG C high temperature can be divided into two types: co-curing forming and secondary bonding forming. The honeycomb sandwich metamaterial resistant to high temperature with frequency selection effect is innovatively prepared, the current preparation problem of the honeycomb sandwich composite material resistant to 350 DEG C high temperature is solved, and the honeycomb sandwich composite material resistant to 350 DEG C high temperature is endowed with superior filtering response characteristics.

1. Name of the product in this design: Table tennis racket rubber re-attachment aid. 2. Purpose of this design: To assist in the secondary bonding of rubber on table tennis rackets. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The invention provides an automobile loudspeaker magnetic circuit bonding device. The automobile loudspeaker magnetic circuit bonding device comprises a machine base, a conveying mechanism, a primary bonding mechanism and a secondary bonding mechanism. The conveying mechanism comprises a rail, a plurality of jigs and a conveying driving assembly. The primary bonding mechanism comprises an upper clamping plate feeding assembly, a primary gluing assembly, a magnet feeding assembly, a primary pressing assembly, a primary drying assembly and a cleaning assembly. The secondary bonding mechanism comprises a secondary gluing assembly, a T iron feeding assembly, a secondary pressing assembly and a secondary drying assembly. According to the magnetic circuit bonding device for the automobile loudspeaker, after the magnet is bonded to the surface of the upper clamping plate, through the cleaning assembly, adhesive left on the inner circumferential side of the magnet, the side, facing the magnet, of the upper clamping plate and the inner circumferential side of the upper clamping plate can be cleaned, the adhesive can be prevented from interfering installation of T iron and a voice coil, the forming quality of a product can be improved, and the production efficiency is improved. And smooth processing can be ensured.

The application discloses a reversible acrylate adhesive with excellent secondary bonding strength and a preparation method, a use method and an application thereof. The adhesive is a new reversible acrylate adhesive formed by combining the reversible anthracene group with the good double bond environment and pressure-sensitive characteristics of the acrylate system. Through the steps of photocuring, thermal depolymerization and photocuring, the problem of reduced strength after secondary bonding of the existing reversible adhesive is overcome, and the shear strength after secondary bonding is increased by 42% compared with that after primary bonding. In addition, the debonding rates of the adhesive in the present application in two debonding processes are 91% and 82% respectively, and the adhesive has good debonding performance. Therefore, the reversible acrylate adhesive can be effectively applied in the electronic field and solve the problem of poor mechanical properties after secondary bonding in the existing reversible electronic adhesive field.

The invention provides a preparation method of a composite substrate, the composite substrate and a surface acoustic wave filter, and the preparation method comprises the steps: providing a first substrate, a second substrate and a piezoelectric wafer, carrying out the thermal oxidation treatment of the second substrate, forming an oxidation layer on a to-be-bonded surface of the second substrate, and carrying out the bonding of the to-be-bonded surface of the second substrate; carrying out ion implantation processing on one end, close to the oxide layer, of the second substrate, and forming a first useful layer and a first multiplexing layer through isolation of an ion implantation layer; carrying out primary bonding on the oxide layers of the first substrate and the second substrate to obtain a first combination body, and then carrying out primary splitting treatment to crack the ion implantation layer to obtain a first multiplexing layer and an intermediate bonding body; and carrying out secondary bonding on the piezoelectric wafer and the first useful layer in the middle bonding body to form a nanopore layer on a bonding interface of the piezoelectric wafer and the first useful layer to obtain the composite substrate. The interface bonding energy of the prepared composite substrate is high, clutter scattering is relieved, and the requirement for device miniaturization is met.

The utility model provides a pre-die for supporting synchronous extrusion of a sidewall and a shoulder pad, which comprises a main plate, a sidewall rubber runner which is obliquely arranged downwards is arranged at the top of the main plate, a seam allowance rubber runner which is obliquely arranged upwards is arranged in the middle of the main plate, and a shoulder pad rubber runner which is obliquely arranged upwards and extends to the sidewall rubber runner is arranged at the bottom of the main plate. The shoulder pad rubber runner and the seam allowance rubber runner are arranged on the left side and the right side of the sidewall rubber runner respectively, and the top of a rubber outlet of the shoulder pad rubber runner and the top of a rubber outlet of the seam allowance rubber runner are located on the same horizontal plane, so that subsequent secondary fitting operation is not needed, the operation steps are reduced, the labor intensity is reduced, the working efficiency is improved, and meanwhile, the production cost is reduced. When the three rubber materials are extruded, a continuous composite interface can be formed, the problem that the tire side is adhered after being reversely wrapped due to deviation of the attaching position in the prior art is solved, the pressure distribution of the rubber materials in the runner is more uniform during synchronous extrusion, the bubble defect of the tire shoulder can be effectively reduced, and the product quality is ensured.

