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High-reliability packaging structure and packaging method for microwave piece cover plate

A technology of packaging structure and packaging method, which is applied in the directions of electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of high-reliability packaging structure and method of unseen microwave components, unseen encapsulation cover plate structure and packaging method, etc. The realization of micro-assembly promotes, enhances the integration density, and achieves the effect of highly reliable integration

Inactive Publication Date: 2021-08-24
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the packaging reliability and integration density of microwave components are improved by improving the preparation method of composite materials and optimizing the box structure of microwave components to solve the problems of thermal expansion coefficient matching, heat dissipation, and welding airtightness in microwave component packaging. The structure and packaging method of the packaging cover plate, especially the high-reliability packaging structure and method for microwave components

Method used

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  • High-reliability packaging structure and packaging method for microwave piece cover plate
  • High-reliability packaging structure and packaging method for microwave piece cover plate

Examples

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Embodiment 1

[0035] This embodiment discloses a highly reliable packaging structure for a cover plate 1 of microwave components, including a cover plate 1 and a box body 5. The cover plate 1 includes an external output interface 6, and the middle part of the cover plate 1 includes chips and ceramics. The circuit substrate assembly area 7 also includes an organic circuit substrate assembly area 8, and a sealing connection portion 9 is arranged at the edge of the cover plate 1, and the sealing connection portion 9 extends along the edge of the cover plate 1 and forms a closed ring; the entire cover plate in this example It is prepared by integrated powder metallurgy of gradient silicon-aluminum materials. The chip and ceramic circuit substrate assembly area 7 adopts AlSi50 with a thermal expansion coefficient of 11ppm (Al accounts for 50%, and Si accounts for 50%). The thermal expansion coefficient of the organic circuit substrate assembly area 8 AlSi35 (Al accounts for 65%, Si accounts for 3...

Embodiment 2

[0049] The content of the above-mentioned embodiment 1 discloses the encapsulation structure, and this embodiment discloses the corresponding encapsulation method for realizing the encapsulation structure, which is now specifically explained:

[0050] A highly reliable packaging method for a cover plate of a microwave component, used to realize the packaging of the above packaging structure, comprising:

[0051] S01: According to the different requirements for the thermal expansion coefficient of the chip and ceramic circuit substrate assembly area, the organic circuit substrate assembly area, and the sealing connection area, prepare a variety of gradient materials with thermal expansion coefficients, and prepare the integral cover by integral molding in the form of powder metallurgy plate;

[0052] S02: Connect and fix the chip and the ceramic circuit substrate in the corresponding assembly area, and connect and fix the organic circuit substrate in the corresponding assembly ...

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Abstract

The invention relates to the technical field of microelectronic packaging, and discloses a high-reliability packaging structure for a microwave piece cover plate, which comprises a cover plate and a box body, the cover plate comprises an external output interface, the middle part of the cover plate comprises a chip and a ceramic circuit substrate assembly area, and the high-reliability packaging structure also comprises an organic circuit substrate assembly area, and the edge of the cover plate is provided with a sealing connection part; and the sealing connection part extends along the edge of the cover plate and forms a closed ring. The gradient materials with different thermal expansion coefficients are integrally formed in a powder metallurgy mode, the thermal expansion coefficients, the shapes, the sizes and the positions of all the areas can be flexibly adjusted, and circuit substrates, chips and packaging components with different physical properties can be integrated on the same cover plate; and meanwhile, airtight welding with the box body can be realized, so that a high-density and high-reliability integrated packaging cover plate is formed. According to the invention, the integration density of the microwave assembly can be improved, and the improvement of the reliability of the cover plate and the realization of micro-assembly are greatly promoted.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to a highly reliable packaging structure and packaging method for a cover plate of a microwave component. Background technique [0002] Electronic equipment and products continue to develop towards thinner, lighter and smaller, and the integration density continues to increase. Microwave components are gradually developing from traditional two-dimensional plane integration to three-dimensional integration. No components are integrated on the cover plate of microwave components based on two-dimensional plane integration technology. It is only used for airtight isolation from the circuit substrate, and a relatively simple cover plate structure can realize airtight packaging with the microwave component box. [0003] In addition to airtight isolation, the cover plate for three-dimensional integration technology also needs to be used as a mechanical support for compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/06H01L23/10H01L23/04H01L21/48H01L21/50
CPCH01L23/06H01L23/10H01L23/04H01L21/4817H01L21/50
Inventor 方杰崔西会邢大伟刘川张旻吴婷伍泽亮廖伟何东陈涛
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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