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Lead bonding method for lead frame plastically packaged in advance

A technology of wire bonding and plastic-encapsulated leads, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the pollution of the bonding area, reduce the bonding strength between the gold wire end 193 and the inner pin 13, reduce the Solve problems such as wire bonding reliability, achieve good reliability, avoid pollution problems, and improve bonding strength

Active Publication Date: 2012-12-12
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During pre-molding, materials such as resin used to form the pre-molding body tend to overflow from the slit between the mold (such as the upper mold) and the surface of the lead frame to the inner pins 13, which may form tiny structures such as plastic flashes that are difficult to see with the naked eye , which contaminates the bonding area of ​​the inner pin 13
The pollution caused by the pre-molding process will greatly reduce the bonding strength between the gold wire end 193 and the inner pin 13, and even make it difficult for the gold wire end 193 to be soldered and fixed on the silver layer of the inner pin 13
Therefore, the reliability of wire bonding is greatly reduced

Method used

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  • Lead bonding method for lead frame plastically packaged in advance
  • Lead bonding method for lead frame plastically packaged in advance
  • Lead bonding method for lead frame plastically packaged in advance

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Embodiment Construction

[0022] Presented below are some of the many possible embodiments of the invention, intended to provide a basic understanding of the invention. It is not intended to identify key or critical elements of the invention or to delineate the scope of protection. It is easy to understand that, according to the technical solution of the present invention, those skilled in the art may propose other alternative implementation manners without changing the essence and spirit of the present invention. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solution of the present invention, and should not be regarded as the entirety of the present invention or as a limitation or restriction on the technical solution of the present invention.

[0023] In the present invention, "the first pad" is the connection point between the lead wire and the pad of the chip, and the "second pad" is the connection point between the lead wire and the lea...

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Abstract

The invention provides a lead bonding method for a lead frame plastically packaged in advance, and belongs to the technical field of packaging of chips. The lead bonding method is characterized in that by the lead bonding method, bonded balls are planted on second bonded spots in a pressure manner after the second bonded spots are formed in a wedge bonding manner. Inner lead feet bonded by the lead bonding method are high in bonding strength and good in reliability, and the lead bonding method is particularly applicable to lead bonding for lead frames plastically packaged in advance.

Description

technical field [0001] The invention belongs to the technical field of chip packaging and relates to a gold wire bonding method for a lead frame with a pre-molded package. Background technique [0002] In IC packaging technology, it is necessary to select the packaging form and packaging process according to the circuit function requirements of different circuit chips. Among them, the packaging process usually includes a wire bonding process and a plastic sealing process. Wire bonding is the process of connecting the pads of the chip to the lead frame with very thin metal wires. In the traditional packaging process, the IC chip (Die) is generally loaded on the small island of the lead frame first, then wire bonded, and then the bonded chip and part of the lead frame are plastic-sealed to achieve the fixation of the package. However, for IC chips with special functions, such as sensor chips (for example, MEMS pressure sensor chips), the packaging process is different from t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L2224/48997H01L2224/45144H01L2224/48465H01L24/48H01L2224/48247H01L2224/05554H01L2224/45015H01L2224/48H01L2224/85207H01L2224/85951H01L2924/1461H01L2224/48455H01L2924/00H01L2924/00012
Inventor 郁琦王建新经文斌
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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