The invention relates to the field of microelectronic packaging, and discloses a method for selectively pressing an
alloy soldering lug on a substrate, which comprises the following steps of: cleaningand plating the surface of the substrate; performing
laser material reduction on the surface of the template to transfer the specified pattern to the template; laminating and pre-fixing the substrate, the
soldering lug, the template and the laminating die according to a specified sequence; sending the laminated structure into a laminating
machine, and heating and pressurizing in a vacuum environment, so that the
soldering lug is attached to the substrate; and the soldering lugs on the substrate are
cut through
laser, and the soldering lugs corresponding to the specified patterns on the surface of the substrate are selectively reserved. According to the method, the
alloy soldering lugs are selectively pressed on the surface of the substrate, high-quality and high-reliability integration and packaging between the
chip, the module, the surrounding frame and the like and the substrate can be achieved, and the method has the advantages that the soldering lug size adjusting range is large,the line precision is high, alignment between the soldering lugs and the substrate is not needed, and disturbance displacement between the soldering lugs and the substrate is avoided.