The invention discloses a ferroelectric
field effect transistor FeFET with optimized double interface
layers and a preparation method of the ferroelectric
field effect transistor FeFET, and belongs to the technical field of micro-nano
electronics. The FeFET structure comprises a
silicon substrate, a source, drain
and gate laminated structure and a gate
metal electrode, the gate laminated structure comprises an optimized double-
interface layer and a
hafnium zirconium oxide ferroelectric layer, the double-
interface layer comprises a lower
silicon oxide interface layer and an upper aluminum
oxide interface layer, the
hafnium zirconium oxide ferroelectric layer is arranged on the double-interface layer, and the gate
metal electrode is arranged on the
hafnium zirconium oxide ferroelectric layer. An optimized double-interface layer structure is introduced, the charge
trapping effect in the writing and circulating process of the FeFET is restrained, the storage window and durability of the FeFET are optimized, meanwhile, the storage density and reliability of the FeFET are optimized, and the restriction of tradeoff between the FeFET and the storage window is broken through. According to the method, the size of the prepared FeFET is reduced by adopting the
electron beam
lithography technology, and the integration density of the FeFET is improved; and the preparation process is completely compatible with an advanced node
CMOS (Complementary
Metal-
Oxide-
Semiconductor Transistor) process, and is expected to be applied to large-scale
integrated circuit manufacturing.