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94 results about "Electron scattering" patented technology

Electron scattering occurs when electrons are deviated from their original trajectory. This is due to the electrostatic forces within matter interaction or, if an external magnetic field is present, the electron may be deflected by the Lorentz force. This scattering typically happens with solids such as metals, semiconductors and insulators; and is a limiting factor in integrated circuits and transistors.

Radiation correction method for electron beam lithography

InactiveUS6872507B2Readily commercially implementedOptimal correction for proximity effectsElectric discharge tubesRadiation applicationsResistLight beam
A method for forming a patterned microelectronics layer employing electron beam lithography in a sensitive material upon a substrate with optimal correction for proximity effects resulting from electron back scattering into the resist material. There is provided a substrate having formed thereon a layer of resist material sensitive to electron beam exposure. There is then exposed the sensitive layer to a vector scan shaped electron beam to write a primary pattern with dose correction of the beam dose for proximity effects due to electron scattering at each point in the primary pattern. There is then written a secondary pattern which is a negative reversed image of the primary pattern in a secondary exposure employing a vector scan shaped focused electron beam at an exposure dose substantially below the primary beam dose, there being provided a gap between the primary pattern and the secondary pattern. There is then developed the primary pattern in the sensitive resist layer to form the final corrected pattern on the substrate. The patterned layer of resist material may be employed directly on the substrate on which it is formed, or alternatively the patterned resist layer may be employed formed over an opaque layer upon the transparent substrate and subsequently the pattern etched into the opaque layer to form a photomask.
Owner:TAIWAN SEMICON MFG CO LTD

Cu-Ni-Nb ternary alloy film with low resistivity and high chemical inertia and preparation process thereof

The invention provides a Cu-Ni-Nb ternary alloy film with low resistivity and high chemical inertia and a preparation process thereof, and belongs to the field of materials. Under the guidance of a cluster model of a stable solid solution, the selection and the addition quantity of alloying elements in the Cu film are determined, and factors such as the enthalpy of mixing, a cluster structure and atomic radius dimension are comprehensively considered, so that the solid solution alloy film with relatively high thermal stability and relatively low chemical reaction activity is formed. By adopting a solid solution structure, resistivity rising caused by mass precipitation of solute elements is avoided; due to the introduction of an element Nb with a large atomic radius, interdiffusion between Cu and surrounding media can be effectively blocked; and due to the proportional addition of the second group of elements Ni, the addition quantity of Nb can be greatly reduced, thereby reducing an electron scattering effect caused by large atom selves to a large extent, facilitating the stabilization of the Cu film and guaranteeing that the resistivity of the Cu film is minimally influenced. The Cu-Ni-Nb ternary alloy film can be expected to simultaneously have a diffusion blocking effect as well as high temperature stability.
Owner:DALIAN UNIV OF TECH

Conductive Mg-P co-doped Cu2V2O7-graphene negative thermal expansion material and preparation method thereof

The invention relates to the technical field of negative thermal expansion materials, and discloses a conductive Mg-P co-doped Cu2V2O7-graphene negative thermal expansion material and a preparation method thereof. The conductive Mg-P co-doped Cu2V2O7-graphene negative thermal expansion material comprises the following formula raw materials: graphene oxide, CuO, MgO, V2O5 and NH4H2PO4. According tothe conductive Mg-P co-doped Cu2V2O7-graphene negative thermal expansion material and the preparation method thereof, Cu2V2O7 has a stable linear negative thermal expansion coefficient, a centrosymmetric monoclinic phase structure is formed by doping Cu2V2O7 with Mg, under temperature variation, the Mg-O bond generates a vibration effect, the internal coupling effect of the Cu2V2O7 crystal is improved, a linear chain-shaped monoclinic phase in the crystal is destroyed, oxygen atoms form a new arrangement in the crystal lattice, local collapse occurs, the Cu2V2O7 is enabled to show a negativethermal expansion phenomenon, P atoms replace part of V atoms, the grain size of Cu2V2O7 is reduced, the bond energy of P-O bonds is larger than that of V-O bonds, stress in Cu2V2O7 lattices is reduced, lattice distortion is reduced, the electron scattering probability and the high-frequency dielectric constant are reduced, and therefore the conductivity of Cu2V2O7 is enhanced.
Owner:管玲飞

Topological insulator/graphene compound flexible transparent conductive thin film and preparation method and application thereof

The invention discloses a topological insulator / graphene compound flexible transparent conductive thin film and a preparation method and application thereof. The topological insulator / graphene compound flexible transparent conductive thin film is combined by a nanosheet formed by a topological insulator and a graphene thin film by virtue of Van der Waals' force. The preparation method comprises the step: by taking inertial gas as carrier gas, putting the topological insulator in the upstream of a gas flow direction and putting the graphene thin film in the downstream of the gas flow direction for chemical vapor deposition to obtain the topological insulator / graphene compound flexible transparent conductive thin film. According to the topological insulator / graphene compound flexible transparent conductive thin film disclosed by the invention, a stable conductive channel can be provided by virtue of a special metal surface state of the topological insulator, the crystal boundary of the domain is sewed, and reduction of conductivity caused by electron scattering at the crystal boundary is improved, so that the topological insulator / graphene compound flexible transparent conductive thin film is obtained. The thin film has high transmission of light in a wide wavelength coverage, high conductivity, outstanding chemical stability and mechanical property, and can be used for the field of photoelectrons, nano-electrons and the like.
Owner:PEKING UNIV

Thermal electronic surface emitting source for vacuum system

The invention discloses a thermal electronic surface emitting source for a vacuum system. In the invention, a first anode comprises a lamp holder, a lamp filament, a lamp filament wiring column, an electronic scattering mesh, a wiring column frequency shielding disk and a base frequency shielding disk, and a second anode is formed in such a way that a sleeve is added in a shell of the thermal electronic surface emitting source in a mutually insulating way; by the invention, an electronic track is effectively changed; after emitted electrons are accelerated by an electric field, the distribution of formed high-energy electronic beams can be controlled by changing the potential condition; the lamp filament is wound into a pane spiral shape by a tantalum wire; the lamp filament in the shape can generate the uniform high-energy electronic beams, finish the uniformization, gathering and submerging of the high-energy electronic beams and realize the detection of parameters of a fluorescent screen, such as uniformity, light emitting efficiency, afterglow, and the like; particularly, the detection error of the uniformity is smaller than +/-0.05; and the invention has multiple functions, simple structure and easy processing, can completely meet the test of all the parameters of the fluorescent screen and can be widely used for the quality detection of the fluorescent screens on variousimage intensifiers.
Owner:南京理工大学张家港工程院有限公司
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