33 results about "Secondary bonding" patented technology

The invention belongs to the technical field of polymer composite materials, and discloses a leather collagen fiber / polyurethane composite material and a preparation method thereof. The metal-polyphenol coordination network interface layer provided by the invention is accurately positioned on the surface of the leather collagen fiber and is between the fiber and a waterborne polyurethane matrix, and a three-stage structure of'fiber-interface layer-matrix 'is constructed. The interface layer forms a stable network through coordination of metal nanoparticles and polyphenol, and forms chemical bridging with a WPU matrix through secondary bonding. According to the structure, the tearing strength and the tensile capacity of the composite material are greatly improved, the limitation that reinforcement and toughening are difficult to consider in traditional physical blending modification is broken through, and a synergistic reinforcement effect is generated.

The invention relates to the technical field of bio-based polyamide modification, and discloses a bio-based polyamide modified raw material composition for improving the surface hairiness distribution of bunchy yarn, which comprises the following components in percentage by mass: 2.5-6.0% of bio-based polyamide 1010 resin, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3500-5500g / mol, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3,500-5,500 g / mol, 0.5-2.0% of maleic anhydride grafted castor oil polyether with the weight-average molecular weight of 3,500-5,500 g / mol, the functional components are driven to migrate to a surface layer and generate interface secondary bonding by utilizing reaction activity and temperature drop rate coupling among the components and a temperature drop rate difference generated corresponding to an axial variable cross section of the slub yarn, and a thickness heterogeneous interface layer is spontaneously constructed at slubs and details; the technical contradiction that a homogeneous modified material cannot be matched with a non-uniform thermal field is solved, and the physical integrity of the fiber surface is improved.

The invention discloses a precipitation-free rubber material for a stabilizer bar bushing and a preparation method of the precipitation-free rubber material, and particularly relates to the technical field of automobile part materials. The precipitation-free rubber material for the stabilizer bar bushing comprises 100 parts of natural rubber; 4-8 parts of zinc oxide; 1-3 parts of stearic acid; 3-8 parts of a compound anti-aging agent; 20 to 60 parts of carbon black; 0.3-2 parts of a vulcanizing agent; 1.5 to 5.5 parts of a compound accelerant; and 0.1 to 0.5 part of scorch retarder. The anti-aging agent in the formula is reasonably matched to replace traditional protective paraffin, the problem of protective paraffin precipitation is avoided while the excellent ozone resistance of the rubber material is ensured, the problem of secondary bonding degumming of the stabilizer bar bushing is effectively solved, and the rubber material also has good hardness, breaking strength, elongation at break, pressure change and other physical properties, and is suitable for popularization and application. The anti-aging performance is better, and the service life is long.

The present application relates to the technical field of light collecting plate manufacturing, and particularly relates to a light collecting plate film pasting process and a film pasting device for a solar combined heat and power assembly, which comprises the following steps: a plurality of secondary parabolic support plates are stacked from top to bottom to form a support plate array; an adhesive is coated on the film pasting surface of the top secondary parabolic support plate of the support plate array by using an adhesive coating assembly; a reflective film is placed on the film pasting surface of the secondary parabolic support plate coated with the adhesive and is aligned, and an external force is applied to the reflective film to perform primary bonding; the secondary parabolic support plate after the film is placed is placed at the bottom layer of the support plate array, and secondary bonding is performed by relying on the self weight of the support plate array; the aforementioned steps are cycled until the film pasting is completed, and a light collecting plate array is formed. The present application can realize fast film pasting of the light collecting plate of the solar combined heat and power assembly and ensure the pasting quality by relying on the self weight of the support plate array for secondary bonding.

