57results about How to "Reliable integration" patented technology

A processing device in which maintenance can be easily carried out and a burden on a worker can be reduced, and a method of maintaining the device are provided. An upper electrode unit 106 structuring a ceiling portion of a processing chamber 102 of an etching device 100 is structured from a lower assembly 128 at a processing chamber 102 side including an upper electrode 130, and an upper assembly 128 at a power supply side including an electro-body 144. A lock mechanism 156 is released, and after the upper assembly 126 is independently raised and removed by a lift mechanism 164, maintenance of the upper assembly 126 and/or the lower assembly 128 is carried out. The lock mechanism 156 is locked, and after the upper and lower assemblies 126, 128 are integrally raised and removed by the lift mechanism 164, maintenance of an interior of the processing chamber 102 is carried out.

The detection circuit comprises a photodiode connected to an input of a capacitive transimpedance amplifier. The circuit comprises an anti-blooming circuit connected between the input and an output of the capacitive trans-impedance amplifier. The anti-blooming circuit comprises a field effect transistor connected between the input and output of the capacitive trans-impedance amplifier. The transistor is of pMOS type when the input of the capacitive transimpedance amplifier is connected to a cathode of the photodiode. The transistor is of nMOS type when the input of the capacitive transimpedance amplifier is connected to an anode of the photodiode.

A method and system are provided by the present invention for developing functional software element that operates in an environment comprising a plurality of computer programs that are being simultaneously developed. A test facilitating computer program product is utilized to simulate the plurality of computer programs as seen by the functional software element. The functional software element has one or more internal software interfaces that interact with one or more simulated external software interfaces to provide an environment in which the operation of the functional element and the internal software interfaces thereof can be monitored. The test facilitating tool permits creation of files that may be utilized to create an operational scenario during which messages that are received by and sent from said functional software element can be monitored.

The invention discloses a folding cell-built-in flexible solar cell array. The folding cell-built-in flexible solar cell array is different from a traditional rigid solar cell array and a traditional flexible solar cell array. A substrate of the solar cell array is a flexible substrate, solar cell circuits are highly integrated, the circuits of the whole solar cell array are arranged inside the flexible substrate, and the solar cell carry in the type can achieve folding-unfolding motions and can be widely applied to a power subsystem of an air vehicle such as a space satellite. The folding cell-built-in flexible solar cell array mainly comprises a solar cell, the flexible substrate, a rigid substrate, the integrated circuits and the like. Compared with the solar cell array in the traditional modes, the folding cell-built-in flexible solar cell array has the advantages of being large in gravimetric specific power, small in folded size, high in reliability and the like, and is of great significance in the future development and the future application of the space solar cell array technology.

An optoelectronic device including a first electrode arranged on a substrate, a second electrode that includes a first surface facing the first electrode, and a semiconductor material layer that is in electric contact with the first and second electrodes. The second electrode includes a side wall that is adjacent to the first surface and is covered with the semiconductor material layer by the insertion of a self-assembled monolayer.

The invention provides a portable electronic device which can make heat generated by the internal electronic components diffused from the outer surface of the housing in an efficient way. The portable electronic device comprises a housing component (1). The housing component (1) comprises a thin-wall outer wall part (2) formed on the outer surface (10) of the housing; a heat conduction sheet body (3) laminated on a part of the thin-wall outer wall part (2) back and applied for transmitting heat from the heating part (6) of the internal electronic component (5) and performing heat radiation on the outer surface (10) of the housing; and an inner wall part (4) integrally laminated on the back faces of the heat conduction sheet body (3) and the thin-wall outer wall part (2) through the curing of fusing resins.

The invention relates to a forest measurement method and particularly relates to a forest measurement method based on an electronic tree measurement gun. An inclination sensor angle measurement, a laser distance measurement, an electronic compass, a central control unit, a flash memory, a liquid crystal display, a micro-button, a universal serial bus (USB) data communication interface and the like are performed high-density high-reliability integration, and a physical casing is designed in accordance with ergonomics. Functions such as measurement of coordinates, measurement of tree heights, measurement of angle gauges and measurement of forest mean height are achieved. In the measurement process, measurement data are digitally displayed and stored automatically. Problems that the period of data acquirement is long, the efficiency is low and the precision is poor in traditional forest measurement methods are solved. The efficiency and the precision are improved, the period is shortened, and the accurate measurement of forest stand is achieved.

