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Grinding wheel

A grinding and grinding wheel technology, applied in the direction of grinding workpiece supports, grinding/polishing equipment, grinding machines, etc., can solve the problems of resin or metal extension burrs, etc., and achieve the effect of inhibiting extension

Pending Publication Date: 2022-06-21
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, when such a conventional grinding wheel is used to grind a resin packaged substrate on which a semiconductor device chip is packaged, there is also a demand for thinning the wafer level package, and there is a problem that the resin or metal stretches and becomes a burr.

Method used

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Embodiment Construction

[0015] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include contents that can be easily conceived by those skilled in the art and substantially the same contents. In addition, the structures described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the configuration can be made without departing from the gist of the present invention.

[0016] The grinding wheel 1 according to the embodiment of the present invention will be described with reference to the drawings. figure 1 It is a bottom view which shows the structural example of the grinding wheel 1 of embodiment. figure 2 is shown figure 1 Cross-sectional view of the grinding wheel 1. figure 2 Yes figure 1 (II)-(II) sectional view. image 3 is s...

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Abstract

The invention provides a grinding wheel which can inhibit extension and burr formation of a ductile material such as resin or metal compared with the prior art. A grinding wheel for grinding a ductile material includes: an annular grinding wheel base having a fixed end portion fixed to a lower end of a main shaft and a free end portion facing a ground workpiece; and a plurality of rectangular plate-shaped grindstones, wherein the long sides of the plurality of grindstones are arranged at the free end part at specified intervals along the circumferential direction of the grinding wheel base station. The grindstone is a rectangular plate-shaped electroformed grindstone in which abrasive grains are fixed by nickel plating, the grindstone has a thickness of 1 mm or less, and the value represented by the ratio of the height of the grindstone from the free end to the thickness of the grindstone is 5 or more and less than 35.

Description

technical field [0001] The present invention relates to grinding grinding wheels. Background technique [0002] There is known a technique of grinding silicon, gallium arsenide, ceramics, glass substrates, etc. forming semiconductor devices using a grinding wheel in which a plurality of grinding tools are arranged in an annular shape (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent No. 4885376 [0004] In Patent Document 1, the grinding wheel for grinding a grinding wheel is a rectangular plate-shaped segmented grinding wheel in which diamond abrasive grains are fixed with a bonding agent, and is fixed on the lower surface (free end portion) of the grinding wheel, Grinding the workpiece. The binder used in this grinding wheel is selected from resin-based, metal-based, and ceramic-based binders, and the thickness and height (protrusion) of the segment of the grinding wheel are set so as not to be broken during grinding. The thickness i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D7/06B24D7/16B24B7/22B24B41/06
CPCB24D7/06B24D7/16B24B7/228B24B41/068B24D7/10B24B37/26B24D3/06B24D3/28
Inventor 马路良吾
Owner DISCO CORP
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