7 results about "Electron scattering" patented technology

This invention relates to the field of copper alloy materials technology, and more particularly to a Cu-Fe-Re alloy based on controlled deformation and its preparation method. The alloy composition, by weight percentage, includes: 10%~20% iron, 0.2%~1.0% rare earth elements, and the balance being copper and unavoidable impurities; the rare earth elements are selected from one or more of cerium, lanthanum, and yttrium. Based on rare earth refinement, this invention, through precise control of the deformation amount, transforms the precipitated iron phase from coarse dendrites to dispersed droplets, which, after further deformation, evolve into a fibrous structure. The gaps between iron phases are significantly reduced, and the distribution becomes more compact. The optimized selection of the deformation amount achieves the best match between dislocation strengthening and second-phase strengthening. Simultaneously, in terms of electrical conductivity, by controlling the dislocation density and second-phase morphology, the electron scattering effect is minimized, achieving a synergistic improvement in strength and conductivity. The introduction of rare earth elements can purify grain boundaries, refine the as-cast structure, and improve the distribution of the second phase.

This invention relates to the field of copper alloy materials technology, specifically to a high-performance copper alloy wire and its preparation process. A high-performance copper alloy wire includes a base copper alloy wire and a corrosion-resistant protective layer. The base copper alloy wire, by mass percentage, comprises: 0.4-0.6% Cr, 0.05-0.2% Zr, 0.05-0.06% Hf, 0.01-0.03% Ce, 0.4-0.5% rare earth modified carbon nanotubes, with the balance being Cu. This invention improves the dispersibility of carbon nanotubes by first activating them with carboxylation and then modifying them with rare earth citric acid coupling agents. The uniformly dispersed carbon nanotubes can form a continuous conductive network in the copper matrix. At the same time, the lanthanum and cerium introduced during modification can purify the grain boundaries and reduce electron scattering at the grain boundaries, thereby effectively improving the conductivity of the copper alloy wire. In addition, the uniformly dispersed rare earth modified carbon nanotubes can effectively hinder dislocation movement and refine the matrix grains, thereby effectively improving the tensile strength of the copper alloy wire.

The application relates to the field of metal matrix composites and wire and cable manufacturing, in particular to a high-strength and high-conductivity copper alloy energy storage cable and a preparation method; the cable comprises, from inside to outside, a conductor core, an insulation layer, a flame-retardant armored layer and a weather-resistant sheath layer; the conductor core is uniformly dispersed with a multifunctional composite modifier in a copper matrix, the modifier has a core-shell structure and is composed of a multi-walled carbon nanotube center core, a 5-15nm silver conductive transition shell layer and a rare earth anchoring phase; the core is to construct a high-strength skeleton by using the carbon nanotube to provide physical strengthening support, and the silver transition shell layer is used to tightly fuse with the copper matrix in a microstate, so that micro-pores are eliminated to realize dense metallurgical coherent bonding; the alloy single wire is prepared by feeding the intermediate into the copper melt and assisting with ladder aging treatment, the electronic transmission channel is effectively bridged, the interface electron scattering is greatly reduced, and the technical bottleneck of the traditional metal material strong-conductivity mutual repulsion is successfully broken.

This invention relates to the field of VR technology, specifically to a VR-based electron beam generation method, device, and medium. The method includes: generating a corresponding original electron beam 3D model in a VR environment based on electron beam parameters; determining the positional mapping relationship between the predefined VR environment and the original 2D image data; performing image blurring and brightness processing according to the electron beam parameters to obtain updated 2D image data; and mapping the updated 2D image data as a texture onto the surface of the original electron beam 3D model to generate a standard electron beam 3D model in the VR environment. By simulating electron scattering effects through image blurring, an edge blurring effect conforming to physical laws is generated. Furthermore, by mapping the intensity distribution through image brightness processing, the electron beam in the VR environment exhibits realistic optical characteristics of a bright center and gradually weakening edges, thereby achieving faithful visualization of the physical properties of the electron beam.

The application discloses a kind of high-conductivity aluminum alloy wire and preparation method thereof, including following weight percentage of element: B is 0.01-0.05%, Si is 0.1-0.3%, Fe is 0.1-0.25%, Zn is 0.01-0.05%, Tb is 0.001-0.005%, Ce is 0.005-0.02%, V is 0.001-0.005%, Ti is 0.001-0.005%, Zr is 0.01-0.05%, Er is 0.001-0.005%, the rest is Al;The beneficial effect of the application is: B and the compound formed by Si are dispersed in aluminum alloy matrix, effectively refine grain, reduce the influence of electron scattering on grain boundary, so as to significantly improve the conductivity of aluminum alloy wire, can effectively reduce the power loss of power transmission line, improve transmission efficiency;Tb, Ce, Er and other rare earth elements interact with Fe, Zn and other elements, improve the crystal structure of alloy, strengthen the grain boundary binding force, so that aluminum alloy wire has excellent tensile strength, elongation and fatigue life, can better adapt to complex power transmission environment, improve the reliability and stability of power transmission line.

This invention relates to the field of aluminum alloy production technology, specifically disclosing a method for producing high-purity, high-conductivity aluminum strip with high efficiency and low carbon emissions. The method utilizes continuous casting and rolling to produce 1085 alloy high-purity aluminum strip. While ensuring efficient, low-carbon, and low-cost production through a short process, the cold rolling process employs a three-stage fully recrystallized annealing process: intermediate annealing + cold rolling + intermediate annealing + cold rolling + finished product annealing. This produces 0-state aluminum strip with a soft texture, eliminating the formation of large grains. Through three recrystallization processes, work hardening is eliminated, solid solution impurities precipitate, the number and severity of lattice distortion are reduced, dislocation defect density is low, and free electron scattering is significantly weakened, resulting in improved conductivity. The tensile strength is only about 53 MPa, making it extremely easy to process and use. The finished product conductivity is ≥37.5 mS / m, an improvement of about 3% compared to traditional processes, making it suitable for high-conductivity applications such as power equipment.

The application relates to the technical field of silver-coated copper powder, in particular to silver-coated copper powder suitable for high-frequency electronic components and a preparation method thereof. The silver-coated copper powder comprises the following steps: copper powder treatment, chemical silver plating, cleaning and drying, surface finishing, silver layer deposition and passivation and material taking, the application utilizes the skin effect, and a surface silver layer formed through PVD is extremely dense and smooth, thus providing a nearly perfect transmission channel for high-frequency current, and the resistivity of the silver layer is close to that of a bulk silver single crystal. The reduction of surface roughness also reduces electron scattering; in a target high-frequency band, the conductive loss of the silver-coated copper powder is far higher than that of a pure chemical plating product and reaches the level of pure silver powder.