Microwave low waveband ultra-minitype power synthesizer

A power combiner and low-band technology, applied in waveguide devices, electrical components, circuits, etc., can solve problems such as low integration, large volume, and complex structure, and achieve good circuit consistency, small volume, and high gain Effect

Inactive Publication Date: 2009-05-20
SHENZHEN GRENTECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in order to obtain a large enough gain in the RF power combiner, multi-stage amplification is usually used, and some require an external bridge, which makes the product larger in size, complex in structure and low in integration.

Method used

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  • Microwave low waveband ultra-minitype power synthesizer
  • Microwave low waveband ultra-minitype power synthesizer
  • Microwave low waveband ultra-minitype power synthesizer

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Embodiment Construction

[0011] The present invention will be described in detail below with reference to the accompanying drawings and examples. However, the invention is not limited to the examples given.

[0012] like figure 1 As shown, the circuit composition of microwave low-band ultra-miniature power combiner of the present invention comprises the power divider GF11 of tree structure, GFml-GFmn, n path balanced amplifier BP1-BPn, the combiner HL11 of tree structure, HLml-HLmn , the radio frequency input RFin is connected to the dry input end of the power divider (that is, the input end of the power divider GF11), and the pin output end of the power divider (that is, the output end of the power divider GFml-GFmn) is respectively connected to the input of n-way balanced amplifiers end, the output of the n-way balanced amplifier is connected to the tip input of the combiner (ie the input of the combiner HLml-HLmn), and the output of the dry output of the combiner (ie the output of the combiner HL1...

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Abstract

The invention discloses a micro-wave low-band ultra-micro power combiner, which is characterized in that a circuit composition comprises power dividers with a tree structure, more than or equal to 2 of multi-channel balanced amplifiers, and combiners with a tree structure, wherein each balanced amplifier consists of an IC amplifying device and two 3dB quadrature bridges, the power dividers, the combiners, the 3dB quadrature bridges in the balanced amplifiers, and peripheral circuits of the IC amplifying devices in the balanced amplifiers are produced on a ceramic substrate, and the IC amplifying devices are fixed on the ceramic substrate through wedge bonding. Circuits of a radiofrequency power combiner are produced on the ceramic substrate, the IC amplifying devices are fixed on the ceramic substrate through wedge bonding, the circuits have good consistency and the power combiner has the advantages of high gain, high integration level, high efficiency, small volume and so on, and the power combiner, is suitable for mass production, greatly reduces production cost, and is suitable to be applied to base station transmitters and small whole machines in the field of microwave communication.

Description

Technical field: [0001] The invention relates to a radio frequency power synthesizer in the field of microwave communication, in particular to a microwave low-band ultra-miniature power synthesizer with high gain, high integration and high efficiency. Background technique: [0002] In the field of microwave communication, base station transmitters and small complete machines have high requirements on output power, requiring the signal to have sufficient power when transmitting, so that the signal can be transmitted far enough to cover a certain area. However, it is often difficult to obtain such a high power by single-channel power amplification. At this time, it is necessary to use power combining technology. Power combining is to combine smaller power into larger output power. At present, in order to obtain a large enough gain in the RF power combiner, multi-stage amplification is usually used, and some require an external bridge, which makes the product bulky, complex in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/213
Inventor 庄昆杰傅阳波陈天佑
Owner SHENZHEN GRENTECH CO LTD
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