A carbon dioxide gas or a nitrogen gas is dissolved in a polyurethane raw material. By injecting the polyurethane raw material into the cavity of a mold formed in the periphery of a glass panel (2), a resin molded member (3) composed of a polyurethane foam is formed integrally with the glass panel (2). The specific gravity of the resin molded member (3) is set at not less than 0.60 but not more than 0.90 by changing the amount of the carbon dioxide gas or the nitrogen gas dissolved in the polyurethane raw material.

A cover has a breathable first portion arranged on a seating side of a seat structure member, a second portion that is laminated to the first portion and inhibits penetration of resin foam material, and a passage portion through which air passes that is provided on the second portion. A protruding portion is arranged face-to-face with the passage portion while the cover is arranged in a cavity, and the cushion is formed with an interposed member that is less rigid than the cover being interposed between the passage portion and the protruding portion.

The invention relates to a method for producing a plastic housing, where at least one first plastic housing part with at least one guide or bearing for at least one mechanically movable component, in particular a sensor, is produced in a first molding step, the at least one first plastic housing part is overmolded in a second molding step while a second plastic housing part is being formed, in order to form an integral plastic housing. Moreover, the invention relates to a plastic housing with at least one first plastic housing part including at least one guide or bearing for at least one mechanically movable component, where the at least one plastic housing part is entirely or partially overmolded by a second plastic housing part so that the integral plastic housing is formed.

The invention discloses special-shaped pipe fitting welding equipment. The special-shaped pipe fitting welding equipment comprises a workbench, a high-frequency sensing heating unit, an image measurement unit, a mechanical positioning and clamping unit, an exhaust fan and a control cabinet, wherein the exhaust fan is installed behind the mechanical positioning and clamping unit, the mechanical positioning and clamping unit is arranged in the middle of the tabletop of the workbench, and a PLC is installed in the control cabinet. The special-shaped pipe fitting welding equipment is applicable to assembling small-size special-shaped pipe fittings according to a soldering method, and the problem that high assembly accuracy can not be achieved when the positioning standard is not ideal is solved by the adoption of image measurement and positioning; meanwhile, errors caused by clamping force in the welding and heating process are compensated for conveniently and rapidly, welding accuracy is improved, and thin-wall positions of a part can be effectively prevented from collision deformation in the assembly or disassembly process.

A method of manufacturing a unit fuel cell includes a step of forming an adhesive layer having ultraviolet curability and heat curability on an outer peripheral edge portion of a side surface of a membrane electrode assembly, a step of disposing a support frame so that an inner peripheral edge portion of the support frame which supports the membrane electrode assembly at an outer periphery of the membrane electrode assembly is disposed on an outer portion of the adhesive layer, and a step of disposing a second gas diffusion layer on the side surface of the membrane electrode assembly so that an outer peripheral edge portion of the second gas diffusion layer is disposed on an inner portion of the adhesive layer, and a step of integrating the membrane electrode assembly, the second gas diffusion layer and the support frame by curing the adhesive layer.

To provide a chain guide mechanism that enables a plurality of chain guides, a chain, and a sprocket to be held together with a simple structure, such that work efficiency during assembly and maintenance is improved. The chain guide mechanism joins a plurality of chain guides that slidably guide a chain; and a connection unit is made up of arm members that extend from both sides of the chain on a chain running surface of a fixed chain guide toward a pivoting chain guide, and a coupling member including a fitting hole for a mounting boss of the pivoting chain guide to fit in.

The invention relates to an electronic equipment casing structure with double casings. The structure comprises an outer casing and an inner casing, wherein a main machine electronic part is arranged in the outer casing, the inner casing is provided with a side opening, an embedding type function module is inserted into the side opening, and at least one part of the inner casing is arranged in a cavity of the outer casing. When the whole inner casing is arranged in the cavity of the outer casing, the opening side of the inner casing and a side plate of the outer casing are positioned on one plane, and the opening is directly formed on the side plate of the outer casing. When one part of the inner casing is exposed on the exterior of the outer casing, the opening side of the inner casing is directly exposed on the exterior of the outer casing. Compared with the prior art, the electronic parts in the outer casing and the inner casing cannot generate electromagnetic interference on each other through the self-shielding performance of each casing; when the embedding type function module is inserted or detached, the embedding type function module is only inserted into or plugged out of the opening at one side of the inner casing, so the main machine electronic part in the cavity of the outer casing cannot be exposed to the outside environment due to the installation or detachment of the embedding type function module, and the pollution by the outside environment is avoided.

