Portable electronic device and method for manufacturing housing of the electronic device

Abstract

The invention provides a portable electronic device which can make heat generated by the internal electronic components diffused from the outer surface of the housing in an efficient way. The portable electronic device comprises a housing component (1). The housing component (1) comprises a thin-wall outer wall part (2) formed on the outer surface (10) of the housing; a heat conduction sheet body (3) laminated on a part of the thin-wall outer wall part (2) back and applied for transmitting heat from the heating part (6) of the internal electronic component (5) and performing heat radiation on the outer surface (10) of the housing; and an inner wall part (4) integrally laminated on the back faces of the heat conduction sheet body (3) and the thin-wall outer wall part (2) through the curing of fusing resins.

Description

technical field [0001] The invention relates to a method for making portable electronic equipment and its casing. Background technique [0002] Portable electronic devices such as mobile phones, smart phones, tablet communication terminals, and notebook computers have electronic components inside their casings. Among the electronic components, components such as CCD camera modules and IC chips generate heat due to power consumption, so a thermal diffusion sheet (such as , refer to Patent Document 1). [0003] [Patent Document 1]: Japanese Unexamined Patent Publication No. 2009-117594. [0004] However, in conventional portable electronic devices, the thermal diffusion sheet described in Patent Document 1 is adhered to the rear surface of the case by a double-sided adhesive tape and attached thereafter. Therefore, when a flange or a stud is formed on the back surface of the case, the sticking position is limited, and cannot correspond to the heat generating part, and effec...

AI Technical Summary

Problems solved by technology

Therefore, in the case where a flange or a stud is formed on the back surface of the case, the sticking position is limited and cannot correspond to the heat generating part, and effective sticking cannot be performed.

In addition, since the thermal diffusion sheet is exposed on the back of the case, there is a risk that the thermal diffusion sheet will be damaged or peeled off when the electronic components are housed inside and assembled.

[0005] In addition, the thermal diffusion sheet is bonded to the back surface separated from the outer surface of the case (by an amount corresponding to the wall thickness of the case), so the heat from the heat generating part is difficult to escape to the outside of the case, and there is a disadvantage that the heat dissipation characteristics deteriorate.

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