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1413results about How to "Low conductivity" patented technology

Method and structure for providing improved thermal conduction for silicon semiconductor devices

Thermal cooling structures of diamond or diamond-like materials are provided for conducting heat away from semiconductor devices. A first silicon-on-insulator embodiment comprises a plurality of thermal paths, formed after shallow trench and device fabrication steps are completed, which extend through the buried oxide and provide heat dissipation through to the underlying bulk silicon substrate. The thermal conduction path material is preferably diamond which has high thermal conductivity with low electrical conductivity. A second diamond trench cooling structure, formed after device fabrication has been completed, comprises diamond shallow trenches disposed between the devices and extending through the buried oxide layer. An alternative diamond thermal cooling structure includes a diamond insulation layer deposited over the semiconductor devices in either an SOI or bulk silicon structure. Yet another embodiment comprises diamond sidewalls formed along the device walls in thermal contact with the device junctions to provide heat dissipation through the device junctions to underlying cooling structures. It is also proposed that the foregoing structures, and combinations of the foregoing structures, could be used in conjunction with other known cooling schemes.
Owner:IBM CORP

PTC graphene heating printing ink, preparation method thereof and heating film prepared from PTC graphene heating printing ink

InactiveCN107446408AImprove securityAchieving self-limiting temperature characteristicsInksHeating element materialsSilver pasteAdhesive
The invention discloses PTC graphene heating printing ink and a preparation method thereof. The PTC graphene heating printing ink is prepared from the following components in percentages by mass: 50% to 70% of a binder, 9% to 21% of a solvent, 1% to 3% of an additive, 10% to 20% of a conductive filler and 5% to 20% of a PTC functional material. The preparation method comprises the following steps: (1) firstly stirring and dispersing the binder, the solvent and the additive for 20 to 30 min, then adding the PTC functional material into stirring equipment for stirring for 8 to 12 min, and finally adding the conductive filler for uniform stirring to obtain a coarse paste; and (2) carrying out four to six times of three-roller grinding on the coarse paste so as to obtain the PTC graphene heating printing ink. The invention also discloses a heating film. The heating film comprises an organic polymer base material film, the PTC graphene heating printing ink, a conductive silver paste, conductive copper foil and an organic polymer adhesive film. The PTC function of the graphene heating film is increased, the potential safety hazard problem of an existing graphene heating film is eliminated, and the practicability is improved.
Owner:DEYANG CARBONENE TECH

Non-transparent quartz crucible for polysilicon crystallization and manufacturing method thereof

The invention provides an opaque quartz crucible used in multicrystal silicon crystallization and a method for manufacturing the same. The crucible is of a regular square structure, and the compositions in mass ratio of the crucible are more than 99.7 Wt percent of silicon dioxide, less than 600ppm of aluminum oxide and less than 30ppm of ferric oxide. The method comprises the following steps: firstly, a raw material, i.e. high purity quartz is put into granulation equipment for wet method granulation, the grain size is controlled between 70 and 100mu m; then, slurry is fully stirred and then is fed into a gypsum mould under a pressure of between 2 and 3bar after being deposited for 24 to 48 hours; moreover, early grouting is assisted by slight vibration; the slurry is further settled for 5 to 8 hours, and is demoulded after fully dewatered; the slurry is dried inside a drier; and finally, a blank is put in a kiln for sintering so as to obtain the opaque quartz crucible. The proposal adopts grouting forming by a high-purity quartz material, and the sintered crucible has uniform inner structure; moreover, the crucible has excellent thermal shock stability and cracking resistance, and can meet the technological requirements for manufacturing multicrystal silicon cast ingots.
Owner:常熟华融太阳能新型材料有限公司

Material characterization with model based sensors

InactiveUS20070069720A1Improve crack detection reliabilityImprove reliabilityMaterial magnetic variablesSensor arrayElectric field sensor
Nondestructive material condition monitoring and assessment is accomplished by placing, mounting, or scanning magnetic and electric field sensors and sensor arrays over material surfaces. The material condition can be inferred directly from material property estimates, such as the magnetic permeability, dielectric permittivity, electrical property, or thickness, or from a correlation with these properties. Hidden cracks in multiple layer structures in the presence of fasteners are detected by combining multiple frequency magnetic field measurements and comparing the result to characteristic signature responses. The threshold value for indicating a crack is adjusted based on a high frequency measurement that accounts for fastener type. The condition of engine disk slot is determined without removal of the disk from the engine by placing near the disk a fixture that contains a sensor for scanning through the slot and means for recording position within the slot. Inflatable support structures can be placed behind the sensor to improve and a guide can be used to align sensor with the slot and for rotating the disk. The condition of an interface between a conducting substrate and a coating is assessed by placing a magnetic field sensor on the opposite side of the substrate from the coating and monitoring at least one model parameter for the material system, with the model parameter correlated to the interfacial condition. The model parameter is typically a magnetic permeability that reflects the residual stress at the interface. Sensors embedded between material layers are protected from damage by placing shims on the faying surface. After determining the areas to be monitored and the areas likely to cause sensor damage, a shim thickness is determined and is then placed in at least one area not being monitored by a sensor. The condition of a test fluid is assessed through a dielectric sensor containing a contaminant-sensitive material layer. The properties of the layer are monitored with the dielectric sensor and correlated to contaminant level.
Owner:JENTEK SENSORS

Lithium iron phosphate composite material, production method and use thereof

Provided are a lithium iron phosphate composite material, the production method thereof and the use thereof The lithium iron phosphate composite material has a micro-size particle structure, which contains nano-size grains of lithium iron phosphate and graphene inside, and bears nano-carbon particulates outside. The lithium iron phosphate composite material has the properties of high conductivity, high-rate charge/discharge performance and high tap density. The production method comprises: preparing an iron salt mixed solution according to the mole ratio of P:Fe=1:1; adding the above solution into an organic carbon source aqueous solution, followed by mixing and reacting, so as to obtain nano-iron phosphate covered with organic carbon source; adding the above nano-iron phosphate covered with organic carbon source and a lithium source compound into an aqueous solution of graphene oxide, agitating, mixing, and then spray drying, so as to obtain a precursor of lithium iron phosphate composite material; calcinating said precursor in a reduction atmosphere and cooling naturally, so as to obtain said lithium iron phosphate composite material. The material is used for lithium ion battery or positive electrode material.
Owner:OCEANS KING LIGHTING SCI&TECH CO LTD
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