The invention discloses a preparation method of high-performance powder metallurgy heat-resistant stainless steel, and belongs to the technical field of heat-resistant stainless steel preparation. S2, water and gas combined atomization is carried out; s3, powder pretreatment; s4, cold isostatic pressing forming is carried out; s5, vacuum or nitrogen sintering is carried out; the method has the advantages of being short in preparation process, high in material utilization rate, uniform in component structure distribution, high in second-phase bonding strength, good in mechanical property and free of metallurgical defects, and solves the problems that heat-resistant stainless steel prepared through an existing smelting method has component segregation and metallurgical defects and is not uniform in structure distribution, the preparation process is long, the material utilization rate is low, and the cost is low. Particularly, when ceramic particles are introduced, due to the fact that the density difference between a ceramic reinforced phase and a stainless steel matrix is large, wettability is poor, and the problems that the distribution of the reinforced phase of the heat-resistant stainless steel is not uniform and the bonding strength is low are easily caused.

The invention relates to the technical field of composite materials, and discloses an impact resistance-wave absorption integrated fiber reinforced composite material and a preparation method thereof.The preparation method comprises the following steps that 1, N layers of carbon fiber prepregs and M layers of wave-transparent fiber prepregs are sequentially laid from bottom to top, and laminated prepregs are obtained; 2, pre-arranging conductive fibers which are arranged in an array mode and are perpendicular to the direction of the plane where the surface of the base body is located in the plate-shaped base body to obtain a fiber carrier; 3, after the laminated prepreg is preheated and softened, the fiber carrier is implanted into the laminated prepreg under the heating and pressurizing conditions, meanwhile, curing and cooling are conducted, and then the needed composite material plate can be obtained; a carrier pre-fixing-one-step hot-pressing curing method is adopted, and the implanting process of the conductive fibers and the integral forming process of the composite material are combined into a whole; the preparation method is simple, secondary bonding or complex post-treatment is avoided, and synchronous forming and firm combination of the structural layer, the conductive fibers and the resin matrix on the microscopic scale are achieved.

This invention discloses a method for manufacturing a non-uniform diameter, thick, closed-type tubular carbon fiber beam in the field of carbon fiber beam technology for wind tunnel blades. The method includes: S1, disassembling the carbon fiber beam structure and preparing a specially designed mold with corresponding cavities; S2, laying a carbon fiber preform on the mold; S3, assembling the preform after demolding and fixing the mold; S4, setting vacuum bags and placing vacuum nozzles on the inner and outer sides of the assembled mold; S5, placing the mold in a thermosetting device and using a gradient curing process with vacuum pressure for curing; S6, demolding after cooling. This invention, by employing co-curing in a thermosetting tank, results in excellent overall performance of the carbon fiber beam, eliminating the need for additional adhesives and secondary bonding steps, reducing air bubbles and defects. Simultaneously, dividing the carbon fiber beam into three parts disperses the thickness, improving the laying quality and efficiency, increasing the bonding surface of the carbon fiber beam, and enhancing the bonding strength.

The application discloses a MEMS sensor structure and a forming method, which can reduce the probability of edge area fragmentation of a first wafer, and reduce the probability of device failure. The MEMS sensor structure comprises the first wafer, a surface and / or an internal functional device, the first wafer comprises a first surface and a second surface arranged oppositely, the first surface is provided with a pad, the pad is located outside the area of the functional device, and is electrically connected to the functional device and used for bonding wire to electrically connect the functional device to the outside of the first wafer. The second wafer is supported by a first bonding assembly and is bonded to the second surface of the first wafer oppositely. The first bonding assembly comprises a main bonding piece, which is arranged around the functional device, is annular, and forms a first cavity between the main bonding piece, the first wafer and the second wafer. A secondary bonding piece is bonded between the first wafer and the second wafer and is arranged outside the main bonding piece. The distribution area of the secondary bonding piece is opposite to the position of the pad, and the pad of the first wafer is supported.