The invention relates to a forming method of an automobile interior trim part made of a polyurethane foam material. Comprising the following steps that a mold cavity corresponding to the automotive upholstery is formed in a mold, the mold cavity comprises a first sub-mold cavity corresponding to a first structural part and a second sub-mold cavity corresponding to a second structural part, the first sub-mold cavity communicates with the second sub-mold cavity, the mold is pretreated, the mold is closed, a foaming raw material is injected into the mold cavity, and the automotive upholstery is obtained. And the foaming raw materials flow in the first sub-mold cavity and the second sub-mold cavity and are cured, an automobile interior trim part blank is formed, the mold is opened, and the automobile interior trim part blank is taken out. According to the forming method of the automobile interior trim part made of the polyurethane foam material, secondary bonding is not needed, the processing technology of the automobile interior trim part is simplified, the production period of the automobile interior trim part is shortened, the production efficiency is improved, the cost is reduced, the connecting strength of the first structure part and the second structure part is improved, and the service life of the automobile interior trim part is prolonged.

This invention relates to the field of micro / nanomaterial fabrication and micro energy storage device technology. The invention discloses an in-situ fabrication method for on-chip integrated nanotube array supercapacitor electrodes, comprising the following steps: in-situ construction of an on-chip patterned template; in-situ electrochemical growth of a metal nanotube array; in-situ conversion of a metal / metal oxide composite structure; and the forming of an integrated electrode. This invention directly constructs a patterned anodic aluminum oxide template on a chip substrate with a pre-prepared patterned conductive layer (non-aluminum material) and completes material growth. The resulting nanotube array electrode and the current collector on the chip are grown in situ and integrally formed, avoiding complex material transfer and secondary bonding steps. This achieves perfect compatibility with planar microelectronic processes and can be mass-produced on 4-inch and larger wafers.

The invention relates to the technical field of tensile tests, in particular to a forming device and method for a composite biaxial tensile test piece. When the device is used, a co-curing test piece and a secondary cementing test piece can be respectively obtained, as both the upper cover plate and the lower bottom plate are detachably connected with a reinforcing sheet central area chamfering slope forming piece, when the device adopts a secondary cementing method to manufacture the test piece, in the secondary bonding and curing process of the test piece and the reinforcing sheet, glue overflowing and blocking treatment is carried out on a reinforcing sheet central glue film, and the test piece is not damaged. After the reinforcing sheet is cured for the first time, demolding is not needed, demolding is conducted after the reinforcing sheet and a test piece are glued for the second time, the purpose of glue blocking can be achieved, and the problem that glue overflowing and blocking are difficult during secondary gluing is solved. Meanwhile, the through hole in the direction of the chamfer slope of the reinforcing sheet area of the co-curing test piece can be directly cured and formed under the action of the chamfer slope forming piece in the central area of the reinforcing sheet, so that the machining step is omitted, and the problems of layering and splitting between fiber layers of the reinforcing sheet can be avoided.

The application provides a composite material rotary body stiffened secondary bonding positioning and detecting device and method. The positioning device comprises: a composite material rotary body, the outer surface of which has a flange part, two first positioning lugs are symmetrically arranged on the flange part, and a first pin hole is formed in each first positioning lug; a composite material tool for rib positioning, the inner surface of which is fitted with at least the area of the cylinder part and the flange part of the outer surface of the composite material rotary body, a second positioning lug is arranged on the composite material tool for rib positioning, a second pin hole is formed in the second positioning lug, and the position of the second pin hole corresponds to the position of the first pin hole one by one; a rotary curvature rib, the two ends of the adhesive surface side of which are respectively provided with third positioning lugs, and a third pin hole is formed in the third positioning lugs; a positioning pin, the positioning pin is configured to selectively pass through the first pin hole and the second pin hole to position the composite material tool for rib positioning on the composite material rotary body; and the positioning pin is configured to pass through the first pin hole and the third pin hole to position the rotary curvature rib on the composite material rotary body.

The invention belongs to the technical field of shoemaking, and particularly discloses a process for covering the surface of a U-shaped curved surface soft sole with cloth. The process disclosed by the invention comprises the following steps: firstly, arranging a cloth sleeve on the upper surface of a mold, and tightening the cloth sleeve; then, first-time bonding and glue brushing are carried out; then, reversely buckling the shoe sole brushed with the glue on a mold, and pressing until the cloth and the shoe sole are firmly bonded; then, the outer side wall of the shoe edge is subjected to secondary bonding and glue brushing; then, the mold and the shoe sole are overturned and placed, and the tightening state of the cloth is relieved; then, the cloth covering the shoe edge is pressed along the outer side wall of the shoe edge brushed with the glue until the cloth is firmly bonded; and finally, the mold is taken away, and redundant cloth is cut off. According to the shoe sole cloth covering device, operation is simplified, cloth covering on the shoe sole is achieved, the covering cloth on the surface of the shoe sole is smooth and free of gaps, and the qualified rate of products is greatly increased. The surface cloth covering device can be widely applied to surface cloth covering of soft shoe soles.