30 results about "Wedge bonding" patented technology

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at a terminal end of the body portion. The tip portion includes a groove surface defining a groove. The groove is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

There is provided a bonding wire for semiconductor devices that exhibits a favorable bondability even when being applied to wedge bonding at the room temperature, and also achieves an excellent bond reliability. The bonding wire includes a core material of Cu or Cu alloy (hereinafter referred to as a “Cu core material”), and a coating containing a noble metal formed on a surface of the Cu core material. A concentration of Cu at a surface of the wire is 30 to 80 at %.

The invention discloses a plastic package patch ideal diode and a packaging method, the plastic package patch ideal diode comprises a frame, the frame is provided with three electrodes, and soft solder is used on the electrodes OUT to sinter and connect an MOS chip and a ceramic copper-clad plate; according to the package, the control chip and the low-on-resistance power MOS are electrically connected through the copper-clad ceramic plate and different bonding wires, so that the overall function of the control chip and the low-on-resistance power MOS is achieved. The control chip changes the output driving voltage by detecting the voltage difference between the source end and the drain end of the MOS so as to control the on-off of the MOS, the power consumption of the whole control part is very low, so that the control part is connected to the input and the output in a gold wire ball bonding and fine aluminum wire wedge bonding mode, the power part, namely the source end and the drain end of the MOS, needs to bear considerable current, and the power consumption is very low. Therefore, the purpose of reducing the loss is achieved by adopting the modes of thick aluminum wire bonding and soldering lug sintering for connection. The packaging employs an integral structure of the copper frame and the plastic packaging material, and the cost is controllable.

The invention relates to the technical field of microelectronic packaging technology and semiconductor manufacturing equipment, in particular to a clamp for ultrasonic wedge-shaped bonding and a bonding method. The invention provides a clamp for ultrasonic wedge bonding, which comprises a mounting plate, a plurality of bonding substrates and spring thimbles, and is characterized in that the mounting plate is used for providing base support, and the plurality of bonding substrates are embedded on the mounting plate; the spring ejector pin is arranged on the side surface of the mounting plate, and the spring ejector pin is inserted into the mounting plate and abuts against the side surface of the bonding substrate; the mounting plate is provided with a positioning screw hole, and the positioning screw hole is used for providing a positioning mounting position for the automatic wedge-shaped bonding machine. The invention further provides a bonding method which is matched with the clamp to realize stable and efficient clamping of the substrate without a blind area, so that the bonding precision and the production efficiency are improved.

The invention belongs to the field of semiconductor integrated circuit packaging testing, and discloses an FOW process anti-wire-collapse and anti-glue-overflow lead bonding method and a chip product, and the method comprises the steps: forming a first Bump on a bonding pad of a first chip layer through solder ball planting, and then bonding an RSSB wire on the first Bump through arc wedge bonding, and then, solder balls are planted on the wedge welding points of the first Bump to form at least one new Bump, and the laminated Bump structure is formed. In the surface mounting process of the upper-layer chip, the downward pressure of the surface mounting directly acts on the Bump, instead of an RSSB wire arc or an FOW adhesive film. The laminated Bump structure adopting the method can effectively bear and transmit the downward pressure in the surface mounting process, so that the risk of wire arc collapse is reduced, the overflow of the FOW adhesive film is prevented, and the process stability and the packaging reliability are remarkably improved.

The utility model belongs to the technical field of main shaft machining, and particularly relates to a press machine for machining a main shaft, which comprises a bottom plate, four stand columns arranged at the top of the bottom plate and a bearing plate used for bearing a main shaft forge piece, a supporting plate arranged at the tops of the four stand columns, and a hydraulic assembly arranged on the supporting plate. Two first sliding grooves and two second sliding grooves are formed in the upper surface of the bottom plate, rotating assemblies are arranged in the two first sliding grooves, first wedge-shaped blocks are arranged on the rotating assemblies, telescopic assemblies are arranged at the tops of the first wedge-shaped blocks, first connecting plates are arranged at the tops of the telescopic assemblies, and rotating assemblies are arranged on the first connecting plates. An elastic moving assembly is arranged in each second sliding groove, an impurity removing plate attached to the surface of the bearing plate is arranged on each elastic moving assembly, and second wedge-shaped blocks attached to the first wedge-shaped blocks are arranged at the two ends of each impurity removing plate. According to the device, the forge piece can be turned over automatically, the working efficiency is improved, meanwhile, impurities can be removed in time, and the machining quality is guaranteed.