This application discloses a fabrication process for a secondary-bonded lithium tantalate composite substrate and a flexible lithium tantalate composite substrate, belonging to the field of flexible ultrathin lithium tantalate wafer fabrication technology. The process includes the following steps: (1) ion implantation of a lithium tantalate wafer and pre-annealing of a substrate wafer; (2) activation and bonding of the implantation surface of the lithium tantalate wafer and the substrate wafer to obtain a first bond, and thinning the lithium tantalate wafer of the first bond to a thickness of 2-50 μm; (3) secondary bonding of the lithium tantalate wafer of the first bond to a flexible substrate to obtain a second bond; (4) annealing and peeling of the second bond to obtain a flexible lithium tantalate composite substrate and a heterogeneous thin-film bonded substrate. This method achieves permanent bonding between an ultrathin lithium tantalate wafer and a flexible substrate through a two-step bonding process, transforming the lithium tantalate wafer from a "fragile thin sheet" into a practical, integrable, and flexible lithium tantalate composite substrate suitable for flexible devices.

The invention provides a double-layer SOI substrate and a preparation method thereof, and the preparation method comprises the following steps: providing a first silicon wafer, and forming a first oxide layer on the surface of the first silicon wafer; providing a second silicon wafer, and performing primary bonding on the first oxide layer and the second silicon wafer; performing primary thinning and polishing treatment on the surface of the bonded second silicon wafer to form a first device layer; providing a third silicon wafer, and forming a second oxide layer on the surface of the second silicon wafer or the third silicon wafer; carrying out secondary bonding on the second oxide layer and the second silicon wafer or the third silicon wafer on which the second oxide layer is not formed; the secondary bonding is high-pressure vacuum bonding, the pressure is 5-20 KN, the vacuum degree is 10 <-3 >-10 <-5 > mbar, and the bonding time is 5-20 min; and carrying out secondary thinning and polishing treatment on the surface of the bonded third silicon wafer to form a second device layer. The invention also discloses the double-layer SOI substrate obtained by the preparation method. According to the method, the double-layer SOI substrate with the adjustable thickness of the device layer and the oxide layer can be obtained, the technological process for manufacturing a device by using the substrate is simplified, or a special structure is easy to obtain.

This utility model relates to the field of precast composite slabs. Its purpose is to provide an ultra-heavy precast composite slab, comprising a composite slab body. Within the composite slab body, a reinforcing cage, several strip-shaped reinforcing trusses, and prestressed reinforcing bars are pre-embedded. The upper part of the reinforcing cage extends beyond the top surface of the composite slab body, with both ends of the extended portion pre-cast with concrete to form reinforcing beam ends, while the middle section of the extended portion forms a reinforcing beam casting area. The strip-shaped reinforcing trusses are located around the reinforcing beams, and their upper parts also extend beyond the top surface of the composite slab body. The prestressed reinforcing bars are located below the strip-shaped reinforcing trusses, with their ends extending beyond the left and right end faces of the composite slab body. This utility model possesses excellent structural rigidity, load-bearing capacity, and superior secondary bonding with cast-in-place concrete.

The invention belongs to the technical field of anti-elastic composite materials, and particularly relates to a heterostructure aramid fiber composite material and a preparation method thereof.A panel of the composite material is an aramid fiber reinforced thermosetting phenolic resin composite material, and a back plate of the composite material is an aramid fiber reinforced thermoplastic polyurethane resin composite material; the heterogeneous prepreg is prepared in a glue solution brushing mode, the integral heterogeneous composite material is prepared through a common laying one-step hot press molding method, and the layering problem caused by secondary bonding of the heterogeneous material is avoided. Compared with a single aramid fiber composite material, the heterostructure anti-elastic composite material prepared by the method has the advantages that the mechanical property and the anti-elastic property are improved in a balanced manner. The method is simple in process, the heterostructure composite material is good in integrity and suitable for large-scale industrial production, and a feasible way is provided for structural regulation and control of the anti-elastic composite material prepared through the hot press molding process.