The invention relates to the technical field of microelectronic packaging, and discloses a high-reliability packaging structure for a microwave piece cover plate, which comprises a cover plate and a box body, the cover plate comprises an external output interface, the middle part of the cover plate comprises a chip and a ceramic circuit substrate assembly area, and the high-reliability packaging structure also comprises an organic circuit substrate assembly area, and the edge of the cover plate is provided with a sealing connection part; and the sealing connection part extends along the edge of the cover plate and forms a closed ring. The gradient materials with different thermal expansion coefficients are integrally formed in a powder metallurgy mode, the thermal expansion coefficients, the shapes, the sizes and the positions of all the areas can be flexibly adjusted, and circuit substrates, chips and packaging components with different physical properties can be integrated on the same cover plate; and meanwhile, airtight welding with the box body can be realized, so that a high-density and high-reliability integrated packaging cover plate is formed. According to the invention, the integration density of the microwave assembly can be improved, and the improvement of the reliability of the cover plate and the realization of micro-assembly are greatly promoted.

The invention relates to a temperature, pressure and acoustics integrated MEMS underwater sensor and system. The sensor comprises an acoustic vector sensitive unit, an acoustic pressure sensitive unit, a pressure sensitive unit, and a temperature sensitive unit, wherein the acoustic vector sensitive unit and the acoustic pressure sensitive unit are disposed on the top surface of a first carrier plate, the pressure sensitive unit and the temperature sensitive unit are disposed on the bottom surface of the first carrier plate, the acoustic vector sensing unit and the acoustic pressure sensing unit which are located on the top surface of the first carrier plate are packaged through an acoustic transmission cap, and the pressure sensing unit and the temperature sensing unit which are located on the bottom surface of the first carrier plate are packaged through a metal shell. According to the sensor, integration of temperature, pressure and acoustic sensitive units can be realized, and underwater temperature, pressure and acoustic detection is realized.

The invention relates to the field of microelectronic packaging, and discloses a method for selectively pressing an alloy soldering lug on a substrate, which comprises the following steps of: cleaningand plating the surface of the substrate; performing laser material reduction on the surface of the template to transfer the specified pattern to the template; laminating and pre-fixing the substrate, the soldering lug, the template and the laminating die according to a specified sequence; sending the laminated structure into a laminating machine, and heating and pressurizing in a vacuum environment, so that the soldering lug is attached to the substrate; and the soldering lugs on the substrate are cut through laser, and the soldering lugs corresponding to the specified patterns on the surface of the substrate are selectively reserved. According to the method, the alloy soldering lugs are selectively pressed on the surface of the substrate, high-quality and high-reliability integration and packaging between the chip, the module, the surrounding frame and the like and the substrate can be achieved, and the method has the advantages that the soldering lug size adjusting range is large,the line precision is high, alignment between the soldering lugs and the substrate is not needed, and disturbance displacement between the soldering lugs and the substrate is avoided.

The invention relates to the field of genetic engineering and particularly discloses a pig specific friendly site Pifs501. The position of the friendly site Pifs 501 in a genome is 44288819bp on the chromosome 16 (NC_010458.3, based on the pig genome sequence information version number Sscrofa10.2, September, 2011). The pig specific friendly site Pifs501 can be used for stable expression of exogenous genes, and the problems of instable expression of the exogenous genes and unpredictability of the position effect during transgenosis are solved. By means of the pig specific friendly site Pifs501, fixed-site exogenous gene integration to livestock becomes reliable, and the foundation for fixed-site integration of the livestock is laid. A targeting vector provided on account of the pig specific friendly site Pifs501 can achieve targeting efficiently and specifically.

The invention relates to the technical field of microorganisms, in particular to a blue light regulation promoter, a fusion gene of the blue light regulation promoter, a blue light-mediated regulation plasmid and a construction method and application of the blue light-mediated regulation plasmid. The invention provides a blue light regulation promoter PC120-CYC. The feasibility of a blue light-induced regulation mode in the gene expression and regulation process of the yarrowia lipolytica is verified by utilizing a fusion gene synthesized based on the blue light-induced regulation mode and a blue light-mediated regulation plasmid. The blue light-mediated regulation plasmid provided by the invention is very simple and compact, and can be induced by blue light on the single cell level of yarrowia lipolytica. In the application of the blue light-mediated regulation plasmid, the blue light-mediated regulation plasmid is non-toxic and harmless, quick in response, simple and convenient to operate and good in reversibility, and can effectively promote the wide application of the yarrowia lipolytica in the fields of food, medicine, agricultural product processing and the like.