This application relates to the field of semiconductor processing, specifically a wire bonding collision detection method. The method includes acquiring the first position coordinates and first specification parameters of a workpiece, and the second position coordinates and second specification parameters of a wedge bonding head. Based on the first and second position coordinates, the method calculates the actual horizontal and vertical distances between the workpiece and the wedge bonding head. Based on the first and second specification parameters and the actual vertical distance, the method calculates the theoretical horizontal distance between the center of the workpiece and the bonding end of the wedge bonding head. Based on the comparison between the actual and theoretical horizontal distances, the method determines whether the workpiece will collide with the wedge bonding head during rotation. This application also provides related equipment for wire bonding collision detection. This method can predict collisions between the workpiece and the wedge bonding head in advance, effectively avoiding losses caused by collisions between the wedge and the workpiece, and ensuring processing continuity during production.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at a terminal end of the body portion. The tip portion includes a groove surface defining a groove. The groove is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

The invention belongs to the technical field of chip bonding equipment, and particularly relates to a spring hinge force compensation device and a wedge welder. The Z-axis motor is mounted on the base; the bonding head unit is connected to the lower end of the Z-axis motor; one end of the spring hinge mechanism is connected with the Z-axis motor, and the other end of the spring hinge mechanism is connected with the base; the spring hinge mechanism comprises a hinge support, a support, a connecting rod and a spring assembly, the two ends of the hinge support are rotationally connected with the support and the connecting rod respectively, and the spring assembly is installed on the hinge support and is in transmission connection with the connecting rod; according to the invention, the Z-axis motor can realize upward self-resetting under the condition of power failure, the binding head damage caused by the gravity effect is avoided, and the variable force generated in the movement process of the Z-axis motor is very small, so that the movement stability and the movement precision of the Z-axis motor are improved.

In a general aspect, an electrical device assembly (e.g., a battery module) can include a first electrical contact surface, a second electrical contact surface, and a ribbon wire extending along a longitudinal axis. The ribbon wire can include a first portion, a second portion and a third portion. The first portion of the ribbon wire can be coupled with the first electrical contact surface via a first wedge bond. The second portion of the ribbon wire can be coupled with the second electrical contact surface via a second wedge bond. The third portion of the ribbon wire can extend between the first portion and the second portion. The first portion can have a first width transverse to the longitudinal axis of the ribbon wire, and the third portion can have a second width transverse to the longitudinal axis, the first width being greater than the second width.

The embodiments of the present application relate to a welding head and a wedge bonding blade comprising the same. According to some embodiments of the present application, a welding head comprises a body and an end portion located at one end of the body, the end portion comprising a first end face for applying a force to a lead wire to weld the lead wire to a target face, the first end face being provided with a plurality of grooves. Some other embodiments of the present application further provide a wedge bonding blade comprising the aforementioned welding head. The welding head and the wedge bonding blade comprising the same provided by the embodiments of the present application can effectively solve the problems encountered in the prior art.

Provided is a novel Al-Mg alloy-based Al bonding wire that has excellent wire drawing and wedge bonding characteristics, as well as excellent reliability at high temperature and high humidity. This Al bonding wire is characterized by containing 0.10-2.0 mass% of Mg, 5-500 mass ppm in total of one or more elements (also referred to as "first group elements") selected from the group consisting of Ga, Ge, Ta, and Ag, and 5-500 mass ppm of Ni, wherein the balance includes Al.

A wedge tool according to one aspect of the present disclosure is a wedge tool used for wedge bonding of pressing a metal wire and applying ultrasonic vibration, thereby bonding the metal wire to a bonded body, including: a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and at least two convex parts formed in a groove bottom part of the wire holding groove and having a side surface located away from a sidewall of the wire holding groove and arranged in the longitudinal direction of the metal wire.

The application relates to the technical field of microelectronic packaging, and particularly discloses a wedge-shaped bonding structure and a use method thereof, wherein the wedge-shaped bonding structure is used for wire bonding and comprises a wedge and a wire clamp used in cooperation with the wedge; the wire clamp comprises a clamping part and a body connected with the clamping part; a wire via hole and a wire limiting groove in communication with the wire via hole and arranged close to one side of the wedge are arranged on the body; and a use method thereof is disclosed; compared with the wedge structure in the prior art, the wedge structure is simplified, the processing difficulty and cost of the wedge are reduced; when the wedge is scrapped, only the wedge needs to be replaced, and the wire clamp can be used for a long time; the structure is simple and practical.