The invention discloses a multi-curvature thin-wall composite material pipe fitting forming tool and method, and belongs to the technical field of composite material forming. The forming tool comprises an upper half die, a lower half die, a first check block and a second check block, and the first check block and the second check block are detachably connected with the lower half die through guide columns; the inner sides of the first check block and the second check block extend into a cavity of the lower half die, the side walls of the inner sides of the first check block and the second check block are stepped surfaces or inclined surfaces or curved surfaces, and the side walls of the inner sides of the first check block and the second check block are used for inwards and obliquely limiting the part, extending out of the molded surface of the lower half die, of a lower half die blank. The forming method comprises the steps that stepped material spreading is conducted on the upper half die and the lower half die, and the problem that the extending blank part is easily clamped between the upper half die and the lower half die during die assembly is solved through the forming tool. According to the forming tool and the forming method, the product quality and the qualified rate are improved, the cost is reduced, secondary bonding is not needed, the manufacturing period is shortened, and the production efficiency is improved.

The application belongs to the field of sandwich composite materials, and relates to a honeycomb sandwich metamaterial resistant to 350 DEG C high temperature and a preparation method thereof. The honeycomb sandwich metamaterial resistant to 350 DEG C high temperature comprises high-temperature-resistant upper and lower skins, high-temperature-resistant adhesive films and high-temperature-resistant honeycomb metamaterials. The high-temperature-resistant honeycomb metamaterials are located between the high-temperature-resistant upper skin and the high-temperature-resistant lower skin, and the high-temperature-resistant adhesive films are located between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant upper skin and between the high-temperature-resistant honeycomb metamaterials and the high-temperature-resistant lower skin. According to the forming process of the resin system of the skin, the forming method of the honeycomb sandwich metamaterial resistant to 350 DEG C high temperature can be divided into two types: co-curing forming and secondary bonding forming. The honeycomb sandwich metamaterial resistant to high temperature with frequency selection effect is innovatively prepared, the current preparation problem of the honeycomb sandwich composite material resistant to 350 DEG C high temperature is solved, and the honeycomb sandwich composite material resistant to 350 DEG C high temperature is endowed with superior filtering response characteristics.

1. Name of the product in this design: Table tennis racket rubber re-attachment aid. 2. Purpose of this design: To assist in the secondary bonding of rubber on table tennis rackets. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The invention provides an automobile loudspeaker magnetic circuit bonding device. The automobile loudspeaker magnetic circuit bonding device comprises a machine base, a conveying mechanism, a primary bonding mechanism and a secondary bonding mechanism. The conveying mechanism comprises a rail, a plurality of jigs and a conveying driving assembly. The primary bonding mechanism comprises an upper clamping plate feeding assembly, a primary gluing assembly, a magnet feeding assembly, a primary pressing assembly, a primary drying assembly and a cleaning assembly. The secondary bonding mechanism comprises a secondary gluing assembly, a T iron feeding assembly, a secondary pressing assembly and a secondary drying assembly. According to the magnetic circuit bonding device for the automobile loudspeaker, after the magnet is bonded to the surface of the upper clamping plate, through the cleaning assembly, adhesive left on the inner circumferential side of the magnet, the side, facing the magnet, of the upper clamping plate and the inner circumferential side of the upper clamping plate can be cleaned, the adhesive can be prevented from interfering installation of T iron and a voice coil, the forming quality of a product can be improved, and the production efficiency is improved. And smooth processing can be ensured.

The application discloses a reversible acrylate adhesive with excellent secondary bonding strength and a preparation method, a use method and an application thereof. The adhesive is a new reversible acrylate adhesive formed by combining the reversible anthracene group with the good double bond environment and pressure-sensitive characteristics of the acrylate system. Through the steps of photocuring, thermal depolymerization and photocuring, the problem of reduced strength after secondary bonding of the existing reversible adhesive is overcome, and the shear strength after secondary bonding is increased by 42% compared with that after primary bonding. In addition, the debonding rates of the adhesive in the present application in two debonding processes are 91% and 82% respectively, and the adhesive has good debonding performance. Therefore, the reversible acrylate adhesive can be effectively applied in the electronic field and solve the problem of poor mechanical properties after secondary bonding in the existing reversible electronic adhesive field.

