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36 results about "Burr formation" patented technology

Aqueous-oily low-viscosity environment-friendly two-component adhesive and preparation method thereof

The invention relates to an aqueous-oily low-viscosity environment-friendly two-component adhesive and a preparation method thereof. The objective of the invention is to provide the environment-friendly polyurethane two-component adhesive which is good in bonding strength, wettability, fire resistance and weatherability, stable in performance and easy to coat. The adhesive is characterized in that the adhesive comprises a component A including water glass and a component B including a mixture of a polyurethane prepolymer and polyisocyanate; the component A contains no or little filler; and in the component B, the content of NCO is 8.5 to 25%, and the content of an organic solvent is 8% to 19.9%. Because the component A contains no or little filler and the component B contains an appropriate amount of an organic solvent, hydroxylated nano-silicon in the water glass and a part of reactive groups wrapped and concealed in the prepolymer are fully activated, so a unique dense interpenetrating polymer network is formed, thereby overcoming the problem of burr formation caused by small amounts of filler and solvents and the problems of poor compatibility and difficult coating caused by multiple solvents and producing unexpected technical effects.
Owner:CHONGQING LIERDA SCI & TECH DEV

Lead frame for semiconductor device

A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.
Owner:NXP USA INC

Method for determining the cut quality of a laser cutting process using a simulation program

The application relates to a method for determining the cut quality of a laser cutting process, said quality being assessed on the basis of the formation of solidification ridges along the cut face and / or burr formation on the lower edge of the cut face. In said method, a virtual laser cutting machine in a simulation program can be virtually operated with a set of values P0 from a parameter space P.; In a step a), the parameter set P0 is entered in the virtual cutting machine (103), then in step b), a cut is made in the virtual workpiece by calculating, from partial differential equations with initial and boundary values, the progression of the melt film thickness over time and the position of the melt front at the apex of the cutting front according to the depth of the cut and the time, and then in step c), the spatial distribution of the ridge amplitude on the cut face is specified by projecting the progression of the absorption front onto the cut face and / or a spatial distribution of the burr is calculated from the progression of the melt film thickness over time and the discharge speed on the lower edge of the cut face, and in step d), a virtual cut quality is provided (104) for further analysis.
Owner:FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EV +1

High-strength hot-dip galvanized steel sheet reduced in burr formation and process for producing same

ActiveCN102712979AExcellent burr resistanceHot-dipping/immersion processesFurnace typesPearliteMartensite
Provided are a high-strength hot-dip galvanized steel sheet which is reduced in burr formation, i.e., low in the height of burrs, and a process for producing the steel sheet. The high-strength hot-dip galvanized steel sheet reduced in burr formation is characterized by having a composition which contains, in terms of mass%, 0.04-0.13% C, 1.0-2.3% Si, 0.8-2.0% Mn, up to 0.05% P, 0.0010-0.01% S, up to 0.1% Al, and up to 0.008% N, with the remainder comprising Fe and incidental impurities, and by having a structure which comprises, in terms of areal proportion, at least 75% ferrite phase, at least 1% bainitic ferrite phase, and 1-10% pearlite phase, has a martensite phase content less than 5% in terms of areal proportion, and satisfies (areal proportion of martensite) / ((areal proportion of bainitic ferrite)+(areal proportion of pearlite))<=0.5.
Owner:JFE STEEL CORP

Semiconductor device with leadframe configured to facilitate reduced burr formation

A semiconductor package or device including a uniquely configured leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in burr formation resulting from a saw singulation process used to complete the fabrication of the semiconductor device. The semiconductor device includes a die pad defining multiple peripheral edge segments. In addition, the semiconductor device includes a plurality of leads which are provided in a prescribed arrangement. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, the lands, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and the leads being exposed in a common exterior surface of the package body.
Owner:AMKOR TECH SINGAPORE HLDG PTE LTD

Conformal lithium polymer battery

This invention is a method of fabricating a conformal lithium polymer battery comprising the steps of: selecting a slab of lithium polymer battery material of a desired height, containing a desired number of cells; freezing the slab; vertically cutting the slab to a desired shape; attaching a lead to each anode conductor; and attaching a lead to a each cathode conductor. The slab may contain one or many cells. The leads may be made of multistranded, metallic wire, metallic ribbon, low melting point alloy, self-healing metal, and litz wire. Attachment is accomplished so as to minimize tension on the leads. The cut slab may need to be deburred after cutting and before attaching leads. Preferably, burr formation is prevented by recessing the edge of the anodic or cathodic half cells. Lead attachment my be accomplished by: wire bonding; wedge bonding; adhesive bonding with conductive epoxy, anistotropic conductive adhesive or conductive thermoplastic; stapling; adhering the lead to the electrode by electropolymerization; welding; and growing a lead in place by electroless plating, electro-plating or a combination of electroless plating and electroplating. The distal ends of the leads may be connected together so that the cells are connected together in series, in parallel or some in series and the remainder in parallel. After the leads have been attached to the cut slab and connected together, the assembly will preferably be wrapped with standard packaging for lithium polymer batteries.
Owner:MB RES & DEV LLC A CA LTD LIABILITY

Pump body die casting welding method

Provided is a pump body die casting welding method. The pump body die casting welding method includes the following steps that 1 a die casting is machined and polished until the phenomena of burrs, die drawing, excessive materials and misrun do not exist in a concave groove of the die casting; 2 a flawless insert is taken, and the periphery of a convex groove of the insert is coated with grease; 3 a sealing ring is added to the insert after the insert is coated with the grease, and the convex groove is fixed; 4 the insert is struck to enter the concave groove, wherein the insert is lower than the outside plane of the concave groove; 5 the size of the die casting is corrected, and the surface of the die casting is polished; 6 the die casting is placed on a laser welding machine, laser welding is conducted on the die casting, and leakage testing is conducted on the die casting after welding is completed. According to the pump body die casting welding method, polishing, insert machining and welding are conducted on a pump body formed in a die-casting mode, the surface of the pump body formed in the die-casting mode is smooth and free of burrs, the formed pump body is more complete in structure, defects formed in the die pressing process are well overcome, and the qualified pump body is machined and obtained.
Owner:ANHUI HUOSHAN LONGXIN METAL TECH CO LTD

Method for determining the cut quality of a laser cutting process using a simulation program

The application relates to a method for determining the cut quality of a laser cutting process, said quality being assessed on the basis of the formation of solidification ridges along the cut face and/or burr formation on the lower edge of the cut face. In said method, a virtual laser cutting machine in a simulation program can be virtually operated with a set of values P0 from a parameter space P.; In a step a), the parameter set P0 is entered in the virtual cutting machine (103), then in step b), a cut is made in the virtual workpiece by calculating, from partial differential equations with initial and boundary values, the progression of the melt film thickness over time and the position of the melt front at the apex of the cutting front according to the depth of the cut and the time, and then in step c), the spatial distribution of the ridge amplitude on the cut face is specified by projecting the progression of the absorption front onto the cut face and/or a spatial distribution of the burr is calculated from the progression of the melt film thickness over time and the discharge speed on the lower edge of the cut face, and in step d), a virtual cut quality is provided (104) for further analysis.
Owner:FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EV +1
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