Power semiconductor unit (100) comprising: - a metal layer (3), - a semiconductor element (4) bonded to the metal layer (3) via a solder layer (7), and - a wire bump (9) extending in the direction in the plane of the solder layer (7) and bonded to the metal layer (3), - wherein an alloy of the material of the wire bump (9) and the material of the solder layer (7) is arranged at the interface between the wire bump (9) and the solder layer (7) and - wherein the wire bump (9) is bonded to the metal layer (3) only by a wedge bond connection region.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at an end of the body portion. The tip portion includes a groove surface defining a groove. The recess is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

The application relates to a gold wire ball wedge soldering bonding method, which adopts a ball soldering process to plant a first gold ball on an RF pad of a PCB, adopts a wedge soldering process to wedge solder one end of a gold wire on an RF pad of a silicon optical chip, and then wedge solder the other end on the first gold ball after being pulled high; or, first adopts a ball soldering process to plant a second gold ball on an RF pad of a silicon optical chip and a first gold ball on an RF pad of a PCB, and then adopts a wedge soldering process to wedge solder one end of a gold wire on one second gold ball, and then wedge solder the other end on one first gold ball after being pulled high. A 1.6T silicon optical module comprises a structure bonded by the gold wire ball wedge soldering bonding method. The gold wire ball wedge soldering bonding method solves the problems of the total length of the gold wire being too long and the reliability of wedge soldering on the pad of the PCB being unstable, the diameter of the gold wire can be 35 mu after the ball wedge soldering, the force is strong, the reliability is good, and the high-frequency performance is good.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at a terminal end of the body portion. The tip portion includes a groove surface defining a groove. The groove is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at an end of the body portion. The tip portion includes a groove surface defining a groove. The recess is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

A method of determining a cutter height on a wedge bonding machine is provided. The method includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.

The invention relates to a gold wire ball wedge bonding method, which comprises the following steps of: planting a first gold ball on an RF (Radio Frequency) bonding pad of a PCB (Printed Circuit Board) by adopting a ball bonding process, carrying out wedge bonding on one end of a gold wire on an RF bonding pad of a silicon optical chip by adopting a wedge bonding process, and pulling the other end of the gold wire up and then carrying out wedge bonding on the first gold ball; or, the second gold balls are planted on the RF bonding pad of the silicon optical chip and the first gold balls are planted on the RF bonding pad of the PCB by adopting a ball bonding process, then one end of the gold wire is subjected to wedge bonding on one second gold ball by adopting a wedge bonding process, and the other end of the gold wire is pulled up and then is subjected to wedge bonding on one first gold ball. The 1.6 T silicon optical module comprises the structure formed by bonding through the gold wire ball wedge bonding method. The method has the beneficial effects that the problem that the total length of the gold wire is too long is solved by adopting a gold wire ball wedge bonding method, the problem that the reliability of wedge bonding on a bonding pad in a PCB is unstable is solved, after ball wedge bonding is adopted, the maximum diameter of the gold wire can be 35 microns, the force is strong, the reliability is good, and the high-frequency performance is good.

The application relates to the field of special equipment manufacturing for semiconductor devices, in particular to a wedge bonding head device. The wedge bonding head device is applied to lead welding of semiconductor devices and comprises a driving main body, a welding head, a winding wheel and a conveying assembly arranged on the driving main body. An adjusting mechanism for adjusting the tightness of the lead during the conveying process is arranged on the driving main body. The adjusting mechanism is provided with a tensioning wheel. The conveying assembly comprises two conveying wheels arranged on the two sides of the lead and capable of moving close to or away from each other. A linkage assembly is arranged between the adjusting mechanism and the two conveying wheels. The linkage assembly comprises a synchronous structure connecting the two conveying wheels and a connecting piece capable of driving the synchronous structure to move in cooperation with the tensioning wheel. The lead tension is adjusted by the tensioning wheel, and the two conveying wheels are synchronously driven by the linkage assembly to pre-relax the lead, so that the welding points are prevented from falling off due to the action force of the lead during the continuous welding process.

The utility model relates to an auxiliary device for replacing a wiring trough block, which comprises a left tweezer body and a right tweezer body, the left tweezer body and the right tweezer body are mutually crossed and hinged, a bayonet is formed on the side wall of a tweezer claw end of the left tweezer body, and a positioning pit is formed on one surface, facing the left tweezer body, of a tweezer claw end of the right tweezer body. The positioning pits in the forceps claw end of the right forceps body correspond to and are clamped at the bottom of the wiring trough block, then the clamping opening in the forceps claw end of the left forceps body is arranged on the side face of the upper end of the wiring trough block in a sleeving mode, the bottom end of the left forceps body abuts against the surface of the opening in the annular object provided with the guiding trough block, and then the forceps claw end of the left forceps body and the forceps claw end of the right forceps body are driven to be close to each other. The wiring trough block is ejected out; through the auxiliary device of the scheme, a wedge (wedge bonding) and a cutter (specially-made cutter) are not damaged, a worker for disassembly and assembly is not damaged, and the wiring trough block does not move randomly in the disassembly and assembly process.