The invention provides a preparation method of a composite substrate, the composite substrate and a surface acoustic wave filter, and the preparation method comprises the steps: providing a first substrate, a second substrate and a piezoelectric wafer, carrying out the thermal oxidation treatment of the second substrate, forming an oxidation layer on a to-be-bonded surface of the second substrate, and carrying out the bonding of the to-be-bonded surface of the second substrate; carrying out ion implantation processing on one end, close to the oxide layer, of the second substrate, and forming a first useful layer and a first multiplexing layer through isolation of an ion implantation layer; carrying out primary bonding on the oxide layers of the first substrate and the second substrate to obtain a first combination body, and then carrying out primary splitting treatment to crack the ion implantation layer to obtain a first multiplexing layer and an intermediate bonding body; and carrying out secondary bonding on the piezoelectric wafer and the first useful layer in the middle bonding body to form a nanopore layer on a bonding interface of the piezoelectric wafer and the first useful layer to obtain the composite substrate. The interface bonding energy of the prepared composite substrate is high, clutter scattering is relieved, and the requirement for device miniaturization is met.

The utility model provides a pre-die for supporting synchronous extrusion of a sidewall and a shoulder pad, which comprises a main plate, a sidewall rubber runner which is obliquely arranged downwards is arranged at the top of the main plate, a seam allowance rubber runner which is obliquely arranged upwards is arranged in the middle of the main plate, and a shoulder pad rubber runner which is obliquely arranged upwards and extends to the sidewall rubber runner is arranged at the bottom of the main plate. The shoulder pad rubber runner and the seam allowance rubber runner are arranged on the left side and the right side of the sidewall rubber runner respectively, and the top of a rubber outlet of the shoulder pad rubber runner and the top of a rubber outlet of the seam allowance rubber runner are located on the same horizontal plane, so that subsequent secondary fitting operation is not needed, the operation steps are reduced, the labor intensity is reduced, the working efficiency is improved, and meanwhile, the production cost is reduced. When the three rubber materials are extruded, a continuous composite interface can be formed, the problem that the tire side is adhered after being reversely wrapped due to deviation of the attaching position in the prior art is solved, the pressure distribution of the rubber materials in the runner is more uniform during synchronous extrusion, the bubble defect of the tire shoulder can be effectively reduced, and the product quality is ensured.

The invention relates to a forming method of an automobile interior trim part made of a polyurethane foam material. Comprising the following steps that a mold cavity corresponding to the automotive upholstery is formed in a mold, the mold cavity comprises a first sub-mold cavity corresponding to a first structural part and a second sub-mold cavity corresponding to a second structural part, the first sub-mold cavity communicates with the second sub-mold cavity, the mold is pretreated, the mold is closed, a foaming raw material is injected into the mold cavity, and the automotive upholstery is obtained. And the foaming raw materials flow in the first sub-mold cavity and the second sub-mold cavity and are cured, an automobile interior trim part blank is formed, the mold is opened, and the automobile interior trim part blank is taken out. According to the forming method of the automobile interior trim part made of the polyurethane foam material, secondary bonding is not needed, the processing technology of the automobile interior trim part is simplified, the production period of the automobile interior trim part is shortened, the production efficiency is improved, the cost is reduced, the connecting strength of the first structure part and the second structure part is improved, and the service life of the automobile interior trim part is prolonged.

This invention relates to the field of micro / nanomaterial fabrication and micro energy storage device technology. The invention discloses an in-situ fabrication method for on-chip integrated nanotube array supercapacitor electrodes, comprising the following steps: in-situ construction of an on-chip patterned template; in-situ electrochemical growth of a metal nanotube array; in-situ conversion of a metal / metal oxide composite structure; and the forming of an integrated electrode. This invention directly constructs a patterned anodic aluminum oxide template on a chip substrate with a pre-prepared patterned conductive layer (non-aluminum material) and completes material growth. The resulting nanotube array electrode and the current collector on the chip are grown in situ and integrally formed, avoiding complex material transfer and secondary bonding steps. This achieves perfect compatibility with planar microelectronic processes and can be mass-produced on 4-inch and larger wafers.

