A method for deburring the edge of high-frequency Teflon circuit board

A technology of circuit boards and Teflon, which is applied to printed circuits, removal of conductive materials by chemical/electrolytic methods, and printed circuit manufacturing. It can solve problems such as manual deburring, improve production efficiency, save labor, and avoid damage. Effect

Inactive Publication Date: 2018-12-07
广东冠锋科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for deburring the edge of the high-frequency Teflon circuit board for the problem of manual deburring in the production process of the high-frequency Teflon circuit board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] After the electroplating is completed, the circuit board substrate enters the deburring process, which has the following steps:

[0023] 1) The circuit board substrate is laminated using the method of positive film, and the dry film is pressed onto the circuit board substrate through a film laminating machine, and the line film and the pressed dry film board are aligned and placed on the exposure machine for exposure. Then develop with a developing machine to form a circuit pattern;

[0024] 2) Electroplate a layer of anti-corrosion tin layer on the surface of the circuit board forming the circuit pattern, and the thickness of the anti-corrosion tin layer is 6µm;

[0025] 3) Carry out a cutting edge on the high-density backing plate, take the counterclockwise direction of the knife, but not cut out all the shapes, keep the connection position, the cutting speed of the cutting machine is 50,000 rpm, and the milling speed is 10 m / min;

[0026] 4) Normal stripping and etc...

Embodiment 2

[0030] After the electroplating is completed, the circuit board substrate enters the deburring process, which has the following steps:

[0031] 1) The circuit board substrate is laminated using the method of positive film, and the dry film is pressed onto the circuit board substrate through a film laminating machine, and the line film and the pressed dry film board are aligned and placed on the exposure machine for exposure. Then develop with a developing machine to form a circuit pattern;

[0032] 2) Electroplate a layer of anti-corrosion tin layer on the surface of the circuit board forming the circuit pattern, and the thickness of the anti-corrosion tin layer is 5 μm;

[0033] 3) Carry out a cutting edge on the high-density backing plate, take the counterclockwise direction of the knife, but not cut out all the shapes, keep the connection position, the cutting speed of the cutting machine is 40,000 rpm, and the milling speed is 8 m / min;

[0034] 4) Normal stripping and etc...

Embodiment 3

[0038] After the electroplating is completed, the circuit board substrate enters the deburring process, which has the following steps:

[0039] 1) The circuit board substrate is laminated using the method of positive film, and the dry film is pressed onto the circuit board substrate through a film laminating machine, and the line film and the pressed dry film board are aligned and placed on the exposure machine for exposure. Then develop with a developing machine to form a circuit pattern;

[0040] 2) Electroplate a layer of anti-corrosion tin layer on the surface of the circuit board forming the circuit pattern, and the thickness of the anti-corrosion tin layer is 7µm;

[0041] 3) Carry out a cutting edge on the high-density backing plate, take the counterclockwise direction of the knife, but not cut out all the shapes, keep the connection position, the cutting speed of the cutting machine is 60000 rpm, and the milling speed is 12 m / min;

[0042] 4) Normal stripping and etch...

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PUM

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Abstract

The invention discloses a board edge de-burring method for a high-frequency Teflon circuit board. Compared with the prior art, the method of the invention is characterized in that: a traditional negative film is replaced by a positive film in technique; primary edge milling is carried out before etching, so that burrs formed at a base material originally are transferred to a copper foil required to be etched, so that de-burring in subsequent etching can be facilitated; the problem of burr formation in traditional edge milling of the high-frequency Teflon circuit board can be solved in a copper foil etching process; after the etching is completed, secondary edge milling is adopted to process connection positions, so that the whole board will have no burrs; and in a whole process, the circuit board obtained finally has no burrs through technique change, and damage to the circuit board caused by a manual scraping method can be avoided, and manual work is not required, and therefore, a lot of labors can be saved, and production efficiency can be increased.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for deburring the edge of a high-frequency Teflon circuit board. Background technique [0002] With the popularization of the 4G network era and the upgrading of communication equipment, the application of microwave high-frequency products has come and gone. At present, the materials of traditional circuit boards can no longer meet the requirements of such products for microwave bands and frequencies. The requirements of new special materials The application will replace traditional materials, but in the process of manufacturing and processing new materials in circuit boards, the traditional process cannot meet the characteristics of new materials. [0003] Teflon material has a series of excellent performance and is an ideal C-level insulating material. It is widely used in important departments such as national defense and military industry, atomic energy, pe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0044H05K3/0055H05K3/06H05K2203/0228
Inventor 林能文肖小红杨帆林晓红谢军里黄增江刘淑梅
Owner 广东冠锋科技股份有限公司
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