11 results about "Wedge bonding" patented technology

There is provided a bonding wire for semiconductor devices that exhibits a favorable bondability even when being applied to wedge bonding at the room temperature, and also achieves an excellent bond reliability. The bonding wire includes a core material of Cu or Cu alloy (hereinafter referred to as a “Cu core material”), and a coating containing a noble metal formed on a surface of the Cu core material. A concentration of Cu at a surface of the wire is 30 to 80 at %.

This application relates to the field of semiconductor processing, specifically a wire bonding collision detection method. The method includes acquiring the first position coordinates and first specification parameters of a workpiece, and the second position coordinates and second specification parameters of a wedge bonding head. Based on the first and second position coordinates, the method calculates the actual horizontal and vertical distances between the workpiece and the wedge bonding head. Based on the first and second specification parameters and the actual vertical distance, the method calculates the theoretical horizontal distance between the center of the workpiece and the bonding end of the wedge bonding head. Based on the comparison between the actual and theoretical horizontal distances, the method determines whether the workpiece will collide with the wedge bonding head during rotation. This application also provides related equipment for wire bonding collision detection. This method can predict collisions between the workpiece and the wedge bonding head in advance, effectively avoiding losses caused by collisions between the wedge and the workpiece, and ensuring processing continuity during production.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at a terminal end of the body portion. The tip portion includes a groove surface defining a groove. The groove is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

The invention belongs to the technical field of chip bonding equipment, and particularly relates to a spring hinge force compensation device and a wedge welder. The Z-axis motor is mounted on the base; the bonding head unit is connected to the lower end of the Z-axis motor; one end of the spring hinge mechanism is connected with the Z-axis motor, and the other end of the spring hinge mechanism is connected with the base; the spring hinge mechanism comprises a hinge support, a support, a connecting rod and a spring assembly, the two ends of the hinge support are rotationally connected with the support and the connecting rod respectively, and the spring assembly is installed on the hinge support and is in transmission connection with the connecting rod; according to the invention, the Z-axis motor can realize upward self-resetting under the condition of power failure, the binding head damage caused by the gravity effect is avoided, and the variable force generated in the movement process of the Z-axis motor is very small, so that the movement stability and the movement precision of the Z-axis motor are improved.

The embodiments of the present application relate to a welding head and a wedge bonding blade comprising the same. According to some embodiments of the present application, a welding head comprises a body and an end portion located at one end of the body, the end portion comprising a first end face for applying a force to a lead wire to weld the lead wire to a target face, the first end face being provided with a plurality of grooves. Some other embodiments of the present application further provide a wedge bonding blade comprising the aforementioned welding head. The welding head and the wedge bonding blade comprising the same provided by the embodiments of the present application can effectively solve the problems encountered in the prior art.

A wedge tool according to one aspect of the present disclosure is a wedge tool used for wedge bonding of pressing a metal wire and applying ultrasonic vibration, thereby bonding the metal wire to a bonded body, including: a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and at least two convex parts formed in a groove bottom part of the wire holding groove and having a side surface located away from a sidewall of the wire holding groove and arranged in the longitudinal direction of the metal wire.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion and a tip portion at an end of the body portion. The tip portion includes a groove surface defining a groove. The recess is configured to receive a wire during a wire bonding operation. The groove surface includes a plurality of laser scribed recesses.

The objective of this invention is to ensure the reliability of primary bonding (also known as first bonding, FAB bonding, ball bonding) and secondary bonding (also known as second bonding, wedge bonding), improve the anti-deposition properties of the cutting edge, and maintain and improve the productivity of the bonding process. The aim is to provide an Ag bonding line that achieves the above objectives. The bonding line that achieves these objectives is an Ag bonding line composed of an Ag alloy comprising: In: 0.05% to 3.0% by mass; Pd, Pt, and Au: 0.010% to 5.0% by mass; Sc, Ti, and Mn: 0.0005% to 0.050% by mass; and P, Zn, Bi, and Cu: 0% to 0.030% by mass.

The utility model provides a near-wall bonding auxiliary clamp of a manual wedge bonding machine, an operation surface is arranged at the top of an operation table, a product box is placed on the operation surface, and the operation surface is obliquely arranged from one end close to a welding pin of the wedge bonding machine to one end far away from the welding pin of the wedge bonding machine from low to high; the first locking mechanism is arranged on the operation surface, and the first locking mechanism is used for locking the product box, so that the product box and the operation surface are relatively fixed; and the second locking mechanism is arranged at the bottom of the operation table and is used for fixing the operation table on a heating table of the wedge bonding machine. According to the utility model, the design of the inclined operation surface optimizes the space adaptability of the welding pin and the near-wall area of the product box, so that the near-wall operation can be realized without depending on a special wire clamp or a customized chopper in the bonding process; the first locking mechanism ensures that the product box is stably connected with the operation table, and the second locking mechanism ensures the bonding precision by fixing the relative position of the operation table and the heating table.

A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.

A wedge bonding tool is provided. The wedge bonding tool includes a body portion including a tip portion, the tip portion terminating at a working end of the wedge bonding tool. The tip portion includes (i) two opposing walls, and (ii) an adjoining surface between the two opposing walls. The adjoining surface includes a flat area. The two opposing walls and the flat area define a groove configured to receive a wire. The flat area has a width of at least 20% of a width of the groove at the working end.