The application provides a composite material rotary body stiffened secondary bonding positioning and detecting device and method. The positioning device comprises: a composite material rotary body, the outer surface of which has a flange part, two first positioning lugs are symmetrically arranged on the flange part, and a first pin hole is formed in each first positioning lug; a composite material tool for rib positioning, the inner surface of which is fitted with at least the area of the cylinder part and the flange part of the outer surface of the composite material rotary body, a second positioning lug is arranged on the composite material tool for rib positioning, a second pin hole is formed in the second positioning lug, and the position of the second pin hole corresponds to the position of the first pin hole one by one; a rotary curvature rib, the two ends of the adhesive surface side of which are respectively provided with third positioning lugs, and a third pin hole is formed in the third positioning lugs; a positioning pin, the positioning pin is configured to selectively pass through the first pin hole and the second pin hole to position the composite material tool for rib positioning on the composite material rotary body; and the positioning pin is configured to pass through the first pin hole and the third pin hole to position the rotary curvature rib on the composite material rotary body.

The invention belongs to the technical field of shoemaking, and particularly discloses a process for covering the surface of a U-shaped curved surface soft sole with cloth. The process disclosed by the invention comprises the following steps: firstly, arranging a cloth sleeve on the upper surface of a mold, and tightening the cloth sleeve; then, first-time bonding and glue brushing are carried out; then, reversely buckling the shoe sole brushed with the glue on a mold, and pressing until the cloth and the shoe sole are firmly bonded; then, the outer side wall of the shoe edge is subjected to secondary bonding and glue brushing; then, the mold and the shoe sole are overturned and placed, and the tightening state of the cloth is relieved; then, the cloth covering the shoe edge is pressed along the outer side wall of the shoe edge brushed with the glue until the cloth is firmly bonded; and finally, the mold is taken away, and redundant cloth is cut off. According to the shoe sole cloth covering device, operation is simplified, cloth covering on the shoe sole is achieved, the covering cloth on the surface of the shoe sole is smooth and free of gaps, and the qualified rate of products is greatly increased. The surface cloth covering device can be widely applied to surface cloth covering of soft shoe soles.

The application discloses a kind of based on winding process hemispherical cover preparation method, belong to aerospace technical field, including the following steps: installation metal core mould, package sealing layer, set winding procedure, carbon fiber inner layer winding, pre-solidification, installation fixed foam interlayer, winding reinforcement layer, installation glass fiber plate interlayer, carbon fiber outer layer winding, solidification, cutting demoulding, machine adds.This application based on winding process hemispherical cover preparation method, both can guarantee product quality, can shorten production cycle, improve production efficiency, play the advantage of automatic equipment, compared with traditional manual laying method, after using winding process, degree of automation is higher, forming cycle is shorter, cost is lower;The hemispherical cover product prepared by the hemispherical cover preparation method of the application is integrally formed with the main body structure without opening end, and is not bonded by adhesive for secondary bonding, so that the product has better pressure bearing effect.

A method for bonding two fiber composite components with each other to form a fiber composite structure includes integrating conductive fibers underneath a bonding surface of at least one of the two fiber composite components, each conductive fiber comprising a carbon fiber coated with an electrically insulating coating, the conductive fibers running along the bonding surface and protruding at least at their ends from the respective fiber composite component; arranging the two fiber composite components against each other at their respective bonding surfaces; passing an electric current through the conductive fibers by electrically contacting the conductive fibers at their protruding ends so that the respective fiber composite component is heated at the bonding surface to a curing temperature; and joining the two fiber composite components with each other at their bonding surfaces via secondary bonding, co-bonding and / or co-curing at the curing temperature, thereby forming the fiber composite structure.