In a general aspect, an electrical device assembly (e.g., a battery module) can include a first electrical contact surface, a second electrical contact surface, and a ribbon wire extending along a longitudinal axis. The ribbon wire can include a first portion, a second portion and a third portion. The first portion of the ribbon wire can be coupled with the first electrical contact surface via a first wedge bond. The second portion of the ribbon wire can be coupled with the second electrical contact surface via a second wedge bond. The third portion of the ribbon wire can extend between the first portion and the second portion. The first portion can have a first width transverse to the longitudinal axis of the ribbon wire, and the third portion can have a second width transverse to the longitudinal axis, the first width being greater than the second width.

The objective of this invention is to ensure the reliability of primary bonding (also known as first bonding, FAB bonding, ball bonding) and secondary bonding (also known as second bonding, wedge bonding), improve the anti-deposition properties of the cutting edge, and maintain and improve the productivity of the bonding process. The aim is to provide an Ag bonding line that achieves the above objectives. The bonding line that achieves these objectives is an Ag bonding line composed of an Ag alloy comprising: In: 0.05% to 3.0% by mass; Pd, Pt, and Au: 0.010% to 5.0% by mass; Sc, Ti, and Mn: 0.0005% to 0.050% by mass; and P, Zn, Bi, and Cu: 0% to 0.030% by mass.

The wedge bonding chopper is applied to the field of chip welding and comprises a chopper body, a welding end is arranged at one end of the chopper body, two receding grooves are formed in the outer edge of the welding end, the welding end is located between the two receding grooves, a welding inclined face and a working face are arranged at the end, away from the chopper body, of the welding end, and the working face is located between the welding inclined face and the working face. A first through groove is formed in the welding inclined face, a second through groove is formed in the working face, the two ends of the second through groove are communicated with the two receding grooves respectively, a first threading hole is formed in the cutter body, and a second threading hole is formed in the groove bottom of the first through groove. The welding structure has the technical effects that the two avoiding grooves are formed in the welding end, so that the use space occupied by the welding end is reduced, the possibility of interference between the outer edge of the welding end and the near wall of the deep cavity is reduced, the deep cavity welding conditions of ultra-narrow spacing and ultra-high near wall can be conveniently dealt with, the use limitation is small, and the welding efficiency is improved.

A semiconductor chip is arranged over a substrate in the form of a leadframe. A set of current-carrying formations configured as conductive ribbons are coupled to the semiconductor chip. The substrate does not include electrically conductive formations for electrically coupling the conductive ribbons to each other. Electrical contacts are formed via wedge bonding, for instance, between adjacent ones of the conductive ribbons so that a contact is provided between the adjacent ones of the conductive ribbons in support of a multi-formation current-carrying channel.

The utility model provides a near-wall bonding auxiliary clamp of a manual wedge bonding machine, an operation surface is arranged at the top of an operation table, a product box is placed on the operation surface, and the operation surface is obliquely arranged from one end close to a welding pin of the wedge bonding machine to one end far away from the welding pin of the wedge bonding machine from low to high; the first locking mechanism is arranged on the operation surface, and the first locking mechanism is used for locking the product box, so that the product box and the operation surface are relatively fixed; and the second locking mechanism is arranged at the bottom of the operation table and is used for fixing the operation table on a heating table of the wedge bonding machine. According to the utility model, the design of the inclined operation surface optimizes the space adaptability of the welding pin and the near-wall area of the product box, so that the near-wall operation can be realized without depending on a special wire clamp or a customized chopper in the bonding process; the first locking mechanism ensures that the product box is stably connected with the operation table, and the second locking mechanism ensures the bonding precision by fixing the relative position of the operation table and the heating table.

A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion including a tip portion, the tip portion terminating at a working end of the wedge bonding tool. The tip portion includes (i) two opposing walls, and (ii) an adjoining surface between the two opposing walls. The adjoining surface includes a flat area. The two opposing walls and the flat area define a groove configured to receive a wire. The flat area has a width of at least 20% of a width of the groove at the working end.