The invention discloses a sandwich composite material light high-strength wing rib and an integral forming method. The wing rib comprises an annular web plate, a peripheral surface layer, a web plate edge strip, a connecting area turned-over edge, a connecting area surface layer and a plurality of wing rib supporting rods. The annular web is of a sandwich structure and is matched with the surface layer composite materials on the two sides, the transverse rigidity is improved, the problems of loading instability and S-shaped bending of an existing wing rib are solved, the characteristics of light weight and high strength are achieved, and the strict requirements of solar airplanes and the like are met. The flanging edge strip, the web edge strip and the connecting area flanging are integrally formed by a surface layer composite material, so that the structural integrity and the damage resistance are enhanced; the surface layer of the connecting area is fixed to the spar, and the connecting area turnup improves the fitting degree and the bonding strength. The two ends of the wing rib supporting rod are clamped between the surface layers on the two sides of the web edge strip, the risk of secondary bonding and splitting is avoided, and the bearing capacity is further enhanced.

To provide a micro pocket coil pad structure in the technical field of furniture products. The cushion includes a lining fabric layer (10), a spring layer (20), and an adhesive-free cotton layer (30). The lining fabric layer encases the spring layer and the adhesive-free cotton layer. The spring layer includes a plurality of microsprings (210) arranged in a rectangular pattern, and a first polypropylene nonwoven fabric (220) and a second polypropylene nonwoven fabric (230) attached to the upper and lower ends of the springs. The first and second polypropylene nonwoven fabrics are ultrasonically welded to form multiple cavities for accommodating the microsprings. In the spring layer, the first and second polypropylene nonwoven fabrics cover the microsprings from above and below and are ultrasonically welded, eliminating the need for secondary bonding or adhesion, resulting in high production efficiency. Each microspring is located in a different cavity between the first and second polypropylene nonwoven fabrics, providing more precise support. The adhesive-free cotton layer is also provided between the lining fabric layer and the spring layer to reduce the stiffness of the microsprings and provide greater comfort. Therefore, the micro pocket coil pad structure can be applied to soft surface furniture such as pillows, seat cushions, mattresses, etc.

The utility model discloses an adhesive tape for supporting, buffering, absorbing and radiating under an OLED (Organic Light Emitting Diode) screen. The adhesive tape comprises a carrier layer, a buffering silica gel layer, a copper foil layer, an adhesive layer and a release layer, the buffer silica gel layer is attached and fixed on the upper surface of the carrier layer; the copper foil layer is attached and fixed on the upper surface of the buffer silica gel layer; the adhesive layer is adhered and fixed on the lower surface of the carrier layer; and the release layer is adhered and fixed on the lower surface of the adhesive layer. The buffer silica gel layer and the adhesive layer are attached and fixed to the upper surface and the lower surface of the carrier layer respectively, the buffer silica gel layer and the adhesive layer have the buffer function and the adhesive function respectively, the functions of structural materials of all layers of the product are independent, the use performance and stability of the product are guaranteed, meanwhile, the product is of an integrated structure, and the service life of the product is prolonged. And secondary lamination is not needed, attenuation and influence on functional characteristics of each layer of material are avoided, imported buffer foam is not needed, and the material cost is greatly reduced.

The invention relates to hand mask production equipment. The hand mask production equipment comprises a rack, a mask supply assembly, a conveying assembly, a cutter assembly and a welding embossing assembly. The film supply assembly, the cutter assembly and the welding embossing assembly are sequentially arranged in the conveying direction of film cloth. The two groups of film supply assemblies are symmetrically arranged on the rack and are positioned at the upper part and the lower part of the rack; the conveying assembly is arranged on the peripheral side of the film supply assembly and used for conveying film cloth on the film supply assembly. The cutter assembly is arranged on the rack and used for cutting off the preset position of the film cloth, and the preset position is the film opening position of the hand film; the welding and embossing assembly is arranged on the rack and used for conducting welding and embossing treatment on the film cloth on the two film supply assemblies. According to the scheme provided by the invention, the problems that in the prior art, the bonding position is inconvenient to adjust, the PE film is easy to tear to cause liquid leakage, the secondary bonding force is reduced, the hand mask is not easy to tear and the mask cloth is easy to separate can be effectively solved, the practicability of the hand mask is greatly improved, and the use experience feeling of a user is enhanced.